China’s Foundry Biz Takes Big Leap Forward
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
JANUARY 28TH, 2019 - BY: MARK LAPEDUS
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China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market.
China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, according to SEMI. The remaining facilities are geared toward LEDs, memory and other technologies.
As before, China’s foundry industry is split into two categories—multinational and domestic vendors. Until recently, both groups used older technology. But Taiwan-based TSMC recently moved into 16nm finFET production in China, while SMIC this year hopes to become the first domestic foundry vendor to enter the 14nm finFET race. SMIC’s move would put it on par with some of its foreign rivals. In addition, SMIC has obtained $10 billion in funding to develop 10nm and 7nm.
Still, it’s doubtful that China will build all 30 fabs. It’s also unclear whether it can develop 10nm or 7nm. And for the foreseeable future, the majority of China’s foundry production remains at 28nm and above.
But armed with billions of dollars, the China government is determined to develop the nation’s IC industry to combat a trade gap. China has a sizeable domestic IC industry, but the nation imports the vast majority of its chips from foreign suppliers. In response, the China government for some time has been investing in its domestic IC industry. It also has lured several multinational chipmakers to build memory and foundry fabs in China.
Those efforts are paying off, but the current IC slowdown, coupled with U.S.-China trade tensions, is causing some headwinds for both memory and foundry vendors in China. Some chipmakers are decelerating their fab expansion plans there, while others are delaying their projects.
Still, some foundry vendors are expanding in China. While some are trying to move to the high end, most are stuck at more mature nodes, where the competition is fierce within China and elsewhere. This is especially true at one popular node. “They are all backed up, especially at 28nm,” said Bill McClean, president of IC Insights. “The foundries talk about the overcapacity situation at 28nm lasting a couple of years. They are not talking about a couple of quarters. They are talking years.”
All told, China remains a vibrant foundry market. The domestic foundry vendors continue to gain steam, although they won’t dominate the landscape anytime soon. In total, China-based companies’ share in the foundry market is expected to reach only 9.2% in 2018, up from 9.1% in 2017, according to IC Insights.
Nevertheless, there are a number of major foundry events in China. Here’s the latest:
TSMC will expand its 16nm finFET production in a new China fab with possible plans to build another plant.
UMC plans to expand its 200mm capacity in China, and continues to produce 40nm and 28nm in a 300mm fab.
GlobalFoundries and TowerJazz are building fabs in China. The latest possible entry is Taiwan’s Foxconn, which plans to build a fab for captive and foundry purposes, according to reports.
On the domestic front, SMIC and Shanghai Huali are eyeing 14nm. Plus, several domestic vendors are expanding their 200mm and 300mm capacities.
Made in China and trade wars
Over the years, China has unveiled various initiatives to advance its domestic IC industry. With help from foreign concerns, China launched several joint chip ventures in the 1980s and 1990s, followed by the emergence of Semiconductor Manufacturing International Corp. (SMIC), China’s largest foundry player, in 2000.
Around that time, OEMs began to move a large percentage of their production to China. Demand for ICs grew, and China eventually became the world’s largest market for chips.
However, China’s IC industry could only satisfy some demand, and the nation was forced to import most ICs from foreign suppliers. By 2015, China amassed a $150 billion trade deficit in ICs alone, according to Gartner.
In 2013, China consumed $82 billion, or 30%, of the world’s chips, according to IC Insights. But IC production in China was $10.3 billion in 2013, which represented only 12.6% of the world’s chip production, according to the firm.
At the time, China also found itself behind in IC technology. For one thing, it was late in modernizing its IC industry. In addition, the United States and other nations imposed strict export control regulations for China, which prevented equipment vendors from shipping the latest gear into China. Recently, many export controls have been relaxed in China.
In response, the Chinese government unveiled a new plan in 2014, dubbed the “National Guideline for Development of the IC Industry.” The plan was designed to accelerate China’s efforts in 14nm finFETs, memory and advanced packaging. To help its cause, China poured billions of dollars into the arena.
The overall goal of these and other programs in China is to reduce its dependency on foreign suppliers. “That’s the issue with China. These projects are not driven by market demand. It’s driven by policy. They want to build capacity to be independent from overseas vendors,” said Clark Tseng, director of industry research and statistics at SEMI.
Then, in 2015, China launched another initiative, dubbed “Made in China 2025.” The goal is to increase the domestic content of components in 10 key areas—IT, robotics, aerospace, shipping, railways, electric vehicles, power equipment, materials, medicine, and machinery.
As part of those efforts, China hopes to become more self-sufficient in ICs. It wants to increase its domestic IC production from less than 20% in 2015 to 70% by 2025, according to IC Insights.
To accomplish those goals, China would not only develop its own technology, but it also wants to acquire foreign companies to gain access to technology.
It acquistion strategy hasn’t worked out as planned, at least for now. While China has purchased several small foreign IC vendors, its strategy was derailed in 2015 when it tried to acquire U.S.-based Micron Technology. The deal, which would have given China a vast portfolio of memory technology, was scrapped due to U.S national security concerns.
Since then China has made some progress in ICs, but it has fallen short of its goals. It still imports most of its ICs. In 2018, China produced 15.3% of the world’s chips, up from 12.6% in 2013, according to IC Insights.
Fig. 1: China’s IC market vs. production trends. Source: IC Insights
That’s the least of China’s problems. Last year, the Trump administration started a trade war with China for a couple of reasons. First, China has a massive trade surplus with the U.S. And second, U.S. companies have been the subject of IP theft in China, which has largely gone unchecked, according to the Trump administration.
In response, the U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. Then, in a separate measure, the U.S. last year restricted exports of fab equipment to Jinhua Integrated Circuit Co. (JHICC), a Chinese DRAM hopeful. JHICC faces some legal and IP issues.
All told, SEMI estimates that these tariffs will cost semiconductor companies more than $700 million annually. “Trade disputes can quickly spin out of control,” pointed out Joanne Itow, managing director of manufacturing at Semico Research. “Partnerships, purchasing and inventory levels are all impacted by increased levels of uncertainty, and we already are seeing companies develop contingency planning scenarios.”