Chinese semiconductor thread II
- Thread starter vincent
- Start date
Understood, thank you.
Though I suppose we do have now an actual name for the new Ascend products. Thank you Huawei.
If it’s half the wafer processing speed and twice the yield and you remove steps you’re doing better than breaking even.
Why do you think the yield is twice? Asml machine has very high yield on a single step on euv layers. It is impossible to double asml yield
Yield for 5 nm using EUV could easily be double of yield using multi patterning DUVi. May even enable a proper 5 nm process rather than a compromised one.
Lipxin Semiconductor Packaging and Testing Project Starts Construction with Estimated Annual Output Value of 2 Billion Yuan
Lipxin Intelligent Chip Packaging and Testing Industrialization Project site was bustling with activity as a highly anticipated groundbreaking ceremony was held. With the official launch of the plant renovation project, Lipxin has taken a crucial step in its strategic layout for high-end packaging and testing, adding new impetus to the development of the semiconductor industry.
The new plant, under construction, will house a 20,000-square-meter, high-purity, intelligent packaging and testing facility. This impressive facility will be equipped with industry-leading production equipment and advanced technologies, providing superior, more efficient chip packaging and testing services. The facility is scheduled to begin production in the second quarter of 2026, adding approximately 5 billion chips per year. This will significantly enhance the company's production capacity and strengthen its competitive advantage in the market.
Lipxin's intelligent chip packaging and testing industrialization project focuses on integrating products and processes such as large QFN, LQFP, LGA/BGA, and flip chips. These products and processes occupy a key position in the semiconductor industry and can meet the needs of a wide range of applications, including communications, storage, sensing, signal chain, microprocessors, power management, and automotive. This comprehensive product portfolio will help Lipxin expand its customer base and enhance its adaptability to diverse markets.
The new plant, under construction, will house a 20,000-square-meter, high-purity, intelligent packaging and testing facility. This impressive facility will be equipped with industry-leading production equipment and advanced technologies, providing superior, more efficient chip packaging and testing services. The facility is scheduled to begin production in the second quarter of 2026, adding approximately 5 billion chips per year. This will significantly enhance the company's production capacity and strengthen its competitive advantage in the market.
Lipxin's intelligent chip packaging and testing industrialization project focuses on integrating products and processes such as large QFN, LQFP, LGA/BGA, and flip chips. These products and processes occupy a key position in the semiconductor industry and can meet the needs of a wide range of applications, including communications, storage, sensing, signal chain, microprocessors, power management, and automotive. This comprehensive product portfolio will help Lipxin expand its customer base and enhance its adaptability to diverse markets.
Kema Technology expands to produce 11,000 silicon carbide ceramic components for semiconductor equipment annually!
Kema Technology's expansion project for silicon carbide ceramic components for semiconductor equipment has made progress. On September 15, the Chuzhou Municipal People's Government issued a public notice regarding the acceptance of the "Environmental Impact Statement for Anhui Kema Materials Technology Co., Ltd.'s Project for Silicon Carbide Materials and Components for Semiconductor Equipment."
Anhui Kema Materials Technology Co., Ltd. plans to expand its plant in Building No. 6, located in the Suzhou-Chuzhou Modern Industrial Square in the Zhongxin Suzhou-Chuzhou High-tech Industrial Development Zone . The project investment is 65.4242 million yuan, with an environmental protection investment of 200,000 yuan. The expansion project will lease Building No. 1 in the Suzhou-Chuzhou Modern Industrial Square, with a construction area of 5,135 square meters. The project will purchase 74 sets of equipment, including a high-temperature silicon carbide sintering furnace, a high-temperature siliconizing furnace for silicon carbide, a process boat slotting machine, cleaning and drying equipment, a slip casting production line, CNC grinding machines, CNC lathes, and a CNC machining center. The project will add an annual production capacity of 11,000 silicon carbide ceramic components for semiconductor equipment (approximately 8 tons). The addition of vacuum stirring equipment to the slurry mixing process will ensure more uniform slurry mixing and further improve product quality. Public information indicates that Anhui Kema Materials Technology Co., Ltd. is a subsidiary of Suzhou Kema Materials Technology Co., Ltd., established in November 2022. It primarily designs and manufactures high-precision ceramic components such as silicon carbide wafer boats and silicon carbide furnace tubes, as well as various specialized equipment.
Huawei's REVENGE: New 'Super Pod' System Will CRUSH Nvidia's Next-Gen AI Chips
This community is surprised that there are so many people who don't know and even hate Huawei.
I also wrote about Kunpeng unveiling from this week. 950 and 960 are coming out. 960 is especially interesting with a 256 cores and 512 thread version.