Nikkei reported that the licence to export EUV machines under the Wassennaar agreement had expired and the US was pressuring ASML to withhold the machines
However, ASML denies that it's under US pressure
That's just replacing one set of problems with another. How soon can China manufacture these components itself?
Oh no, there's no shortcut here.
It has to start from ground and up like it's carrier program started from an outdated Liaoning carrier.
Fortunately good ole optical lithography can extended to 10nm, or even 7nm although not as cost effective.
There are alot of challenge for EUV high volume manufacturing. TSMC and Samsung do not have high volume products made with EUV yet. It would be great they both got stuck at present predicament, LOL
Both Samsung and TSMC made alot BS announcement with regard to EUV 5nm, 3nm roadmap, I don't think so, it won't be that smooth.
The mask for EUV is 10x times harder and expensive than optical lithography mask with only with chrome on glass whereas EUV mask has 10 layers of alternative Si and Mo and absorber in between and not a single contaminant particle allowed
Even at 5nm and 3nm the chip will made with both optical and EUV lithography equipments. Optical litho will made majority of layers and EUV for critical layers like for vias
Last edited: