Chinese semiconductor thread II

[clnt]

not sure about NAURA, but AMEC has reported it's getting pretty close on 90:1 etcher. YMTC has been working on tuning its all domestic production line for a while now and supposedly will start production soon. So, nothing too surprising here.

UBS is late to the game

How much is YMTC’s capacity based on domestic tooling?

 

[tokenanalyst]

They have a previous 3D-NAND etcher


Looking a my previous post, Naura launched a series of new tools, "secretly". One of those says is a Deep Silicon Etcher for 3D-NAND Above Generation 5, I don't know how the generation translate to the number of layers. I think is over the hundreds.

I have notice that Naura has quietly been adding semiconductor tools to their catalog.

The Landscape: A plasma etching-doping system that implant Ions into junctions and trenches of ICs, different from Ion implanters that accelerate particles using magnets this looks likes use energy of the plasma field to implant the atoms. The equivalent would be AMAT VIISta

View attachment 163562
The ACCURA Family: already discuss here, for deep hole-trench, dielectric etching and 3D-NAND
View attachment 163563
The Surefill W Family: For Tungsten thin film Chemical Deposition for the interconnects in ICs, my guess is to compete with AMAT Endura, especially with AMEC Preforma Uniflex.

View attachment 163564

They Also entered the Ion Implantation business, the Sirius family and the Rapid Thermal Processing business with the Sitara family probably to complement their Ion Implanters, RPT tools are used after Ion Implantation basically recrystallize the atoms after doping.
View attachment 163566

 

[tokenanalyst]

Tuojing Technology plans to jointly invest in Chipone Precision with related parties.​

Tuojing Technology plans to jointly invest with its related party, Fengquan Venture Capital (in which senior executives including Chairman Lu Guangquan and Director Liu Jing are limited partners), in Ningbo Xinfeng Precision Technology Co., Ltd. (Xinfeng Precision). This constitutes a related-party transaction.

Tuojing Technology will acquire up to RMB 270 million for 16.42% of Xinfeng Precision’s registered capital (equivalent to RMB 9.9838 million in registered capital). Fengquan Venture Capital will invest RMB 30 million for 1.82% of the company's capital (RMB 1.1093 million in registered capital).

Xinfeng Precision’s specializes in thinning, dicing, and cutting equipment and consumables for 3D IC and advanced packaging processes. Has independent R&D and manufacturing capabilities for core software and components. Both companies operate in semiconductor equipment Tuojing focuses on advanced bonding and metrology equipment for 3D integration, while Xinfeng provides key processing tools.


The investment strengthens Tuojing Technology's industrial ecosystem and synergies with Xinfeng Precision, especially in the 3D integration process where thinning, dicing, and bonding are closely interdependent.
​

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[tphuang]

https://twitter.com/i/web/status/1998032713920528782

Horizon Robotics unveils 4th gen BPU architecture for Journey 7 series of chips. Expecting this to allow 10x higher compute & 5x better power efficiency.