Chinese semiconductor thread II

[tokenanalyst]

10mJ/cm2 will be a golden spot for mass EUV patterning vs the current 30 mJ/cm2

Synergistic Tripartite Molecular Design of Halogen-Engineered Organotin Clusters Enabling 10 mJ cm−2 EUV Lithography​

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ABSTRACT​

Organotin clusters are promising candidates for extreme ultraviolet (EUV) lithography but often suffer from insufficient sensitivity. To address this challenge, we report the first systematic library of halogen-engineered isostructural dinuclear organotin clusters (Sn2-4X, X = F, Cl, Br, I), designed to enhance EUV absorption via halogen incorporation. Our strategy features a synergistic tripartite molecular design integrating: (1) radiation-labile Sn─C bonds for efficient ionization and cleavage; (2) halogenated aromatic ligands to boost absorption cross-sections and etch resistance; and (3) triethanolamine (TEA) ligands to facilitate intermolecular cross-linking via hydrogen atom transfer (HAT). This rational engineering significantly amplifies lithographic performance. Notably, Sn2-4F achieves a record sensitivity of 10 mJ cm−2 alongside ultrahigh resolution (10 nm), establishing a new benchmark for metal–organic clusters (MOCs). Mechanistically, we reveal a fundamental dichotomy where inner-shell ionization of heavy atoms governs EUV sensitivity, whereas “kinetic overkill” dominates electron beam lithography (EBL). Furthermore, a halogen-dependent dissociative electron attachment (DEA) pathway is elucidated, which reinforces the lithographic network through Sn─X coordination. This work bridges the gap between molecular design, radiation physics, and chemistry, offering a robust roadmap for next-generation high-sensitivity EUV photoresists.

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[tokenanalyst]

China domestic equipment components is growing pretty fast.​

Fuchuang Precision expects its net profit to increase by up to 11 times in the first half of the year, with continued strong demand for semiconductor equipment components.​

Fuchuang Precision released its 2026 semi-annual performance forecast. The company expects to achieve a net profit attributable to owners of the parent company of RMB120 million to RMB150 million in the first half of the year, an increase of 877.49% to 1121.86% compared with the same period last year. The net profit growth rate is more than 11 times, which is extremely impressive.

In terms of revenue, the company expects to achieve operating revenue of RMB 2.1 billion to RMB 2.5 billion in the first half of the year, an increase of RMB 376 million to RMB 776 million compared with the same period last year, representing a year-on-year growth of 21.83% to 45.03%. Even calculated based on the lower limit of revenue growth, the net profit growth rate still far exceeds the revenue growth rate, reflecting a significant improvement in the company's profitability.

In its announcement, Fuchuang Precision stated that the significant increase in revenue was due to the continued improvement in the global semiconductor industry, leading to rapid order growth and a sustained expansion of revenue. Simultaneously, the company's economies of scale gradually materialized, resulting in improved gross profit margin and a marked improvement in profitability. Furthermore, the relatively low net profit base in the same period last year (approximately RMB 12.2764 million) also provided room for high growth this year.

According to available information, Fuchuang Precision is a leading enterprise in the field of precision semiconductor equipment components in China. Its products cover process components, structural components, and module products, and are widely used in core semiconductor manufacturing equipment such as etching, thin film deposition, and ion implantation. The company holds an important position in the global semiconductor equipment component supply chain, and its customers include major domestic and international semiconductor equipment manufacturers.



Industry analysts point out that the global semiconductor industry chain is currently in an expansion cycle, and equipment and components, as a key upstream link in the industry chain, directly benefit from the capital expenditure expansion of downstream wafer fabs and packaging and testing plants. The exceptionally high net profit growth of Fuchuang Precision in the first half of the year reflects both the accelerated progress of domestic substitution of semiconductor equipment and components and confirms the trend of the industry's high prosperity continuing to spread upstream in the industry chain.

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[european_guy]

SemiAnalysis teardown and analyze KIRIN 9030

Technical, interesting video

Not all new, they suggest SMIC N+3 about similar to TSMC N6, but interesting to see


....a bit of cope at the end..but it's ok, they have a family to feed...

 

[tokenanalyst]

Yunzhong Technology's high-performance MLCC production project, with a total investment of 1.5 billion yuan, has been signed and settled in Chizhou.​

Recently, the Management Committee of Wanjiang Jiangnan Emerging Industry Concentration Zone and Chizhou Yunzhong Electronic Technology Co., Ltd. reached an agreement, and a high-performance multilayer ceramic chip capacitor production project with a total investment of 1.5 billion yuan was successfully settled in the zone.

The project plans to construct an intelligent production line for multilayer ceramic chip capacitors in two phases, with high-performance multilayer ceramic chip capacitors as the main product. The first phase involves an investment of 750 million yuan, with construction scheduled to begin before September this year and production expected to commence by the end of the year. The second phase will be constructed separately based on the project's operational progress.

Multilayer ceramic chip capacitors are key basic components in the electronics industry, widely used in consumer electronics, automotive electronics, communications and industrial control, etc. Currently, there is broad room for domestic substitution and outstanding development potential.

On June 25, Yunzhong Technology announced that its subsidiary, Chizhou Yunzhong, plans to invest 1.5 billion yuan in a high-performance MLCC production project in Chizhou, Anhui Province. The project will be implemented in two phases, each with an investment of 750 million yuan. The implementing entity will be a newly established subsidiary, Chizhou Yunchi Electronics. The first phase of 750 million yuan will be contributed by Chizhou Yunzhong (450 million yuan) and Chizhou Jiangnan Emerging Industry Fund (300 million yuan). After the capital increase, Chizhou Yunzhong will hold 60% of the shares, and the industry fund will hold 40%. The second phase will depend on the operation of the first phase, with the company and local state-owned assets contributing another 450 million yuan and 300 million yuan respectively. Regarding the funding schedule, the industry fund's 300 million yuan contribution must be paid in by the end of October 2026, and the company's 450 million yuan contribution must be completed no later than September 2028.​

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[siegecrossbow]

SemiAnalysis teardown and analyze KIRIN 9030

Technical, interesting video

Not all new, they suggest SMIC N+3 about similar to TSMC N6, but interesting to see


....a bit of cope at the end..but it's ok, they have a family to feed...

Article version for people who don’t want to sit through a video.

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[tokenanalyst]

XingSi Semiconductor completes a new round of strategic industrial financing to accelerate independent innovation of 6G low-orbit satellite communication baseband chips.​

StarSemi Semiconductor has successfully completed a new round of strategic financing to accelerate its independent research and development in 6G low-orbit satellite communication baseband chips. The investment round attracted a mix of significant new investors, including state-owned entities like Xinhuan Investment (Shanghai) and Zhuzi Fang Venture Capital (Fuzhou), alongside major corporate players such as Manbang Group and Tongding Group. Existing shareholders, including General Atlantic and Langrun Lifang, have also increased their stakes to demonstrate long-term confidence in the company's mission to deepen innovation within China's low-orbit satellite internet sector.



This funding comes at a critical time as Chinese national policy continues to prioritize the development of the satellite internet industry. With the integration of satellite networks into the country's broader infrastructure plans alongside ground communication and computing grids, StarSemi's technology is positioned as a cornerstone for achieving the nation's 2030 and 2035 goals for integrated air-space-ground-sea systems. As a leading hard-tech firm, StarSemi stands out globally for its ability to fully independently design 5G/6G baseband chips from scratch. The company has already begun commercializing these technologies through solutions that enable direct satellite connectivity for smartphones and vehicles, proving the viability of domestic alternatives in this specialized market.

Looking ahead, StarSemi intends to leverage this capital not only to refine its core chip technologies but also to build a robust industrial ecosystem by collaborating with supply chain partners. The company plans to expand its portfolio of domestic satellite terminal products and push for deeper integration between satellite communications and emerging 5G-A networks. Furthermore, StarSemi aims to actively participate in the pre-research and standard-setting phases for China's 6G protocols, ensuring that the nation maintains a strong "indigenous" foundation in the global race toward high-quality, systematized space-to-earth network infrastructure.

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