News on China's scientific and technological development.

The west try to bypass Huawei infrastructure lead by building socalled cloud phone but Huawei is also very active the area Here it is via JSch


2020-09-02 7:16:00 GMT+8 | cnTechPost



On September 1, Huawei Cloud announced the start of public beta testing of the world's first "cloud phone" based on ARM chips.

Huawei debuted the Kunpeng phone in March this year, a cloud-based virtual phone based on the Huawei Kunpeng processor and Android.

It is based on Huawei Cloud Kunpeng Bare Metal Server, a virtual cloud server with a native Android operating system and virtual phone functionality.

As a new type of application, cloud phone plays an extension and expansion role to the physical phone, and can be used in scenarios such as application smart hosting, cloud hand games, crowd broadcasting and mutual entertainment, and mobile office.

According to Huawei, Kunpeng cloud phone adopts self-developed Kunpeng chip and end cloud isomorphism, which can improve the performance of virtual phone by 80 percent compared to traditional simulator solution.

It has massive elastic public cloud server resources, cloud phone can be seamlessly connected with public cloud services.It also has professional-grade GPU hardware acceleration, which makes it possible to run large games with ease.Users can also adjust the cloud phone specifications.

Huawei offers the option to get a free cloud phone worth RMB 5,950, but the Huawei Cloud Kunpeng phone is mainly targeting paid users and comes in two recommended configurations.

rx1.cp.c60.d10.e1v1: For a monthly server cost of RMB 5,950, you get 60 cloud phone instances.That means each phone costs as low as RMB 99/month, they have a resolution of 1280x720, have a 2-core CPU, 3.5GB of RAM and 10GB of storage.

kg1.cp.c100.d10SSD.e1v1: For a monthly server fee of 10,700 RMB, you can get 100 cloud phone instances for as low as 107 RMB per month, with a 1280x720 resolution, 2-core CPU, 4.2GB of RAM and 10GB of storage.

WTAN said:

Huawei will be able to make its own 5/7nm Chips using the SMEE 28nm DUV, as soon as a Localised 7nm Manufacturing Line is developed. The Government should prioritise the development of this localised 7nm Production line as soon as possible.

Click to expand...

If they could do all of that 28nm, 14nm, 7nm, within 3 years that would be amazing already!

But ... according to various internet sources, 28nm, 14nm are imminent for production. Once they embark on that learning curve, then 7nm is next. Heck, maybe they even do it concurrently, this is China, and that is China speed.

The problem is for the rest of the world. Once 14nm production has matured in China, who in their right mind, why a Chinese company would buy from the Americans again these chips? They should buy a little, just for comparison, but realistically the American IC will only lost market share in China the next few years.

Taking a wild guess, but I would think at least 80% of the world IC market is not at 7nm.

Okay, I am just starting to rant again on how stupid the American policy was brought to their IC industry courtesy of dummies like President Trump, and sycophants Navarro and Pomepo.

WTAN said:

The Government will certainly get SMIC or Huahong to lend its expertise to Huawei as they are no longer able to do business with Huawei in any case. National Service for SMIC/Huahong. This is probably a one off thing to get Huawei established in the Semiconductor business.

Building the 45nm FAB is probably to get experience in manufacturing semiconductors for Huawei. A learning process. Huawei probably got a 65nm DUV machine from SMEE. Huawei will probably sell these Chips to Industries and manufacturers which still require 45nm Chips.

The FPGA will use the 28nm process. American company Xilinx built its 28nm FPGAs for many years sucessfully.

Click to expand...

does china actually has FPGA on par of Xilinx, i dont think they have, also do they have eda tool for it? cause these chip are not that simple to design/manufacture, it has the same process/step as ASIC.

from JSCh (pakistan defense forum)

Huawei to continue investment in chip arm Hisilicon despite US ban: Rotating CEO
Source: Global Times Published: 2020/9/3 11:03:04


A visitor experiences Huawei's 5G Mate30 Pro at a press conference in Shenzhen, south China's Guangdong Province, Oct. 23, 2019. (Xinhua/Mao Siqian)

Chinese tech company Huawei will keep investing in its chip arm Hisilicon and help partners in chip manufacturing, production equipment and raw materials - areas in which the Chinese tech firm is restricted by the US - to build and improve their ability, said Huawei's rotating CEO Guo Ping.

The comment was made during Guo's recent meeting with Huawei's new employees. The meeting's memo was published on Huawei's online community Xinsheng Shequ Wednesday and titled "Don't waste the opportunity of a crisis," amid US' relentless crackdown on the Chinese tech firm and as a chip ban, which is set to take effect in mid-September, draws near.

The tougher US "sanction" on Huawei in May has created certain difficulties for the Chinese tech behemoth, but such difficulty is not an insurmountable one - it's just an issue involving technology, cost and time, according to Guo.

Guo admitted that the US-led crackdown on Kirin chipset will pose "certain difficulties" for the company's high-end smartphone business, but noted that he has confidence the issue "could be addressed."

"Hisilicon will grow stronger several years later," Guo said. He also noted that Washington must have "made up its mind" to destroy Beijing's 5G rollout as China has been leading the industry development, which could threaten the US desire to lead the world.

US-based memory chip manufacturer Micron recently said that the firm will not be able to continue to supply Huawei after September 14, the date when the shipment ban formally comes into effect. This marks the second global firm that fired shots at Huawei, after Taiwan-based chip manufacture TSMC confirmed that it does not plan to ship any wafers to Huawei after September 14.

It is not clear whether more chip makers will announce supply cut to Huawei as deadline approaches.

Amid the US moves that could cut Huawei from accessing to Google's Android updates and security patches, Huawei launched its self-developed HarmonyOS last year.

"It's not an easy decision for us, as a smartphone company, to develop our own ecosystem Huawei Mobile Services (HMS). It's very difficult and very challenging. But we delivered a better-than-expected one-year transcript," Guo said.

"If Huawei could help Android in achieving success, is there any reason why our own system cannot be a success?" Guo asked. He compared cultivating HMS as a protracted war that Huawei is destined to win in the end.

Huawei has launched a range of devices ranging from smart TV to vehicles that are equipped with its proprietary HarmonyOS. Some analysts expect that riding on the boom of China's 5G network and the expansion of HMS ecosystem, Huawei could launch the HarmonyOS for smartphone as early as the end of 2020.

"It is plausible to have two systems in a world. And Huawei will be able to survive and take the lead even in an extremely hostile environment," Guo said, while stressing the company's commitment to globalization and cooperation.

ansy1968 said:

"Hisilicon will grow stronger several years later," Guo said. He also noted that Washington must have "made up its mind" to destroy Beijing's 5G rollout as China has been leading the industry development, which could threaten the US desire to lead the world.

Click to expand...

By the end of 2020, China will have installed over 500K (maybe +800K?) 5G base stations.

These are for '21-25, about 1.4 trillion Yuan:
2021 - 1M
2022 - 1M
2023 - 1M
2024 - 1M
2025 - 1M

Division of the pie: Huawei 50%, ZTE 30, Ericsson 10, Datang +5, so Huawei needs toinstall 500K/yr in China!

As we have been discussing Huawei has Solutions

Conclusion: Useless for Trump to block China's 5G projects

machupicu said:

By the end of 2020, China will have installed over 500K (maybe +800K?) 5G base stations.

These are for '21-25, about 1.4 trillion Yuan:
2021 - 1M
2022 - 1M
2023 - 1M
2024 - 1M
2025 - 1M

Division of the pie: Huawei 50%, ZTE 30, Ericsson 10, Datang +5, so Huawei needs toinstall 500K/yr in China!

As we have been discussing Huawei has Solutions

Conclusion: Useless for Trump to block China's 5G projects

Click to expand...

Hi machupicu,

Yup huge number, but can Huawei able to supply all those chip?
like I said before there is no more downside For Huawei, they are definitely working hard and know what is needed. There is nothing more to say but hope for the best, I myself is confident they will succeed. I wish in late 2021 they will able able to produce and sell a high spec smartphone again, my P30 PRO need a replacement by that time, a P50 Pro will be ideal.

ansy1968 said:

Hi WTAN,

Question, will SMIC lent its personnel and expertise to Huawei? will it adverse affect SMIC expansion plan and resources? And how about the 45nm fab Huawei had build for this year? is this fab use in producing FPGA? sorry again for being a nuisance.

Click to expand...

The Government will certainly get SMIC or Huahong to lend its expertise to Huawei as they are no longer able to do business with Huawei in any case. National Service for SMIC. This is probably a one off thing to get Huawei established in the Semiconductor business.

Building the 45nm FAB is probably to get experience in manufacturing semiconductors for Huawei. A learning process. Huawei probably got a 65nm DUV machine from SMEE. Huawei will probably sell these Chips to Industries and manufacturers which still require 45nm Chips.

The FPGA will use the 28nm process. American company Xilinx built its 28nm FPGAs for many years sucessfully.

s002wjh said:

does china actually has FPGA on par of Xilinx, i dont think they have, also do they have eda tool for it? cause these chip are not that simple to design/manufacture, it has the same process/step as ASIC.

Click to expand...

Huawei/Hisilicon really has no problems designing IC's. The main issue is actually manufacturing the IC's which it is starting to get involved in.

Huawei has already developed its own EDA for 7nm Chips being a part of the 02 Special Project for the 28nm Litho Machine.

Huawei already has its own ASIC's which it has been using for a while. Hisilicon is currently developing its own FPGAs, GPUs etc

There are a number of companies in China that have developed FPGAs like GoWin and UNISOC. UNISOC has recently developed a high performance FPGA for Base Stations. This technology is already maturing in China with more advanced designs coming.

I believe Huawei will go with FPGAs in its 5G Base stations as the finished product can be manufactured by Huawei in its own 28nm FAB which will be ready next year. This will be followed by a 14nm FPGA a little later. Designing and Manufacturing its own FPGA will bring the costs of the product down and make it competitive.

Huawei will also be looking to design its own ICs using the RISC-V architecture or some local architecture.

This article talks about the High Performance FPGA recently developed by UNISOC for Base Stations.

WTAN said:

The Government will certainly get SMIC or Huahong to lend its expertise to Huawei as they are no longer able to do business with Huawei in any case. National Service for SMIC. This is probably a one off thing to get Huawei established in the Semiconductor business.

Building the 45nm FAB is probably to get experience in manufacturing semiconductors for Huawei. A learning process. Huawei probably got a 65nm DUV machine from SMEE. Huawei will probably sell these Chips to Industries and manufacturers which still require 45nm Chips.

The FPGA will use the 28nm process. American company Xilinx built its 28nm FPGAs for many years sucessfully.


Huawei/Hisilicon really has no problems designing IC's. The main issue is actually manufacturing the IC's which it is starting to get involved in.

Huawei has already developed its own EDA for 7nm Chips being a part of the 02 Special Project for the 28nm Litho Machine.

Huawei already has its own ASIC's which it has been using for a while. Hisilicon is currently developing its own FPGAs, GPUs etc

There are a number of companies in China that have developed FPGAs like GoWin and UNISOC. UNISOC has recently developed a high performance FPGA for Base Stations. This technology is already maturing in China with more advanced designs coming.

I believe Huawei will go with FPGAs in its 5G Base stations as the finished product can be manufactured by Huawei in its own 28nm FAB which will be ready next year. This will be followed by a 14nm FPGA a little later. Designing and Manufacturing its own FPGA will bring the costs of the product down and make it competitive.

Huawei will also be looking to design its own ICs using the RISC-V architecture or some local architecture.

This article talks about the High Performance FPGA recently developed by UNISOC for Base Stations.

Please, Log in or Register to view URLs content!

Click to expand...

Hi WTAN,

Really glad to hear from you again, from what I read from your post, Huawei will cover all bases regarding IC both in design and also the manufacturing aspect, Its a huge undertaking for a private company, I know govt support is there to provide, From what Im getting is that the CCP had place Huawei as the vanguard of this initiative, they trusted Huawei will accomplished it sooner with its present management and its founder.

WTAN said:

The Government will certainly get SMIC or Huahong to lend its expertise to Huawei as they are no longer able to do business with Huawei in any case. National Service for SMIC. This is probably a one off thing to get Huawei established in the Semiconductor business.

Building the 45nm FAB is probably to get experience in manufacturing semiconductors for Huawei. A learning process. Huawei probably got a 65nm DUV machine from SMEE. Huawei will probably sell these Chips to Industries and manufacturers which still require 45nm Chips.

The FPGA will use the 28nm process. American company Xilinx built its 28nm FPGAs for many years sucessfully.


Huawei/Hisilicon really has no problems designing IC's. The main issue is actually manufacturing the IC's which it is starting to get involved in.

Huawei has already developed its own EDA for 7nm Chips being a part of the 02 Special Project for the 28nm Litho Machine.

Huawei already has its own ASIC's which it has been using for a while. Hisilicon is currently developing its own FPGAs, GPUs etc

There are a number of companies in China that have developed FPGAs like GoWin and UNISOC. UNISOC has recently developed a high performance FPGA for Base Stations. This technology is already maturing in China with more advanced designs coming.

I believe Huawei will go with FPGAs in its 5G Base stations as the finished product can be manufactured by Huawei in its own 28nm FAB which will be ready next year. This will be followed by a 14nm FPGA a little later. Designing and Manufacturing its own FPGA will bring the costs of the product down and make it competitive.

Huawei will also be looking to design its own ICs using the RISC-V architecture or some local architecture.

This article talks about the High Performance FPGA recently developed by UNISOC for Base Stations.

Please, Log in or Register to view URLs content!

Click to expand...

If they are building base stations in large number, ASIC is better than FPGA. Cheaper, uses less power, generates less heat. In fact, I assume Huawei and Ericsson's base stations use ASIC. Huawei's huge numbers, more than 50,000 base stations, that will more than justify ASIC. FPGA is only for applications with small numbers or custom applications.

Nokia's use or gamble of FPGA on base stations cost the company.



Using FPGA is like buying an expensive car whose features you don't end up using. Maybe all you need is a Toyota Corolla, not a Lexus.

Chinese Government has finally decided to invest in the Semiconductor Industry in a big way. It will no longer depend on American technologies.