Chinese semiconductor thread II

[tokenanalyst]

UAI Smart Technology's "One Brain, Multiple States" semiconductor-embedded intelligence solution is implemented.​

On March 25, 2026, SEMICON CHINA 2026 officially opened in Shanghai, where UAI Smart Technology (also known as UAI Robotics) made a significant industry appearance with the launch of three new mobile robot products. The company demonstrated its "One Brain, Multiple States" semiconductor-embedded intelligence solution at their booth, showcasing three robots working collaboratively in a simulated semiconductor factory environment. This demonstration highlighted a complete intelligent material flow loop covering everything from material picking to transportation and docking.

UAI Robotics introduced three next-generation mobile operating robots designed for different stages of semiconductor manufacturing. The OW12-300 targets the entire 12-inch wafer fabrication process and is compatible with FOUP, FOSB, and Metal CST carriers. The OW8-350 serves 8-inch wafer front-end processes and can navigate narrow channels as tight as 650mm. Most notably, the ATS6F represents an industry-first innovation for cross-cleanliness material handling. This robot features an integrated cleanroom system with automatic sealing technology that maintains Class 100 cleanliness levels within Class 10,000 cleanroom environments, enabling seamless transfers between different cleanliness zones.
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The new products deliver what UAI describes as an "efficiency revolution" across three key dimensions: speed, cleanliness, and continuous operation. On-site demonstrations showed that both the OW12-300 and OW8-350 achieve empty-to-full exchange times under 25 seconds, matching the operational pace of overhead crane systems while providing greater flexibility as a supplement to OHT infrastructure. For uninterrupted 24/7 operations, the OW12-300 incorporates wireless charging with dual batteries, while the OW8-350 features high-capacity batteries and dual-sided wireless charging capable of synchronous charging during operation. The ATS6F additionally eliminates the need for dedicated track investment by achieving stringent cleanliness requirements through innovative cabin-based cleanroom design, offering a more cost-effective solution for cross-regional logistics in semiconductor factories.​

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[tokenanalyst]

SMIC establishes Advanced Packaging Research Institute to promote collaborative innovation across the industry chain, achieving a monthly production capacity of over 1 million wafers.​

In 2025, a landmark year marking SMIC's 25th anniversary, the company achieved impressive results by delivering strong performance amid a complex external environment. SMIC focused on its core wafer manufacturing business and recorded annual sales revenue of US$9.327 billion, representing a 16.2% year-on-year increase. This achievement further consolidated SMIC's position as the world's second-largest pure-play wafer foundry. Despite significant increases in depreciation expenses, the company maintained healthy profitability with a capacity utilization rate rising to 93.5%, an 8 percentage point improvement year-over-year, while the gross profit margin reached 21%, up 3 percentage points from the previous year.

In terms of production capacity, SMIC steadily advanced its expansion plans, achieving a monthly production capacity equivalent to over 1 million 8-inch standard logic wafers. The company also made substantial progress on strategic projects including acquiring minority stakes in SMIC Northern and implementing capital increases and share expansion at SMIC Southern, laying a solid foundation for future development. With downstream applications diversifying across artificial intelligence, data centers, and autonomous driving sectors—all leading the industry into rapid growth—alongside iterative upgrades in consumer electronics smart terminals and accelerated industrial chain localization, demand for local mid-to-high-end chip manufacturing increased significantly. In response, SMIC maintained high R&D investment levels at US$774 million in 2025, accounting for 8.3% of sales revenue, while improving its technological innovation system to continuously promote process iteration and product upgrades.

Recognizing that competition in the integrated circuit industry ultimately boils down to talent competition, SMIC implemented comprehensive measures to cultivate outstanding young managers and strengthen its talent pipeline. The company continues increasing recruitment of recent graduates while actively introducing professional backbones and high-end experts. For talent retention, SMIC fosters employees' sense of responsibility, mission, and belonging through positive incentives and diversified compensation packages. Looking ahead to 2026—a strategic opportunity window for industrial development—the company has outlined ten key tasks: ensuring security, securing projects, strengthening technology, expanding growth, training the workforce, optimizing operations, controlling costs, preventing risks, responding to changes, and fostering employee well-being. SMIC aims to consolidate its advantages, break through bottlenecks, address weaknesses, and gain strategic initiative in international and domestic competition, advancing its "One SMIC, Global Operations" strategic layout toward a new era of brilliance.​

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[tokenanalyst]

Yicheng Technology's Board-Level High-Density System Packaging and Testing Solutions Empower the Development of AI Computing Power.​

On March 25th, SEMICON China 2026 officially opened at the Shanghai New International Expo Centre, where Yicheng Technology presented its board-level high-density system packaging and testing solutions. The company comprehensively demonstrated how FOPLP (Fan-Out Panel Level Package) enables heterogeneous integration and performance improvement for AI chips through larger size and higher efficiency high-density interconnects. Current trends in advanced packaging development show that 2.5D/3D packaging technologies provide computing power enhancement support for AI and data center scenarios, while innovative technologies such as FOPLP and CPO (Co-Package for Optoelectronics) accelerate process stability verification. With higher area utilization, output rates, and lower unit costs, FOPLP has become a key pathway supporting mass production of high-performance chips.

Yicheng Technology showcased its EHIoP® Board-Level High-Density Technology Platform at the conference, which includes multiple advanced packaging technologies such as 2D FO, 2.xD FO, FOPoP, FC, and Advanced SBT. This platform targets key applications in AI computing power and heterogeneous integration, providing system solutions ranging from small chips and modules to high-performance heterogeneous integration across diverse application scenarios. The company's 2D FO technology features substrate-less design with five-sided or six-sided chip coating, suitable for single-chip and multi-chip system integration in mobile electronics, automotive, and industrial fields. Meanwhile, their 2.xD FO technology offers RDL-first architecture with line width/space specifications of 2/2 micrometers, available FO sizes up to 50×70mm with substrate options of 90×115mm, delivering flexible and high-performance homogeneous or heterogeneous integration ideal for AI, ASIC, and CPU applications.​

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[tphuang]

https://twitter.com/i/web/status/2037515301730820384

I thought they said testing and inspection equipment was where China was behind in? lol. Looks like that theory has been blown to pieces. I tend to think SiCarrier made huge progress here once the oscilloscope issue and laser issues got resolved.

 

[tokenanalyst]

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Beijing CETC Corporation released its newly developed WGP-1271C fully automatic thinning machine.​

The newly released high-efficiency GGG three-axis four-station fully automatic thinning machine WGP-1271C is specially designed for the processing of large-size SiC substrates and device wafers.​

The equipment, equipped with an ultra-high torque spindle and a fourth-generation high-load-bearing table, boasts powerful and stable power output, easily meeting the stringent requirements of SiC material processing. It also features a new Autosetup intelligent automatic setting function, automatically completing the dressing and calibration process after wheel replacement, effectively ensuring consistency and stability in mass production. Furthermore, in terms of cost control and flexible adaptation, the equipment supports diverse configurations of thinning consumables and adopts an optimal matching design for processing volume. It can be flexibly adjusted according to different production needs, precisely balancing operating costs and output efficiency, providing users with highly customized and flexible process options.​

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[tphuang]

https://twitter.com/i/web/status/2037643417522450706

Axera releasing its 2025 earnings report. Huge growth in edge AI and smart car divisions.

 

[tokenanalyst]

Haichi Semiconductor Unveils High-Performance New Generation Projection Chip Series​

Zhuhai Haiqi Semiconductor Co., Ltd. launched its latest generation of projection chips in Zhuhai, introducing a comprehensive suite comprising over ten sub-models designed to address core needs across diverse scenarios including automotive electronics, commercial displays, portable screens, and home projectors.​

• Advanced Keystone Correction & Image Quality: The series features Hikvision's self-developed second-generation four-point keystone correction technology and the PQ2.0 high-quality engine. This enables accurate image correction at large tilt angles and intelligent optimization of color and brightness, outperforming standard GPUs in speed for three-axis corrections.​
• Robust Performance & Decoding: Chips are equipped with high-performance RISC CPUs supporting H.265 FHD 60FPS decoding. Specific models offer dual HDMI inputs (e.g., D7100), multiple interface outputs (USB/TF, CVBS, RGB888, LVDS, MIPI), and support for RTOS/Linux dual operating systems to lower development thresholds while expanding scenario flexibility.​
• Ultra-Low Latency: Models like the A7100 provide wired/wireless screen mirroring with audio-video synchronization, ideal for mobile playback and conference applications.​

Scenario-Specific Applications:​

• Projectors (D3000-D/D3100-D/D7000): Optimized for home and commercial use with support for various projection hardware requirements.​
• Portable Multimedia Screens (D7000/D7100): Combines lightweight intelligence with high image quality, featuring Wi-Fi/ethernet dual networks, multi-touch control, and expandable functions like cloud photo frames and IPTV.​
• Consumer Devices (A7100): Targets mobile phone mirroring and portable playback with hardware decoding capabilities.​
• Intelligent Vehicles (B7100/C7100/C7000): Designed for in-vehicle central control, instrument panels, and rear entertainment systems, supporting dual cameras and DVR recording while adhering to mainstream vehicle networking protocols.​
• Image Transmission (F7000/F7100/F7101): Provides ultra-low latency transmission suitable for drones, medical imaging, office meetings, and vehicle-mounted applications via high-definition encoding and dual-band Wi-Fi.​

This launch represents a significant breakthrough in the domestic semiconductor industry, moving Haiqi Semiconductor from simple iteration to an ultimate chip solution that challenges overseas technological barriers. By building independent core technologies in multimedia encoding/decoding, Haichi is establishing a new "technological high ground" for China's intelligent display sector.

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[tokenanalyst]

Huahai Qingke Showcase in SEMICON China 2026 Full-Range Semiconductor Solutions​

On March 25–26, Huahai Qingke (Hwatsing) made a significant impact at the SEMICON China 2026 exhibition in Shanghai, showcasing its comprehensive lineup of advanced semiconductor equipment and process integration solutions. The company engaged with industry leaders to discuss global semiconductor trends and demonstrated technological breakthroughs across multiple critical areas.​

• CMP (Chemical Mechanical Polishing) Equipment:
  • The new Universal-S300 featured an innovative stacked layout for superior space utilization and production capacity, supporting advanced processes and packaging.​
  • The Universal-300FS is currently undergoing verification on advanced production lines, praised for high efficiency, stability, and yield.​
  • New launches include the Master-P510APEX (double-sided panel polishing) and high-precision edge polishers.​

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• Ion Implantation Equipment:
  • Huahai Qingke achieved full model coverage in its 12-inch high-current series, with the latest generation reaching internationally advanced levels in replacement rates, stability, and process uniformity.​

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• Thinning & Dicing Solutions for 3D ICs:
  • The company introduced complete solutions for advanced packaging, including the Versatile-GP300 thinning equipment. This device offers high accuracy and solves challenges related to wafer transport of complex shapes and cross-cleanroom cleaning.​
  • Combined with CMP, lamination, and edge trimming machines, these tools provide an integrated cutting-to-finishing process suite.​

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• Wet Processing & Wafer Regeneration:
  • Exhibits included single-wafer cleaning, compound brushing, and wafer brushing machines.​
  • Industry partners expressed strong interest in the company's capacity planning milestones for its wafer regeneration business.​

During the "International Forum on the IC Manufacturing Industry Chain," Vice President Cheng Quansen delivered a keynote titled "Iterative Breakthroughs, Self-Innovation, and Leading the Future." He detailed innovations in low-energy high-current, low-temperature high-current, and hydrogen-based ion implantation technologies.

Looking ahead, Huahai Qingke reaffirms its commitment to strengthening China's semiconductor equipment foundation through an "equipment + service" strategy. The company aims to deepen industry collaboration, break core technological barriers, and build an open industrial ecosystem under its core values of customer orientation and innovation-driven growth.​

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[tokenanalyst]

Lianxun Instruments launched new product​

Lianxun technical engineers conducted multiple dynamic demonstrations on-site, intuitively showcasing the outstanding performance of the new SA8000 in terms of measurement accuracy and testing efficiency.

Lianxun Instruments continues to deepen its expertise in the field of semiconductor electrical parameter testing. Its product portfolio already covers precision SMUs, switch matrices, WAT testers, WLR reliability testing systems, and the newly released SA8000 semiconductor parameter analyzer. Lianxun Instruments is steadily completing its strategic layout for semiconductor electrical parameter testing, moving from the lab to the fab.

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[tokenanalyst]

Primarius Launched The P1800 Series Precision Source Measurement Unit (SMU)​

• P1800 series precision source measurement unit based on proprietary SMU technology
• This enables the company's semiconductor device characteristic testing business to form a complete product line: benchtop instruments, electrical parameter testing, low-frequency noise testing, professional software and parameter testing systems .

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