Chinese semiconductor thread II
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Yangtze Memory Technologies Co. is considering an initial public offering in mainland China at a valuation that could exceed $40 billion, according to people familiar with the matter, in what could be one of the biggest listings there in years.
YMTC, as the chipmaker is known, may seek a valuation of 200 billion yuan ($28 billion) to 300 billion yuan, and it’s working with China International Capital Corp. and CSC Financial Co. on the potential IPO, the people said, asking not to be identified as the information is private. An offering may take place as soon as next year, some of the people said.
Separately, ChangXin Memory Technologies Inc. is also planning to go public onshore. The company, known as CXMT, this month completed pre-listing tutoring work for its IPO and is working with CICC and CSC Financial, the same pair of banks YMTC is relying on. The Hefei-based chip firm is also targeting a valuation of 200 billion yuan to 300 billion yuan in its IPO, people familiar with the matter said, confirming an earlier Reuters report.
Precision Electronics Excimer Laser Core Module to be Batch Verified
Jingce Electronics announced on its investor engagement platform that the performance indicators of its independently developed excimer laser core module have been recognized by customers and will soon be shipped to clients for batch verification. This product marks a breakthrough for the company in the field of core light sources for semiconductor precision equipment.
The company explains that excimer lasers are crucial core components in semiconductor lithography and display inspection equipment, requiring extremely high precision, energy stability, and lifespan. After multiple rounds of design iterations and performance testing, the company's R&D team has achieved mass production verification for the core module.
The company has reportedly secured multiple repeat orders for its core semiconductor components and is currently undergoing verification for complete device integration. It anticipates gradual deployment in multiple scenarios across downstream wafer fabs and panel manufacturers. If this verification proceeds smoothly, it is expected to accelerate the company's product integration into customer supply chains.
In recent years, Jingce Electronics has continuously increased its R&D investment in high-end testing equipment and key core modules, with products covering three major business segments: semiconductor testing, display testing, and new energy testing. The company continues to refine its portfolio from core components to complete systems, promoting domestic substitution.
Industry insiders believe that customer validation of the excimer laser core module will be a key milestone in the company's expansion into the high-end semiconductor equipment market. If successful in batch validation, Precision Electronics is expected to further strengthen its competitive advantage in the domestic light source equipment sector.
Deke Micro releases the world's first ultra-high voltage millimeter-wave isolation driver chip, the DKV56 series.
Deke Micro has launched the world’s first ultra-high-voltage millimeter-wave isolation driver chip, the DKV56 series, marking a major breakthrough in power semiconductor technology. Built on its proprietary MillConnex® millimeter-wave wireless isolation technology, the DKV56 series delivers unprecedented performance in four key areas: high voltage withstand (up to 20kV continuous, 30kV surge), exceptional common-mode transient immunity (CMTI > 200 kV/μs), high integration, and low latency (38ns propagation delay).
It outperforms traditional isolation methods like optocouplers or transformers by enabling reliable, high-speed signal transmission under extreme conditions. The chip supports five current configurations with split outputs (e.g., 2.5A/5A to 30A/30A), efficiently driving SiC devices for higher switching frequencies and reduced energy loss. It includes advanced safety features such as active Miller clamping, soft shutdown (STO), short-circuit protection (ASC), and real-time fault detection (FLT/RST), enhancing system reliability and simplifying circuit design.
Operating from -40°C to 125°C, the DKV56 series is now in mass production and pursuing global safety certifications (VDE/UL/CQC). This innovation aligns with the growing demand for high-performance power electronics in AI data centers, new energy systems, EVs, and industrial automation—areas where SiC/GaN drivers are expanding rapidly.
Deke Micro's ongoing advancements include the world’s first digital millimeter-wave isolation chip (with >10kV withstand voltage and up to 5Gbps speed), further revolutionizing isolated communication in power electronics. The DKV56 series represents a pivotal shift toward safer, more efficient, and higher-performance power systems globally.
Shanghai Institute of Optics and Fine Mechanics makes new progress in boron-doped diamond research
In recent years, boron-doped diamond (BDD) electrodes have been widely used in electrochemical oxidation, wastewater treatment, and sensors due to their wide electrochemical window, high chemical stability, and excellent corrosion resistance. The electrochemical performance of BDD depends primarily on factors such as doping concentration, crystal morphology, and surface chemical properties.
However, impurities are often inevitably introduced into BDD electrodes during the chemical vapor deposition process. For example, during hot-filament chemical vapor deposition (HFCVD), the tungsten filament used as the heating element releases trace amounts of metal atoms into the system. These tungsten (W) impurities can become embedded in the diamond lattice, affecting the material's properties. While this phenomenon has long been observed experimentally, its specific impact on BDD electrode performance has long been overlooked.
A research team led by Hang Yin of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, conducted a systematic study to address this issue. Using microwave plasma chemical vapor deposition (MPCVD), the team fabricated a series of tungsten-codoped boron-doped diamond (WBDD) electrodes with varying tungsten contents and systematically investigated their microstructure, optical characteristics, and electrochemical properties. Their findings were published in the journal Surfaces and Interfaces (2025) in an article titled "Impact of tungsten doping on the physicochemical properties of boron-doped diamond electrodes."
The researchers first noted that during the traditional BDD electrode preparation process, metallic impurities inevitably enter the system. Previous work has shown that impurities such as silicon can significantly alter the surface functional groups and charge transfer properties of BDD, but the role of tungsten is less systematically understood. To eliminate uncontrollable factors, this study actively introduced a controllable amount of tungsten source (W(CO)₆) via MPCVD. Trimethylborate (TMB) was used as a boron source, and the doping concentration was regulated by varying flow rates. The samples were deposited on a titanium substrate at a growth temperature of approximately 750°C and characterized post-deposition using various methods.
interesting, so both YMTC and CXMT are looking to IPO next year at about the same valuation.
Although CXMT probably will get there at higher valuation.
At least this will finally let us know for sure how much capacity and production they are doing.
Do you have to publish this data to be quoted at the Shanghai stock exchange? It would be necessary in Hong Kong yes.
I don't know but SMIC and HH will both talk about their capacity on their earning calls, so I would assume YMTC and CXMT will at least share some stuff.
Anyways all future listings of chipmakers will be Shanghai only, but y'all already expect that.
SSE just updated their disclosure requirements in July, possibly to make it easier for these sensitive tech firms
SSE just updated their disclosure requirements in July, possibly to make it easier for these sensitive tech firms
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