By looking at the original chart from Morgan Stanley you can easily tell these are just bogus numbers made up by them. They put yield of 910B wafers at 30% and 910C wafers at 5%. If it were based on any real data 910C wafers would have the same yield as 910B because 910C is not a monolithic chip. It's just two 910B dies packaged together.
Chinese semiconductor thread II
- Thread starter vincent
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By looking at the original chart from Morgan Stanley you can easily tell these are just bogus numbers made up by them. They put yield of 910B wafers at 30% and 910C wafers at 5%. If it were based on any real data 910C wafers would have the same yield as 910B because 910C is not a monolithic chip. It's just two 910B dies packaged together.
It is the butterfly effect brother ansy1968.
Some random action somewhere else, would cause a disturbance in another part of the world.
That is chaos theory and I believe in that very much.
Put those illegal South Koreans in chains while being arrested, (allegedly still innocent under the law, but guilty under Trump presidency), then we see the fallout happens somewhere else.
It is getting close to a breaking point. Some people cannot take it anymore!
I wonder how much of the other reports from American media have bogus numbers pulled out of someone's ass....
The Morgan Stanley report is based on bogus assumptions. Intel and TSMC also had DUV only 7nm processes and their yield was not 30%. Intel is still selling Raptor Lake processors made with it. It is just cope and maybe even an attempt to tank the SMIC stock.
This one's a big miss. Dylan Patel is back to his old talking points again. It's the same one-weird-export control that keeps being brought up.
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I read through this stuff.
There is some good stuff there, but I think a lot of his AI related stuff are just horribly misguided.
I think everyone has now arrived at the conclusion that China's 7nm capacity is expanding quite a bit, because it's there for all to see. You can't really deny it anymore.
the problem with this is that Morgan Stanley doesn't seem to understand yield for die depends on die size. So, TSMC's 90% yield for 5nm process isn't going to be 90% for a 800 mm^2 AI die (I don't recall the size of 910B/C die, so just putting 800 here).
30-40% yield on AI chip is not end of the world. you get 30 die per wafer instead of 60 die. With 10k wpm, you still get 150k 910C per month or 1.8m a year. Again, China is swimming in AI chips. If you cannot arrive at this conclusion, then you are pretty stupid.
ACM Shanghai successfully delivers its first high-yield Ultra LITH KrF unit to a leading Chinese logic wafer fab! Front-end Track expansion continues
ACM Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "ACM Shanghai") announced the launch of the Ultra LITH KrF, its first independently developed high-throughput KrF front-end coating and development (Track) tool , and announced that the tool was successfully delivered to a leading Chinese logic customer in September! The launch of the high-throughput Ultra LITH KrF is a key step for ACM Shanghai in the field of front-end lithography equipment, marking a further expansion of the company's lithography Track product portfolio.
The Ultra LITH KrF photolithography system, feature a proprietary vertical, cross-shaped architecture (globally patented), which offers three key advantages:
-High Throughput: Reduces robot travel distance and improves transfer efficiency, achieving over 300 wafers per hour (WPH).
-Advanced Technology: Optimized airflow minimizes particle contamination; independent cavity exhaust ensures better photoresist uniformity.
-High Reliability & Stability: Equipped with a proprietary electronic control system and AI-driven AOI monitoring for real-time anomaly detection and process stability.
The Ultra LITH KrF system includes:
-12 spin-coating and 12 developing chambers (12C12D)
-54 temperature-controlled hotplates
-Integrated backside particle removal (BPRV) and wafer-level outlier detection (WSOI)
-Production capacity exceeding 300 WPH
This marks a major milestone for Shengmei Shanghai, completing its full product coverage from ArF to KrF in the photolithography process, strengthening its position in mature node manufacturing. The ArF system had already passed customer verification by end-2024.
Additionally:
- A high-output 400WPH KrF Track system is under development and expected for launch in 2026.
- Shengmei Shanghai’s Track equipment (resist coating/development) plays a critical role in wafer manufacturing, directly impacting yield and precision—especially as advanced processes demand tighter linewidth control.
"KrF remains vital for mature process lines. With our fully self-supplied robot system and proprietary controls, we deliver high precision, stability, and scalability—enabling seamless fab integration and broader manufacturing flexibility."
This development represents a major step toward self-reliance in China’s semiconductor front-end equipment, with ACM Shanghai poised to capture a stronger global share in the Track lithography market.
Is quite interesting that now days the loudest voices in a 600+ billion dollar industry is people who have never worked a single day on it.