Chinese semiconductor thread II

tokenanalyst

Lieutenant General
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In 2015 the Chinese government goal for 2020-2030 was to have:

2020:
250 nm I-Line machine. Wavelength = 350nm 0.8NA
110 nm KrF machine. Wavelength = 248nm 0.8NA
90nm ArF machine. Wavelength = 193nm 0.8NA

2025:
45nm Immersion machine. Wavelength = 193nm 1.35NA

And for 2030:
32nm EUV machine. Wavelength = 13.5nm 0.30NA

Not 7nm no 5nm no 3nm, that goal was to make chips in a planar process closer to the resolution of the machine because at the time,2015, overlay was still an issue. So for 250nm the overlay is 80nm, 110nm is 35nm, for 90nm is close to 30, for 45nm is 15nm and for 32nm is 10nm. Single exposures and big overlays.

My thinking is that the goal was not to replace foreign machines but to have machines that could make chips that are critical for the government, the space program and the military. That was the self-reliance that government wanted in with MIC2025, is to have 70% of the chips that the government use being produced locally, that include chips for the military, reducing the dependency of critical components that could be blocked. But US stooges in their infinite stupidity miss-interpreted this as China wanting to replace every single chip in China with domestic one and from there with the narrative of bellicose overpaid US think tankers everything when downhill with the situation escalating significantly under Biden in 2022.

I do think was bit foolish for the Chinese government not keeping their MIC2025 plans secret knowing that US clowns would misinterpreted it BUT at the same time I think that with MIC2025, the Special Project 02 and other projects China may have avoided a US made bullet.
 

tphuang

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利用变温拉曼光谱和时域热反射法(TDTR)评估了界面热管理性能。拉曼光谱显示β-Ga₂O₃在金刚石上的特征峰随温度升高发生红移,频移系数达 -0.05 cm⁻¹/K,远高于在蓝宝石或硅衬底上的值(-0.024 cm⁻¹/K),说明金刚石衬底有效释放了热应力。TDTR测试表明,无石墨烯时β-Ga₂O₃/金刚石界面热阻仅为2.82 m²·K/GW,而引入石墨烯后因范德华界面声子传输受限,热阻升至6.08 m²·K/GW。虽经氧等离子体处理可部分形成共价键连接(热阻略降至6.02 m²·K/GW),但会牺牲薄膜结晶品质。基于该材料制备的金属-半导体-金属(MSM)型光电探测器在254 nm紫外光照射下,暗电流仅5.83×10⁻⁶ μA,光电流达7.92 μA,光暗电流比10⁶,响应度210 A/W,性能优于大多数同期报道的器件,体现出良好的材料均匀性与界面质量。

总结:石墨烯中间层有效释放热应力,制备的光电探测器具备高响应度与优异稳定性,凸显范德华外延的应用价值。

NPU findings on putting B-Ga2O3 on diamond substrate with graphene middle layer. Looks like this is the best heat management setup in their testing.
 

iewgnem

Senior Member
Registered Member
In 2015 the Chinese government goal for 2020-2030 was to have:

2020:
250 nm I-Line machine. Wavelength = 350nm 0.8NA
110 nm KrF machine. Wavelength = 248nm 0.8NA
90nm ArF machine. Wavelength = 193nm 0.8NA

2025:
45nm Immersion machine. Wavelength = 193nm 1.35NA

And for 2030:
32nm EUV machine. Wavelength = 13.5nm 0.30NA

Not 7nm no 5nm no 3nm, that goal was to make chips in a planar process closer to the resolution of the machine because at the time,2015, overlay was still an issue. So for 250nm the overlay is 80nm, 110nm is 35nm, for 90nm is close to 30, for 45nm is 15nm and for 32nm is 10nm. Single exposures and big overlays.

My thinking is that the goal was not to replace foreign machines but to have machines that could make chips that are critical for the government, the space program and the military. That was the self-reliance that government wanted in with MIC2025, is to have 70% of the chips that the government use being produced locally, that include chips for the military, reducing the dependency of critical components that could be blocked. But US stooges in their infinite stupidity miss-interpreted this as China wanting to replace every single chip in China with domestic one and from there with the narrative of bellicose overpaid US think tankers everything when downhill with the situation escalating significantly under Biden in 2022.

I do think was bit foolish for the Chinese government not keeping their MIC2025 plans secret knowing that US clowns would misinterpreted it BUT at the same time I think that with MIC2025, the Special Project 02 and other projects China may have avoided a US made bullet.
I mean, it's probably not something that was predicted, at least not with certainty, but US re-actions to MIC2025 was very much a net positive to its completion.

Chinese government can do a lot of things, but one of the hardest thing to do even for China is influencing public behaviour and overcome network effects. Without America's open hostility it would have been very hard to get consumers to buy domestic, and without US giving up on entrenched marketshare it would have taken much longer for Chinese companies to gain a foothold.

e.g. China invested in EVs because EVs are sufficiently differentiated and superior to ICEs to overcome entrenched western ICE market dominance, but if there were no EVs and China has to compete on ICE, it would have been much harder without somehow forcing errors from western ICE carmakerse.

The original 2015 semiconductor plan was equivilent to an auto industry that tries to compete with the west on ICE, the oppertunity for signfiicant acceleration only really became aviliable because of US reaction to MIC2015.
 
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