GCIB (gas cluster ion beam) polishing for EUV optics. GCIB is an emerging next-gen polishing tech that may replace CMP. TEL recently introduced the first GCIB tool for corrective etching, which could reduce EUV double patterning to single patterning
this is really curious. Especially the part about CETC putting it on its GaN devices. I'm sure Huawei also will use it in stuff other than "cooling". After all, diamond substrate is very useful in any kind of high power RF applications.Large size Single crystal Diamond substrate from HIT successfully used in CETC GaN on Diamond and HW cooling applications
SmartSens is partially owned by Huawei, so they have first dibs and most likely exclusivity on new sensors. The SC595XS will most likely be the main sensor on the Mate 80 Pro+ and the telephoto sensor on the Pura 90 Ultra, replacing the SC585XS. The SC5A5XS will most likely be the main sensor on the Pura 90 Ultra, replacing the SC5A0CS. The new sensors are pretty much the same as the old ones except with a newer process (22 nm vs. 28 nm) and higher dynamic range.More on the smartsens CMOS
22nm domestic production line (that's important). So either SMIC or HH I guess. They have even more impressive SC5A5XS coming up.
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lol they might as well state 28nm, who knowsAt this Zhihu posts,someone says that the next generation Ascend chip will use 12nm instead of 7nm