Hendrik_2000
Lieutenant General
(cont)
Plus, the trade issues have rattled China. “China is kind of backing off that 2025 goal. Part of that might be due to the trade issues. This ‘Made in China’ campaign and these aggressive targets really put foreign governments on alert with China,” IC Insights’ McClean said.
Still to be seen, however, is whether China will continue to pursue its aggressive goals. Amid the geopolitical issues, demand for chips is slowing in China. This is impacting a growing number of vendors, such as Apple, Intel, Texas Instruments and TSMC.
Citing a slowdown in memory and other factors, chip sales in China are expected to grow by only 3% in 2019, compared to 21% growth in 2018, according to IC Insights. In total, the worldwide chip market will grow by 2% this year, the firm noted.
There are other ominous signs. Pure-play foundry sales in China reached $10.69 billion in 2018, up 41% over 2017, according to IC Insights. In 2019, though, foundry sales in China are expected to slow to about 10%. “Some of the Chinese fabless companies are doing well. HiSilicon is one example. They are basically the main supplier for Huawei. And Huawei is doing well in the smartphone business,” McClean said. “In the foundry space, however, the growth in China is a little misleading. Especially in the first half of 2018, a lot of that growth was driven by cryptocurrency designs. Bitcoin took a tremendous hit last year. That’s taken away a lot of the steam in the China market.”
Still, China continues to build up foundry capacity. “Out of the 30 fabs and lines starting construction in 2018 and beyond, 13 are for foundry,” said Christian Dieseldorff, an analyst at SEMI. “As of the end of 2018, our data showed an installed foundry capacity of 1.3 million wpm in 200mm equivalents in China. Worldwide is about 7 million wpm. This includes IDM foundry capacity.”
The figures include both 200mm and 300mm fabs. In total, there are six 200mm facilities in the works in China, according to Dieseldorff.
From the equipment perspective, meanwhile, it’s a mixed picture. Last year, SEMI reduced its projections for fab equipment spending in China for 2019, from $17 billion to roughly $12 billion. So, in 2019, fab equipment spending in China is expected to reach $11.96 billion, down 2% over 2018, according to SEMI.
“We revised our forecast for 2019 and we still expect pretty healthy growth for China in 2020. We scaled down some of the capacity ramp-up plans in the next two years. But still, there are a lot of memory projects in China, such as Samsung, SK Hynix and even Intel. The investment in China is still strong,” SEMI’s Tseng said. “SK Hynix will invest more this year in China compared to Samsung. This is because they have a new fab in Wuxi.
“The reason why we scaled down the forecast is the China part. We don’t think they will ramp up as fast as they announced. There is a potential that the DRAM project in Fujian will essentially stop. The Hefei project has been very low profile. Overall, the progress is slower than what they announced. It’s also slower than what we expected,” Tseng said. The SEMI analyst is referring to DRAM hopeful JHICC, which is based in Fujian. Innotron, another China DRAM vendor, is located in Hefei.
Others see similar patterns. “The domestic semiconductor companies have been spending quite a bit. And the business was up at all major equipment suppliers in 2018,” said Risto Puhakka, president of VLSI Research. “Now, the indications are that it’s going to slow down like the rest of the industry. In China, you have two different groups. One, you have the domestic Chinese companies. Then, you have the multinationals. The multinationals, in a very large way, won’t be increasing their capital spending. Then, you have the domestic companies. Their projects are not finished by any measure. They will spend some, but it looks like they obtained a fair amount of equipment last year, roughly $5 billion. They have plenty of tools for now.”
Most see flat equipment growth for 2019. “I don’t expect the overall wafer fab equipment market from China to change significantly between ’18 and ’19,” said Oreste Donzella, senior vice president and chief marketing officer at KLA. “The mix is different. We see more foundry and less memory. We see more foreign investment and less local.”
Regarding the IC market as a whole, Donzella said: “For memory, what we are seeing right now is a definite slowdown. I see a CapEx decrease in ’19 for DRAM after an incredible year. In NAND, it will be modestly down in ’19. We believe foundry will go up. The question is how much will foundry go up.”
Multinational foundry landscape
There are several multinational foundry vendors in China. Last year, TSMC had a big year, thanks to a boom cycle in cryptocurrency. TSMC makes chips for the cryptocurrency systems firms in China and elsewhere.
Now, the company is suffering from the bust in Bitcoin. In its fourth-quarter results, TSMC posted mixed results with a weak outlook due to a slowdown in smartphones and cryptocurrency.
It’s unclear if this will impact TSMC’s fab plans in China. For years, the company has operated a 200mm fab in Shanghai.
Last year, TSMC began ramping up 16nm finFETs in a new fab in Nanjing. The 300mm fab is producing 10,000 wpm with plans to move to 20,000 wpm by year’s end.
Fig. 2: Major IC manufacturers in China Source: IC Insights
FinFETs represent a big leap for China. For years, chip production within China has been limited to traditional planar transistors at 28nm and above. FinFETs are used at 16nm/14nm and beyond. In finFETs, the control of the current is accomplished by implementing a gate on each of the three sides of a fin.
TSMC’s Nanjing fab is in the first phase with three other phases in the works. Originally, the company planned to move 7nm into a proposed second fab in Nanjing at some point, according to sources. Now, TSMC is rethinking its plans, targeting 16nm or 12nm for the second phase, sources added.
Not all processes are at the leading edge. For example, UMC has been producing chips in a 200mm fab in Suzhou for several years. UMC plans to expand this fab amid a worldwide shortage of 200mm capacity.
“That’s still on schedule,” said Jason Wang, co-CEO of UMC, in a recent conference call. “And we still have confidence in terms of our 8-inch outlook.”
Meanwhile, in 2017, UMC moved into production in a 300mm fab venture in Xiamen. The fab is ramping up 40nm and 28nm.
Demand for 40nm is steady, but 28nm is engulfed in an oversupply mode for all foundry vendors. “28nm will remain flat. 28nm may experience (an) overcapacity situation for the next years,” Wang said.
Meanwhile, GlobalFoundries is building a 300mm fab in Chengdu. Previously, the goal was to develop 180nm/130nm processes in the fab. Last year, though, the company changed its plans, targeting the fab for its 22nm FD-SOI technology, dubbed FDX. It has not provided a timeline for the completion of the fab.
GlobalFoundries also is ramping up 22nm FD-SOI in a German fab. Nonetheless, the company sees growing interest for FD-SOI in China. “FDX technology is particularly well-suited to the China market, and we continue to see strong potential for its up-take in segments, such as 5G, IoT and edge computing,” said Tom Caulfield, chief executive of GlobalFoundries.
In addition, contract manufacturing giant Foxconn is in talks to build a 300mm fab in Zhuhai, according to reports. The fab, a joint venture between Foxconn and Sharp, would be used for both captive and foundry purposes. Foxconn has yet to make an official announcement.
Plus, the trade issues have rattled China. “China is kind of backing off that 2025 goal. Part of that might be due to the trade issues. This ‘Made in China’ campaign and these aggressive targets really put foreign governments on alert with China,” IC Insights’ McClean said.
Still to be seen, however, is whether China will continue to pursue its aggressive goals. Amid the geopolitical issues, demand for chips is slowing in China. This is impacting a growing number of vendors, such as Apple, Intel, Texas Instruments and TSMC.
Citing a slowdown in memory and other factors, chip sales in China are expected to grow by only 3% in 2019, compared to 21% growth in 2018, according to IC Insights. In total, the worldwide chip market will grow by 2% this year, the firm noted.
There are other ominous signs. Pure-play foundry sales in China reached $10.69 billion in 2018, up 41% over 2017, according to IC Insights. In 2019, though, foundry sales in China are expected to slow to about 10%. “Some of the Chinese fabless companies are doing well. HiSilicon is one example. They are basically the main supplier for Huawei. And Huawei is doing well in the smartphone business,” McClean said. “In the foundry space, however, the growth in China is a little misleading. Especially in the first half of 2018, a lot of that growth was driven by cryptocurrency designs. Bitcoin took a tremendous hit last year. That’s taken away a lot of the steam in the China market.”
Still, China continues to build up foundry capacity. “Out of the 30 fabs and lines starting construction in 2018 and beyond, 13 are for foundry,” said Christian Dieseldorff, an analyst at SEMI. “As of the end of 2018, our data showed an installed foundry capacity of 1.3 million wpm in 200mm equivalents in China. Worldwide is about 7 million wpm. This includes IDM foundry capacity.”
The figures include both 200mm and 300mm fabs. In total, there are six 200mm facilities in the works in China, according to Dieseldorff.
From the equipment perspective, meanwhile, it’s a mixed picture. Last year, SEMI reduced its projections for fab equipment spending in China for 2019, from $17 billion to roughly $12 billion. So, in 2019, fab equipment spending in China is expected to reach $11.96 billion, down 2% over 2018, according to SEMI.
“We revised our forecast for 2019 and we still expect pretty healthy growth for China in 2020. We scaled down some of the capacity ramp-up plans in the next two years. But still, there are a lot of memory projects in China, such as Samsung, SK Hynix and even Intel. The investment in China is still strong,” SEMI’s Tseng said. “SK Hynix will invest more this year in China compared to Samsung. This is because they have a new fab in Wuxi.
“The reason why we scaled down the forecast is the China part. We don’t think they will ramp up as fast as they announced. There is a potential that the DRAM project in Fujian will essentially stop. The Hefei project has been very low profile. Overall, the progress is slower than what they announced. It’s also slower than what we expected,” Tseng said. The SEMI analyst is referring to DRAM hopeful JHICC, which is based in Fujian. Innotron, another China DRAM vendor, is located in Hefei.
Others see similar patterns. “The domestic semiconductor companies have been spending quite a bit. And the business was up at all major equipment suppliers in 2018,” said Risto Puhakka, president of VLSI Research. “Now, the indications are that it’s going to slow down like the rest of the industry. In China, you have two different groups. One, you have the domestic Chinese companies. Then, you have the multinationals. The multinationals, in a very large way, won’t be increasing their capital spending. Then, you have the domestic companies. Their projects are not finished by any measure. They will spend some, but it looks like they obtained a fair amount of equipment last year, roughly $5 billion. They have plenty of tools for now.”
Most see flat equipment growth for 2019. “I don’t expect the overall wafer fab equipment market from China to change significantly between ’18 and ’19,” said Oreste Donzella, senior vice president and chief marketing officer at KLA. “The mix is different. We see more foundry and less memory. We see more foreign investment and less local.”
Regarding the IC market as a whole, Donzella said: “For memory, what we are seeing right now is a definite slowdown. I see a CapEx decrease in ’19 for DRAM after an incredible year. In NAND, it will be modestly down in ’19. We believe foundry will go up. The question is how much will foundry go up.”
Multinational foundry landscape
There are several multinational foundry vendors in China. Last year, TSMC had a big year, thanks to a boom cycle in cryptocurrency. TSMC makes chips for the cryptocurrency systems firms in China and elsewhere.
Now, the company is suffering from the bust in Bitcoin. In its fourth-quarter results, TSMC posted mixed results with a weak outlook due to a slowdown in smartphones and cryptocurrency.
It’s unclear if this will impact TSMC’s fab plans in China. For years, the company has operated a 200mm fab in Shanghai.
Last year, TSMC began ramping up 16nm finFETs in a new fab in Nanjing. The 300mm fab is producing 10,000 wpm with plans to move to 20,000 wpm by year’s end.
Fig. 2: Major IC manufacturers in China Source: IC Insights
FinFETs represent a big leap for China. For years, chip production within China has been limited to traditional planar transistors at 28nm and above. FinFETs are used at 16nm/14nm and beyond. In finFETs, the control of the current is accomplished by implementing a gate on each of the three sides of a fin.
TSMC’s Nanjing fab is in the first phase with three other phases in the works. Originally, the company planned to move 7nm into a proposed second fab in Nanjing at some point, according to sources. Now, TSMC is rethinking its plans, targeting 16nm or 12nm for the second phase, sources added.
Not all processes are at the leading edge. For example, UMC has been producing chips in a 200mm fab in Suzhou for several years. UMC plans to expand this fab amid a worldwide shortage of 200mm capacity.
“That’s still on schedule,” said Jason Wang, co-CEO of UMC, in a recent conference call. “And we still have confidence in terms of our 8-inch outlook.”
Meanwhile, in 2017, UMC moved into production in a 300mm fab venture in Xiamen. The fab is ramping up 40nm and 28nm.
Demand for 40nm is steady, but 28nm is engulfed in an oversupply mode for all foundry vendors. “28nm will remain flat. 28nm may experience (an) overcapacity situation for the next years,” Wang said.
Meanwhile, GlobalFoundries is building a 300mm fab in Chengdu. Previously, the goal was to develop 180nm/130nm processes in the fab. Last year, though, the company changed its plans, targeting the fab for its 22nm FD-SOI technology, dubbed FDX. It has not provided a timeline for the completion of the fab.
GlobalFoundries also is ramping up 22nm FD-SOI in a German fab. Nonetheless, the company sees growing interest for FD-SOI in China. “FDX technology is particularly well-suited to the China market, and we continue to see strong potential for its up-take in segments, such as 5G, IoT and edge computing,” said Tom Caulfield, chief executive of GlobalFoundries.
In addition, contract manufacturing giant Foxconn is in talks to build a 300mm fab in Zhuhai, according to reports. The fab, a joint venture between Foxconn and Sharp, would be used for both captive and foundry purposes. Foxconn has yet to make an official announcement.