Chinese semiconductor thread II
- Thread starter vincent
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Baidu's Kunlunxin won the vast majority of China Mobile's AI inference chip bid for CUDA like ecosystem chip options. Again, Nvidia H20 is just not competitive right now
It is a mistake to aim for CUDA compatibility. Chinese AI vendors should just create their own standard. Otherwise they will perpetually be behind.
The Soviets stepped on that rake when they cloned the IBM S/360 and DEC PDP-11 to use their existing software.
The Soviets stepped on that rake when they cloned the IBM S/360 and DEC PDP-11 to use their existing software.
China is a saturated type of research and development, with teams following up on all technological paths.
Also, let's popularize the science.
1. In the field of high-performance computing, CUDA was initially assisted by China in implementing applications for Nvidia, and the first large-scale heterogeneous computing cluster built using CUDA was developed by China. In fact, using the Windows NT architecture to help Microsoft implement a supercomputer cluster is mainly done by Chinese people, but once it's done, it's cut into Linux versions.
2. Since the 1990s, China has made a large number of compatible chips for the most critical information systems in the United States, at least hundreds of alternative chips. After stepping through the pit, it is far beyond your imagination, and the compatibility level has been roast for a long time, and there are a lot of solutions. After 2015, China's military chip solutions gradually shifted from imitation substitution to comprehensive self-developed.
So now a core problem with NASA's SLS rocket (according to the GAO report) is that many specialized chips (such as the matching of RS25/SSME engines) are no longer produced in the United States. Currently, only East Asia has matching chips in the world. Guess who it is? Do you think Japan, South Korea, or Taiwan have special technology chips for the aerospace industry?
Xinyuan Micro: The new generation of coating and developing machines is expected to be launched in Q4
Xinyuan Micro (KingSemi) disclosed in its investor relations activity log that its strategic new product, the front-end chemical cleaning system, has achieved strong contract signings. The high-temperature SPM system has passed process validation at a leading domestic customer, successfully breaking the international monopoly and earning high customer recognition. The chemical cleaning system has already received orders and verification orders from several major customers. Some customers have placed repeat orders after completing initial validation. The company stated that contract signings in the first half of 2025 were strong, and the company is confident in achieving its full-year targets.
The company also revealed that the research and development and customer introduction of the new generation of front-end coating and developing machines are progressing smoothly overall. It is expected that the machine will be shipped to the client for verification in the fourth quarter of 2025, and the verification performance of the new model is expected to be seen on the client side next year.
Industry insiders point out that as the localization of semiconductor manufacturing accelerates, breakthroughs by local equipment manufacturers in key process steps will significantly enhance the independent and controllable capabilities of the supply chain. Xinyuan Micro's continued advancement in front-end cleaning and coating and development is expected to further increase its market share and drive performance growth.
PolyDing Core Materials completes Series A financing, is a semiconductor packaging bottom fill material supplier
Recently, Nanjing Juding Core Materials Technology Co., Ltd. (hereinafter referred to as "Juding Core Materials") completed its Series A financing, with exclusive strategic investment from Changxin Industrial Investment.
According to public information, Juding Core Materials was established in June 2023. It focuses on the research and development and production of bottom filling materials for integrated circuit packaging. It is engaged in the research and development and production of high-end patch adhesives for integrated circuit packaging. Its products mainly include two types: conductive adhesive and insulating adhesive. It is mainly used in semiconductor integrated circuit IC packaging (DIP SOP SSOP QFP LQFP TQFP SOP PLCC SIP QFN), LED, smart phones, electronic assembly, automobiles and other fields.
PolyDing Core Materials' core products—conductive adhesives and insulating adhesives—directly determine the mechanical stability, thermal conductivity, and signal transmission quality of the package structure. As high-end applications like 5G, AI, and automotive electronics continue to demand ever-increasing chip performance, traditional materials are no longer able to meet the demand. Domestic substitution of high-end patch adhesives has become a key step in breaking through the bottleneck in the industry chain, and PolyDing Core Materials' technological breakthroughs address this critical link.
This company main main business used to be and still is car parts, specially wheels, looks like now they are getting in the semiconductor business selling ultrapure alloys for semiconductor equipment components. Their alloys are market for high speed components maybe like the wafer stage in lithography machines.
Lizhong Group: Silicon aluminum alloy and aluminum silicon carbide new materials have been successfully mass-produced
Lizhong Group announced to investors on its interactive platform that its silicon-aluminum alloy and aluminum silicon carbide (AlSiC) new materials have successfully entered mass production and are being used in the manufacture of key semiconductor equipment components, such as bases, supports, and electrostatic chucks. The AlSiC alloy is primarily suitable for manufacturing parts requiring ultra-high precision and high-speed motion, while AlSiC is used in high-strength parts due to its excellent stiffness and wear resistance. The company has partnered with major domestic semiconductor equipment manufacturers, demonstrating its technological advancement and market expansion capabilities in the semiconductor materials field.
Furthermore, Lizhong Group's high-strength, high-yield, heat-treatment-free die-cast aluminum alloys and ultra-high-strength cast aluminum alloys are currently being widely used in emerging fields such as humanoid robot components and liquid cooling systems, providing further growth momentum for the company. The company's subsidiaries are also actively expanding into the automotive lightweighting market and have secured a major order for aluminum alloy wheels from an international luxury automaker, with mass production expected to begin in 2027. The contract value is approximately RMB 5.8 billion.
With its rich experience in new material research and development and a complete aluminum alloy industry chain, Lizhong Group is committed to providing key materials and component solutions for the semiconductor, robotics, automotive and high-end equipment manufacturing industries.
Panmeng Semiconductor completes 100 million yuan financing to accelerate the localization of etching silicon materials.
Jiangxi Panmeng Semiconductor Technology Co., Ltd. (Panmeng Semiconductor), a domestic company specializing in ultra-pure silicon etching materials for semiconductors, recently announced the completion of nearly 100 million yuan in Series A financing. This round was led by Galaxy Capital, with participation from Qinling Capital and Guangyuan Capital serving as exclusive financial advisor. The company previously received strategic investments from institutions such as Simai Industrial Finance and Bank of China International Investment, providing crucial support for the successful development of its core products and the smooth implementation of its initial production line.
The funds raised will be primarily used to further enhance core technologies and expand production capacity, accelerating the localization of Panmeng Semiconductor's silicon etching materials and meeting the urgent global market demand for ultra-large single crystal and nitrogen-free polycrystalline materials. Jiangxi Panmeng Semiconductor Technology Co., Ltd., led by core personnel from one of the world's top three semiconductor wafer foundries, specializes in the production of semiconductor-grade silicon wafers, including lapping, etching, and polishing wafers. The company offers a full range of wafer sizes, including 4, 5, 6, and 8 inches, with 4- and 6-inch wafers currently the primary focus and 8-inch wafers to be expanded in the future. Quality is paramount in its product offerings, and Panmeng's primary customers are major domestic and international manufacturers.