Most information are from Articles, Interviews and Research Reports in Chinese from Websites and Forums.You have any source ? Or anything you say are fake ?
The 7nm Semiconductor Equipment will probably be ready in 2022.Hi WTAN,
The Huawei Official was probably being very conservative when he said that.
Thanks for the info, I'm surprise cause what I know from your previous post and also from A-SET is that Huawei is part of the 02 special project that develop the 7nm EDA tool. The main purpose of that project is develop equipment for the eventual production of 7nm chips within 2022-2023 timeframe. I had no illusion knowing the huge hurdle Huawei alone had to endure. The important thing is they had a road map. Aside from SMIC ,Huahong and now Huawei, are there any new Chinese entrant in FAB business?
Hi siegecrossbow,A friendly reminder that not all tech is semi-conductor, stealth fighter, 5G, or quantum computing.
The Huawei Official was probably being very conservative when he said that.
But it showed that Huawei has already started its FAB business and they have a roadmap for Chip production.
I think he really meant that Huawei will be making 5/7nm Chips by then. The 28nm Lithograph will be out next year and they will have the opportunity to start seeing what they can do with it.
Alot of the major Semiconductor Equipment makers like Naura, Amec and Huahuai Zero have already finished developing their 14nm equipment and have started R&D in 5/7nm equipment.
The Equipment development was slow previously as they didnt expect the US to cut off supply. It should be relatively quick from now on.
Its very likely that Huawei would team up with SMIC on the 7nm Chips. Maybe a joint venture or license production of SMIC N+1/2 Process.
It is very likely that SMIC will be sanctioned in the future, so SMIC really has nothing to lose.
It will gain a big customer in Huawei.
Most information are from Articles, Interviews and Research Reports in Chinese from Websites and Forums.
This information is certainly more reliable than the "Fake News" that is reported in American, Japanese and Taiwanese Internet Articles.
But at the end of the day it is up to the Reader to believe it.
The 7nm Semiconductor Equipment will probably be ready in 2022.
There was a recent article stating that one of the goals of the 2021-2025, 5 year plan was to promote the production of 5/7nm Chips. I will try to locate the article.
SMIC is the largest FAB at the moment. Huahong is the 2nd largest and Government owned. The rest are small and produce 40 - 90nm Chips. No new entrants as far as i know as setting up FABs can be quite costly.
Speaking of other tech, both BOE and JOLED (Consortium of Japanese companies and TCL) are working on printing methods for OLED displays. Apparently they should be going into pilot production in the next few months.A friendly reminder that not all tech is semi-conductor, stealth fighter, 5G, or quantum computing.
Huawei's production of 5/7nm Chips by 2023 seems about right. (Within 3 years)Right, so equipment ready in 2022, another year and a half for development and installation, pilot production in Q2 2023, then volume production in Q2 2024.
I don't know where the 3 year estimate the Huawei exec got from.
hi WTAN,Huawei's production of 5/7nm Chips by 2023 seems about right. (Within 3 years)
I wouldn't underestimate the speed at which Huawei can move in Chip production, as in everything else that Huawei does.
There is also a new Big Push by the Government to throw alot of resources into Chip manufacturing equipment development. Equipment will certainly be developed much faster than before. The timeline i have given is just an estimate. It could be much faster.
Huawei is currently building a 45nm FAB in Dongguan. It will build a new 28nm FAB next year possibly in cooperation with another party.AMEC is actually supplying the etching equipment for TSMC's 5nm node, and most of the other suppliers are also competitive. The bottleneck right now is litho machines from SMEE.
Huawei is already SMIC's biggest customer. The issue is that N+1 and N+2 are both developed on and for US lithographic machines (LAM research iirc). As such, it is still party to US sanctions. Of course SMEE may come up with a 7nm machine by then, but I have doubts that SMIC could establish volume production of a 7nm node with fully domestic equipment within the next 3 years.
I'd still like links, please. Everything I've seen points to Huawei establishing a 45nm fab, and nothing about 10nm.
Huawei's production of 5/7nm Chips by 2023 seems about right. (Within 3 years)
I wouldn't underestimate the speed at which Huawei can move in Chip production, as in everything else that Huawei does.
There is also a new Big Push by the Government to throw alot of resources into Chip manufacturing equipment development. Equipment will certainly be developed much faster than before. The timeline i have given is just an estimate. It could be much faster.