Chinese semiconductor thread II
- Thread starter vincent
- Start date
FT didn't write the complete story.
SMIC has now spare advanced capacity but its not only for Cambricon but for other players as well.. spare 7nm capacity will further use in domestic CPU/GPU and advance automotive chips. Biren Technology coming back too.
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A breakthrough for domestic manufacturers! Oriental Crystal Source's chip system EDA simulation tool PanSys® successfully passed the acceptance inspection of the Beijing Municipal Science and Technology Commission.
The Beijing Science and Technology Plan project "Research and Development of EDA Tools for Multi-Physical Field Coupling Simulation Analysis of Core-Particle Systems" led by Oriental Jingyuan has successfully passed expert on-site acceptance after over a year of research. Seven authoritative experts, convened by the Beijing Municipal Science and Technology Commission and Zhongguancun Science Park Management Committee, unanimously approved the project and praised its achievements.
This marks a major breakthrough for PanSys®, Oriental Jingyuan's independently developed chip system EDA tool—making it the first domestic solution to achieve a "zero breakthrough" in multi-physics simulation for chiplet systems. It breaks the long-term monopoly of international EDA giants and significantly advances China’s chip technology security and integrity.
PanSys® features an adaptive meshing engine and high-performance multi-physics solver, automatically importing chip and package design data to build a high-fidelity 3D model, enabling accurate simulation of thermal conductivity, thermal mismatch, and warpage. This improves design efficiency, shortens development cycles, and supports rapid domestic chip industry growth.
Oriental Jingyuan has filed nine invention patents and registered one software copyright for PanSys®'s core technology. The achievement signifies a critical step in independent innovation within China’s chiplet technology and industrial upgrading, strengthening the security of the national semiconductor supply chain. Going forward, Oriental Jingyuan will continue addressing core industry challenges through technological innovation to drive industrial progress.
Xinsheng Semiconductor completes B+ round of financing, a high-end packaging equipment manufacturer
Recently, semiconductor packaging equipment manufacturer Xinsheng Semiconductor Technology (Shanghai) Co., Ltd. ("Xinsheng Semiconductor") announced the completion of its Series B+ financing round, led by Oriza Puhua. This round of financing will be primarily used to optimize product structure, expand market applications, and strengthen its technological advantages in the field of high-end packaging equipment.
According to public information, Xinsheng Semiconductor, founded in July 2020, is a Chinese supplier of semiconductor back-end molding equipment and solutions. Its core team is drawn from internationally renowned semiconductor equipment manufacturers. The company has successfully developed the STM-120 and STM-180 fully automatic injection molding equipment, the SWM-90 fully automatic wafer-level molding equipment, and the SCM-60 fully automatic compression molding equipment. Its packaging options include TO, SOT, SOP, LQFP, IGBT, QFN/DFN, LGA, BGA, Fan-in WLCSP (fan-in), Fan-out WLCSP (fan-out), FCCSP, FCBGA, 2D stacked POP, and 2.5D/3D. The company provides system solutions ranging from molding equipment and molds to automated packaging, and can also meet users' urgent needs for the development and production of non-standard automation equipment.
Furthermore, Qingdao Xinsheng Micro-Nano Electronics Technology Co., Ltd., an affiliate of Xinsheng Semiconductor, has achieved a significant breakthrough in gas mass flow controllers (MFCs), overcoming key technical barriers that have long hindered the development of domestic semiconductor-grade MFCs. The company has successfully developed two semiconductor-grade MFC products based on high-speed piezoelectric proportional valves. These products offer exceptional precision, reliability, and stability five times greater than existing products.
Maolai Optics' revenue in the first half of the year was 319 million yuan, and its net profit increased by 110.36% year-on-year.
Maolai Optics released its 2025 semi-annual performance report, stating that in the first half of the year, the company achieved operating income of 319 million yuan, up 32.26% year-on-year; net profit attributable to shareholders reached 32.7555 million yuan, an increase of 110.36%; excluding non-recurring items, net profit was 29.2037 million yuan, up 156.4%.
The growth in operating income is primarily driven by strong performance in the semiconductor field, with revenue rising 64.65% year-on-year. This growth reflects the company’s continuous technological advancement, improved process stability, and increasing market recognition of its products. Several semiconductor products have successfully transitioned from R&D samples to mass production, and the company has now actively integrated into key customers’ R&D and production lines, securing significant scale in cooperation. Customer feedback in downstream markets has been positive, with expanded collaboration on new product development.
The domestic semiconductor industry is undergoing a major upgrade, and Maolai Optics is playing an increasingly vital role in this transformation by supporting independent innovation and supply chain resilience. The company’s semiconductor products are now in high demand both domestically driven by the national push for substitution and internationally, with sustained overseas market interest. Its deep involvement in cutting-edge semiconductor applications positions it as a key player in advancing China's domestic semiconductor ecosystem through technology-driven solutions.
"GaN on Silicon Epitaxial Wafers for HEMT Power Devices" Standard Released
Led by Suzhou Jingzhan Semiconductor Co., Ltd. and following the CASAS standard-setting process, after discussions in the standard drafting group meeting, extensive solicitation of opinions, and committee draft voting, the group standard T/CASAS 060-2024 "GaN epitaxial wafers on silicon substrates for HEMT power devices" was officially released to the industry on August 29, 2025.
T/CASAS 060-2024, "Gallium Nitride Epitaxial Wafers on Silicon Substrates for HEMT Power Devices," specifies the classification, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of GaN epitaxial wafers on silicon substrates for HEMT power devices. It applies to the research, development, production, testing, analysis, and quality evaluation of composite-structure GaN epitaxial wafers grown on silicon substrates for use in power electronics.
Main drafting units of this document:
Suzhou Jingzhan Semiconductor Co., Ltd., Beijing Zhongboxin Semiconductor Technology Co., Ltd., Xiamen San'an Integrated Circuit Co., Ltd., Sun Yat-sen University, Institute of Semiconductors, Chinese Academy of Sciences, Fifth Institute of Electronics, Ministry of Industry and Information Technology, Peking University Dongguan Institute of Optoelectronics, Guangdong University of Technology, Dalian University of Technology, Zhuhai Gallium Future Technology Co., Ltd., Institute of Microelectronics, Chinese Academy of Sciences, Xinlian Integrated Circuit Manufacturing Co., Ltd., and Beijing Third Generation Semiconductor Industry Technology Innovation Strategic Alliance.
Huawei seems to have no chip shortage issue anymore. Even Mate TV and MiniPad will use Kirin 9 series of chips. I hear it's going to be 9020, so only the new Mate phones will have newer chip than that.
again, the yield and capacity on N+2 process seems to be pretty decent now. N+3 likely is still limited as they get better at producing it.
it's not that they didn't write the complete story. It's that their sources on the ground only knows so much. The OpSec on this is off the chart. Tencent reported well over a year ago that it had domestic options for AI chips and they were not talking about Huawei.
again, the yield and capacity on N+2 process seems to be pretty decent now. N+3 likely is still limited as they get better at producing it.
it's not that they didn't write the complete story. It's that their sources on the ground only knows so much. The OpSec on this is off the chart. Tencent reported well over a year ago that it had domestic options for AI chips and they were not talking about Huawei.
