You forget the 3rd, Huawei, they are secretly making their own chip, at what node level is anybody guess but certainly at 14nm and below.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
TSDSEMI Diamond Wafer Polishing Equipment
Beijing TSD Semiconductor Equipment Co., Ltd. focuses on the research, development, production and sales of ultra-precision planar processing equipment in the semiconductor field. With the mission of "leading the advancement of semiconductor technology and helping customers develop", the company is committed to becoming a global technology-leading semiconductor equipment manufacturer. Deeply cultivating ultra-precision planar processing technology in the fields of semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, MEMS, etc., it has formed core technological advantages of leading technology, superior performance and stable process, and can provide customers with system solutions and process equipment for thinning, polishing and chemical mechanical planarization (CMP).
Recently, diamond materials have attracted much attention due to their unique properties, especially in the diamond substrate processing link, where the grinding and polishing problems are particularly prominent. With its profound technical accumulation and innovation capabilities, Tesidi has successfully developed a diamond polishing machine, effectively solving this problem.
Diamond polishing equipment has attracted much attention for its excellent efficiency, precision and stability. The equipment adopts advanced grinding and polishing technology and can easily cope with the processing needs of diamonds of different sizes from 2 to 6 inches. In the polishing process of polycrystalline diamond sheets, after processing, the TTV (total thickness variation) can be ≤5um and Ra (surface roughness) ≤1nm, which fully meets the requirements of high-precision processing.
Recently, diamond materials have attracted much attention due to their unique properties, especially in the diamond substrate processing link, where the grinding and polishing problems are particularly prominent. With its profound technical accumulation and innovation capabilities, Tesidi has successfully developed a diamond polishing machine, effectively solving this problem.
Diamond polishing equipment has attracted much attention for its excellent efficiency, precision and stability. The equipment adopts advanced grinding and polishing technology and can easily cope with the processing needs of diamonds of different sizes from 2 to 6 inches. In the polishing process of polycrystalline diamond sheets, after processing, the TTV (total thickness variation) can be ≤5um and Ra (surface roughness) ≤1nm, which fully meets the requirements of high-precision processing.
Zhanxin Electronics launches 1200V SiC half-bridge 1B package module to facilitate high-frequency and high-efficiency applications
Zhanxin Electronics launched the 1B packaged 1200V 9mΩ silicon carbide (SiC) half-bridge power module (IV1B12009HA2L), which provides efficient and low-cost solutions for photovoltaic, energy storage and charging pile applications. The product has passed industrial-grade reliability testing.
The size of this module product (IV1B12009HA2L) is the same as the standard Easy 1B package, and its shell is compact with a height of only 12mm. The internal chip of the module is arranged on a ceramic copper-clad substrate (DCB), which has an internal insulation function and can be directly attached to the heat sink without the need for an external ceramic insulating gasket. It is safe and reliable, and has better heat dissipation. At the same time, the module adopts a spring mounting seat, which is easy to assemble, and the integrated mounting clip makes the installation firm.
Module circuit topology
The module product has a built-in 1200V 9mΩ SiC MOSFET chip to form a half-bridge circuit, which has low stray inductance, simplifies the design of the application circuit, and improves the power density compared to discrete device solutions. At the same time, it integrates a thermistor (NTC) to monitor the temperature.
This product has a Kelvin source pin, which can suppress the driving voltage spike when the SiC MOSFET switches at high speed, ensuring the safety and reliability of high-frequency switching applications.
SiC MOSFET Chip
This module uses Zhanxin Electronics' second-generation planar gate 1200V SiC MOSFET chip, which has good performance and reliability, supports +15V to +18V turn-on voltage and -3.5V to -2V turn-off voltage, and has a rated current of 100A.
The size of this module product (IV1B12009HA2L) is the same as the standard Easy 1B package, and its shell is compact with a height of only 12mm. The internal chip of the module is arranged on a ceramic copper-clad substrate (DCB), which has an internal insulation function and can be directly attached to the heat sink without the need for an external ceramic insulating gasket. It is safe and reliable, and has better heat dissipation. At the same time, the module adopts a spring mounting seat, which is easy to assemble, and the integrated mounting clip makes the installation firm.
Module circuit topology
The module product has a built-in 1200V 9mΩ SiC MOSFET chip to form a half-bridge circuit, which has low stray inductance, simplifies the design of the application circuit, and improves the power density compared to discrete device solutions. At the same time, it integrates a thermistor (NTC) to monitor the temperature.
This product has a Kelvin source pin, which can suppress the driving voltage spike when the SiC MOSFET switches at high speed, ensuring the safety and reliability of high-frequency switching applications.
SiC MOSFET Chip
This module uses Zhanxin Electronics' second-generation planar gate 1200V SiC MOSFET chip, which has good performance and reliability, supports +15V to +18V turn-on voltage and -3.5V to -2V turn-off voltage, and has a rated current of 100A.
With an investment of 600 million yuan, Huaxian Optoelectronics' commercial vehicle intelligent cockpit project will be completed in July!
Huaxian Optoelectronics launched the commercial vehicle smart cockpit project last year. The project has an investment of 600 million yuan and covers an area of about 17 acres. It mainly provides smart cockpit solutions for commercial vehicles. After the project reaches full production, the production capacity will be 1 million sets of LCD screens, human-computer interaction systems, commercial vehicle cockpit systems and other products, and the output value will exceed 700 million yuan.
A few days ago, the reporter walked into the project construction site, where workers were already conducting static load tests on the project's pile foundation. "At present, the pile foundation engineering part of the project has been completed, and the main factory building construction period is about to begin. The entire project will be completed in July and put into production around November." Zhang Jiahao, head of the smart cockpit project of Kunshan Huaxian Optoelectronics Technology Co., Ltd., told reporters.
Kunshan Huaxian Optoelectronics Technology Co., Ltd. was established in 2015. It focuses on providing smart cockpit solutions for the global market. It is a high-tech enterprise specializing in the automotive original equipment market, providing research and development, production, sales and services for in-vehicle smart cockpit software and hardware. As the automotive industry is rapidly moving towards a new round of competition dominated by intelligence, intelligence is not only the focus of attention in the passenger car field, but the commercial vehicle industry is also actively working to accelerate the development of intelligent driving. In order to further seize this new track, Huaxian Optoelectronics launched the commercial vehicle smart cockpit project last year. The project has an investment of 600 million yuan and covers an area of about 17 acres. It mainly provides smart cockpit solutions for commercial vehicles. After the project reaches full production, the production capacity will be 1 million sets of LCD screens, human-computer interaction systems, commercial vehicle cockpit systems and other products, and the output value will exceed 700 million yuan.
this is literally not true.
From the CEO of AMEC himself:
"it is wrong to say that there's a 5 nm etcher, 3 nm etcher, or 14 nm etcher. Actually it is the same design with a few changes that can do everything from 45 nm to 2 nm."
I've even pointed this out before as early as 2022:
I'm very much aware of that Interview. But I think my point is still valid. If you recall, China already domesticated 28nm everything (except for lithography) as early as 2022-2023. But even in late 2024 we were seeing huge revenue surge from AMAT, LAM, TEL towards China. If it was so easy to go from 28nm to say 5nm, why bother giving revenue to your adversary and go through so many hurdles to get the equipments via Singapore etc etc right?
So, is KingSemi no more or will it continue as a subsidiary of Naura?
At first I think was panic buying and stockpiling due the uncertainty of the idea of being completely cut off in 2021 and 2022 that created a gigantic backlog of tools. The issue is that the sentiment in the industry in 2020 was extremely pessimistic, the views of like those of "Leslie" Wu was the norm. That has changed a bit as Domestic equipment makers increase production capacity, as more new semiconductor equipments are announced and more tools fill the niches that was exclusive of US tools in YMTC and SMIC, "If is good for SMIC is good for us".
It takes a few years for Chinese equipment makers to ramp up production?
Just to add a bit more exposition here, a lot of people don’t understand that lithography is defined around resolution because that’s the physical characteristic the equipment manipulates and does work on. Etch and deposition processes aren’t defined around resolution because they don’t manipulate that physical characteristic. Evenness and homogeneity of thermo-chemical kinetics over a total area or volume is what defines their performance attributes so that’s what their performance is defined around. Work on different physical mechanisms and characteristics means performance is defined around different parameters. Defining performance of etch and deposition equipment in resolution terms is like trying to define tire performance in the same parameters as thermodynamic efficiency of the motor just because they both are involved in making cars move.
Just because the domestic alternatives have the same capabilities doesn’t mean they can necessarily scale production on a dime.
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