Chinese semiconductor thread II

tphuang

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16 bit 12.8G RF DAC from CASC, rivaling the best from TI and ADI. DAC is less used than ADC, but still important for AWG, EW, SerDes and radar simulation
this is good stuff. In fact, having seen how dominant TI still is in the serdes, EW and radar, it's good to see some domestic solutions here. If you look at the MMW radars that Chinese producers are now making for EVs, the radar themselves are domestic designed, but the main SoC is always TI.

I saw this chip recently by TI called AWR2188
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essentially receives analog data and convert to digital to pass along computing unit to process.

Until you get really good at analog to digital and vice versa + FPGA, it's hard to compete against TI on integrated solutions like this. With the world class ADC, DAC and FPGA that they are increasingly developing, looks like we are getting there.
 

tokenanalyst

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Anlu Technology plans to raise 1.262 billion yuan to increase its investment in the research and development and industrialization of high-end FPGA chips.​



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On January 26, Anlogic Technology unveiled its "2026 Plan for Issuance of A-Shares to Specific Targets," aiming to raise up to RMB 1.26 billion by issuing no more than 120.25 million shares—capped at 30% of pre-issuance share capital—to no more than 35 institutional investors. The funds will be used exclusively for two core R&D projects to strengthen its position in high-end field-programmable gate array (FPGA) chips and accelerate domestic technological substitution.

The issuance price will be set at no less than 80% of the average stock price over the previous 20 trading days, with all proceeds paid in cash and subject to a six-month lock-up period. After deducting issuance costs, the funds will be allocated as follows:
  1. Advanced Process Platform Ultra-Large Scale FPGA Chip R&D Project (RMB 726 million): Focuses on developing next-generation ultra-large scale FPGA chips using advanced FinFET and chiplet technologies, targeting high-performance applications in 5G/6G communications, data centers, precision instruments, and hardware simulation to bridge the gap with global leaders.​
  2. FPGA & FPSoC Chip Upgrade and Industrialization Project (Planar Process) (RMB 536.4 million): Aims to enhance existing FPGA and FPSoC products with support for new bus protocols, high-precision ADCs, customizable interfaces, and national cryptographic security features—addressing growing domestic demand in intelligent computing servers, smart vehicles, smart grids, and edge computing.​
Anlogic emphasized that this private placement is a strategic move to leverage national semiconductor industry opportunities and meet evolving market needs. The projects are expected to overcome critical technical barriers, expand product innovation, strengthen China’s end-to-end semiconductor supply chain, and solidify Anlogic’s leadership in the domestic FPGA market while enhancing long-term competitiveness and profitability.

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tokenanalyst

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Jifeng Electronics, a one-stop semiconductor testing and analysis solutions provider, has submitted its IPO preparatory filing application.​

According to the official website of the China Securities Regulatory Commission, Shanghai Jifeng Electronics Co., Ltd. (hereinafter referred to as "Jifeng Electronics") submitted an IPO tutoring filing application to the Shanghai Securities Regulatory Bureau on January 22, with Everbright Securities as the tutoring broker.

Jifeng Electronics was established in July 2008 with a registered capital of 116 million yuan. The legal representative is Zheng Zhaohui. The company has no controlling shareholder. The actual controllers, the siblings Zheng Zhaohui and Zheng Qijun, and their concerted parties hold a total of 38.08% of the shares. Jifeng Electronics was listed on the National Equities Exchange and Quotations (NEEQ) from January 2017 to March 2021.

According to its official website, Jifeng Electronics is an enabling platform technology company focusing on the semiconductor field and deeply engaged in the R&D and technical services of integrated circuit testing-related software and hardware. The company's business is divided into four major segments: basic laboratories, software and hardware development, testing and packaging, and instrumentation and equipment. It can provide one-stop testing and analysis solutions for companies in the semiconductor industry chain, including chip design, wafer manufacturing, packaging and testing, and materials equipment, as well as in the new energy field.
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tphuang

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San Yi Laser unveiled new large inch laser cutting equipment for diamond.

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黄河旋风 became the first in china to produce 8-inch diamond heat sink wafer, breaking a major bottleneck here. This will significantly lower production cost of heatsinks.


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CSMT won CEC award for its 3 major breakthrough in high speed ADCs this year for 8-bit 64G, 12-bit 16GSPS and 12-bit 40 GSPS. They have already been used in radar, EW, 6G, satcom and AI data center and high end instrumentation.

For example, China's first Ku-band ADC is use ADC-HWD12B40GA4
 
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