Chinese semiconductor thread II

tokenanalyst

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GaN Future's Gen3 Platform Launched.​


Zhuhai Gallium Future Technology Co., Ltd. has launched its Gen3 technology platform, featuring 650/700V series GaN field-effect transistors (FETs), marking a major advancement in power semiconductor performance.

Highlights:​
  • Innovative gate design delivers the strongest gate robustness among wide-bandgap devices, with simple gate driving compatible with traditional Si MOSFETs—enabling seamless integration into existing production lines.​
  • Achieves 25% lower reverse voltage drop than industry standards, improving system efficiency by 0.3–0.5 percentage points in high-frequency applications (e.g., EV inverters and DC/DC converters).​
  • Improved device performance: 33% reduction in die package width (DPW) and 15% optimization of FOM, enabling smaller footprint with enhanced power handling.​
  • Under high-load conditions (~7.7kW), temperature rise drops by 8.6°C (a 66% reduction) for the same Rds(on), boosting thermal stability and longevity.​
  • Offers nearly 20 package options, including TO-247, DFN, PQFN, TOLL, and QDPAK, supporting diverse applications from consumer electronics to industrial systems.​
GaN FETs are now embedded in mass-produced fast-charging adapters from leading global brands including Lenovo, DJI, Xiaomi, LG, HP, and Delta. These partnerships have enabled thinner, faster, and more efficient chargers delivering power delivery speeds up to 100W or higher while reducing heat generation and charging time for consumers.

GaN Future achieved a landmark milestone with the world’s first 3.6kW bidirectional energy storage inverter, enabling seamless energy flow between solar panels, batteries, and the grid. This technology is critical for smart homes and microgrids. Additionally, its 3kW communication power supply delivers up to 98% efficiency a significant improvement over conventional designs and supports stable operation under fluctuating loads, making it ideal for data centers and telecom infrastructure.

The company’s G3E65R009 series, the world's smallest 650V GaN discrete device with a record 1500A pulse current rating, represents a breakthrough in power density. This high-current capability enables more compact, efficient power conversion systems in electric vehicles (EVs), supporting higher output inverters and improved battery management. The device is currently undergoing R&D verification with several leading automotive OEMs and Tier 1 suppliers positioning GaN Future as a key enabler of next-generation EV drivetrains and on-board power electronics.

Expanding into High-Performance & Smart Systems: Beyond consumer and transportation, the Gen3 platform is being deployed in:

LED lighting (energy-efficient, high-lumen output with reduced driver losses),
High-performance computing (to manage power demands of AI accelerators and data centers),
Home appliances (e.g., smart fridges, air conditioners) for improved energy efficiency,
Motors & industrial drives, enabling faster response times and lower power consumption.​

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tokenanalyst

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Jiangling Technology's AiMET AI Measurement System Empowers Semiconductor Measurement Performance​


Shanghai Jiangling Technology Co., Ltd. has successfully delivered a repurchased TFT70 SuperHiK high-end thin-film metrology system to a leading wafer fab in Shanghai marking a significant milestone as this is a repeat purchase, highlighting strong client confidence and sustained partnership.

TFT70 SuperHiK:
The flagship model in Jiangling’s TFT series, engineered with industry-leading SuperHiK® technology to deliver ultra-precise measurements for the most challenging thin-film layers in advanced semiconductor manufacturing:​
  • Gate ultra-high-k material (nano-thin single-layer films)
  • Metal interconnect layers (stacked nano-ultra-thin multilayer structures)
  • Ultra-thin dielectric layers
  • It has solved key international technical challenges and is already deployed in batches across logic and memory chip production lines, establishing a new supply security foundation for the front-end semiconductor industry.​
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AiMET AI-Enhanced Metrology System (AI-powered):
A breakthrough integration of artificial intelligence into metrology, representing Jiangling’s deep application of AI in semiconductor process control. The AiMET system enhances every stage of data processing:​
  • Architecture: Uses a physically-supervised adaptive scaled neural network with high-reliability parallel computing for real-time, robust performance.​
  • AI Capabilities:
    • Data preprocessing, dimensionality reduction, classification, and prediction via machine learning.​
    • 20x faster analysis speed per wafer due to optimized AI inference algorithms.​
    • One-click recipe generation: Automatically designs customized measurement protocols for complex multi-layer films, boosting engineering efficiency and accuracy.​
    • Intelligent multi-layer model construction: Dynamically builds accurate models for diverse and intricate film stacks without manual intervention.​
    • Enhanced accuracy: AI-driven evolutionary algorithms significantly improve precision in measuring thin, complex films.​
    • Unified standards: Ensures consistent material coefficients and model building across different processes and sites, eliminating operational variability.​
The deployment of the AiMET system demonstrates Jiangling Technology's leadership in advancing intelligent metrology solutions. By combining cutting-edge hardware (TFT70 SuperHiK) with advanced AI software, the system delivers superior performance for high-end logic and memory chip manufacturing, directly supporting process control and yield optimization.

This success not only solidifies Jiangling’s position as a trusted supplier in the global semiconductor front-end ecosystem but also sets a new benchmark for intelligent, high-precision metrology systems.

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