Chinese semiconductor thread II

[tokenanalyst]

The world's first ultra-wide bandgap semiconductor high-frequency filter chip production line is in the process of trial production​

According to the "Shanghang Rong Media" public account, the overall architectural image of the second phase project of Fujian Jingxu Semiconductor Technology Co., Ltd. - a high-frequency filter chip production project based on gallium oxide piezoelectric film new materials has recently emerged.

According to the relevant person in charge, the civil engineering and the main body of the whole project have been completed, and the construction of the rainwater and sewage pipe network and the road surface has begun. The interior decoration has entered the fine decoration project, the construction of the power station room, and the decoration project of the Jingxu factory are expected to complete the initial trial production in September.

It is understood that the total investment of the project is 1.68 billion yuan, and the construction of an industrial plant area of 136 mu will build the world's first ultra-wide bandgap semiconductor high-frequency filter chip production line. The first batch of production lines will achieve an annual production capacity of 400kk, and the company's output value will be about 1 billion yuan. After completion, it will not only fill the gap in the field of new materials of gallium oxide piezoelectric thin films in China, but also play an important role in promoting the development of new materials industry in Shanghang County.

Fujian Jingxu Semiconductor Technology Co., Ltd. is a high-tech enterprise with independent intellectual property rights, focusing on high-frequency acoustic wave filter wafers and chip materials for 5G communications. The technical team has been researching the preparation of 5G acoustic wave filters since 2005, and has more than 100 patents for optoelectronic integrated chips and compound single crystal thin film materials. In particular, it is in an international leading position in the preparation technology of piezoelectric thin film material chips for RF filters, the core device of 5G.

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[tokenanalyst]

OFILM participates in supplying multiple camera modules for Huawei's Pura 80 series​

According to supply chain sources, OFILM is involved in the supply of multiple camera modules for Huawei's Pura 80 series, among which the main camera modules of different models are exclusively supplied by OFILM.

In the smartphone business, OFILM is a mainstream supplier of high-pixel camera modules and mid-to-high-end camera products in the industry; a variety of optical lens products have entered the lens supply chain of mainstream domestic mobile phone manufacturers; and both optical under-screen fingerprint recognition modules and ultrasonic under-screen fingerprint recognition modules are in a leading position.

O-Film's independently developed innovative solutions such as 7P optical lens module and variable aperture technology have significantly improved the imaging performance and differentiated competitiveness of the flagship models of the partner brands. In addition, O-Film occupies a leading position in the field of biometric technology. Its optical under-screen fingerprint recognition module and ultrasonic under-screen fingerprint recognition module have become standard solutions for high-end models due to their high precision and strong environmental adaptability.

Based on long-term strategic cooperation with customers, OFILM continues to promote technology iteration and capacity adaptation. In recent years, the company has achieved breakthroughs in core technologies such as cameras and fingerprint recognition by integrating global R&D resources and increasing R&D investment, and has successfully expanded its business to emerging fields such as folding screens and smart cars. At present, the company has formed a diversified product matrix covering smartphones, smart cars and IoT devices, further consolidating its market competitiveness.

OFILM stated on the investor interaction platform that all product lines of the company are in orderly production and are preparing and supplying goods in a timely manner according to customer order expectations. The company will continue to improve its management level, integrate and optimize resource allocation, and adjust production plans in a timely manner according to business layout and actual order conditions. The company has established long-term, stable and in-depth cooperative relationships with many mobile phone brand customers.

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[tokenanalyst]

 

[tokenanalyst]

Trinuclear Tin Complexes for Advanced Lithography: Sensitivity Enhancement via the Synergistic Effect in Dual Cross-Linking Systems.​

​

Abstract​

Balancing nanoscale pattern fidelity with high sensitivity remains a key challenge in extreme ultraviolet (EUV) lithography applications. Trinuclear tin complexes (organotin-based trinuclear macrocyclic complexes) have been shown to exhibit nanoscale pattern fidelity and demonstrate significant potential in enhancing sensitivity and reducing roughness caused by photon shot noise. This study investigates first how organic groups affect trinuclear tin complex photoresist sensitivity by investigating four trinuclear tin complexes with varying groups, and complex Vi-Sn-Oc {[{(nOc)2Sn(5-Vi-1,3-bdc)}3], (5-Vi-1,3-bdc = 5-vinyl-1,3-benzenedicarboxylate)} with C═C bonds and long alkyl groups exhibits excellent sensitivity (D0 = 23 μC/cm2) and high-resolution patterning performance in electron beam lithography (periodic lines of 16 nm and grid patterns of 13 nm) and EUV lithography (periodic lines of 20 nm). This confirms that trinuclear tin complexes can achieve nanoscale pattern fidelity at high sensitivity. Mechanistic studies on radiation exposure explain the solubility changes before and after exposure and the extremely high sensitivity of Vi-Sn-Oc. Specifically, the sensitivity enhancement of Vi-Sn-Oc arises from the synergistic effect in dual cross-linking systems, which includes Sn-X-Sn (X = O/alkylene) cross-linking at the Sn centers and C═C cross-linking at the C═C bonds. This novel synergistic mechanism may provide insights into the advancement of high-sensitivity, high-resolution tin-oxide EUV photoresists.​

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[interestedseal]

do you know how well this compared to the one that Huawei/Hisilicon came out a while ago?

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Seems different in their purpose.

This is a 12 bit 16000 MSPS ADC. The Hisilicon ADC with a different architecture (SAR) is 24 bit 2 MSPS. Essentially lower resolution higher speed versus higher resolution but much lower speed. There’s always a trade off between precision and speed for ADCs. However there’s credibly rumor that Hisilicon has developed even faster 12bit ADC but simply doesn’t sell it to outside customers

 

[tphuang]

OFILM participates in supplying multiple camera modules for Huawei's Pura 80 series​

According to supply chain sources, OFILM is involved in the supply of multiple camera modules for Huawei's Pura 80 series, among which the main camera modules of different models are exclusively supplied by OFILM.

In the smartphone business, OFILM is a mainstream supplier of high-pixel camera modules and mid-to-high-end camera products in the industry; a variety of optical lens products have entered the lens supply chain of mainstream domestic mobile phone manufacturers; and both optical under-screen fingerprint recognition modules and ultrasonic under-screen fingerprint recognition modules are in a leading position.

O-Film's independently developed innovative solutions such as 7P optical lens module and variable aperture technology have significantly improved the imaging performance and differentiated competitiveness of the flagship models of the partner brands. In addition, O-Film occupies a leading position in the field of biometric technology. Its optical under-screen fingerprint recognition module and ultrasonic under-screen fingerprint recognition module have become standard solutions for high-end models due to their high precision and strong environmental adaptability.

Based on long-term strategic cooperation with customers, OFILM continues to promote technology iteration and capacity adaptation. In recent years, the company has achieved breakthroughs in core technologies such as cameras and fingerprint recognition by integrating global R&D resources and increasing R&D investment, and has successfully expanded its business to emerging fields such as folding screens and smart cars. At present, the company has formed a diversified product matrix covering smartphones, smart cars and IoT devices, further consolidating its market competitiveness.

OFILM stated on the investor interaction platform that all product lines of the company are in orderly production and are preparing and supplying goods in a timely manner according to customer order expectations. The company will continue to improve its management level, integrate and optimize resource allocation, and adjust production plans in a timely manner according to business layout and actual order conditions. The company has established long-term, stable and in-depth cooperative relationships with many mobile phone brand customers.

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btw, oFilm has always been the camera module supplier for Huawei.

The world's first ultra-wide bandgap semiconductor high-frequency filter chip production line is in the process of trial production​

According to the "Shanghang Rong Media" public account, the overall architectural image of the second phase project of Fujian Jingxu Semiconductor Technology Co., Ltd. - a high-frequency filter chip production project based on gallium oxide piezoelectric film new materials has recently emerged.

According to the relevant person in charge, the civil engineering and the main body of the whole project have been completed, and the construction of the rainwater and sewage pipe network and the road surface has begun. The interior decoration has entered the fine decoration project, the construction of the power station room, and the decoration project of the Jingxu factory are expected to complete the initial trial production in September.

It is understood that the total investment of the project is 1.68 billion yuan, and the construction of an industrial plant area of 136 mu will build the world's first ultra-wide bandgap semiconductor high-frequency filter chip production line. The first batch of production lines will achieve an annual production capacity of 400kk, and the company's output value will be about 1 billion yuan. After completion, it will not only fill the gap in the field of new materials of gallium oxide piezoelectric thin films in China, but also play an important role in promoting the development of new materials industry in Shanghang County.

Fujian Jingxu Semiconductor Technology Co., Ltd. is a high-tech enterprise with independent intellectual property rights, focusing on high-frequency acoustic wave filter wafers and chip materials for 5G communications. The technical team has been researching the preparation of 5G acoustic wave filters since 2005, and has more than 100 patents for optoelectronic integrated chips and compound single crystal thin film materials. In particular, it is in an international leading position in the preparation technology of piezoelectric thin film material chips for RF filters, the core device of 5G.

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This is actually pretty cool. GaO RF filters. I have honestly never heard of this. But they are saying 400 million filters a year, which is enough for probably 10 to 20 million 5G phones a year. That's not bad for a company I have never heard of.

 

[tokenanalyst]

This is actually pretty cool. GaO RF filters. I have honestly never heard of this. But they are saying 400 million filters a year, which is enough for probably 10 to 20 million 5G phones a year. That's not bad for a company I have never heard of.

Try to find their website but look like is not up yet.

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[tokenanalyst]

SMIC's market share is rapidly approaching Samsung Electronics as it grows against the trend​

The global semiconductor foundry market is undergoing significant changes. According to the latest report from market research firm TrendForce, the total revenue of the world's top ten foundry companies in the first quarter of 2025 was US$36.43 billion, a 5.4% decrease from US$38.48 billion in the previous quarter, mainly due to the seasonal market off-season.

In this market structure, TSMC still maintains an absolute leading position. Although its revenue fell 5% from the previous quarter to US$25.517 billion, its market share rose by 0.5 percentage points to 67.6%. This further widened the market share gap between TSMC and the second-place Samsung Electronics to 59.9 percentage points, consolidating its dominant position in the global foundry market.

At the same time, Samsung Electronics faces severe challenges. In the first quarter of 2025, Samsung Electronics' revenue fell sharply by 11.3% to US$2.893 billion, and its market share dropped from 8.1% to 7.7%. TrendForce analysis believes that Samsung's market share decline is mainly due to its limited benefits from China's consumer subsidies, coupled with the US's restrictions on advanced process nodes, which weakened its competitiveness in the global market.

The most eye-catching is the performance of SMIC. As the world's third largest wafer foundry, SMIC achieved a revenue growth of 1.8% in the first quarter of 2025, reaching US$2.247 billion, becoming the only company among the top three companies to achieve revenue growth. Its market share increased from 5.5% to 6%, and the gap with Samsung Electronics narrowed rapidly from 2.6 percentage points to 1.7 percentage points, posing a substantial threat to Samsung's second place position.

Analysts attributed SMIC's growth to its strategy of building up inventory in advance in response to U.S. tariffs and taking advantage of domestic subsidy policies, which enabled it to achieve counter-cyclical growth amid an overall market slowdown.
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NOO. It has been the clownish stooge sponsored ever increasing US export controls and US sanctions since 2019 that has make more and more Chinese companies to secure their chip supply with SMIC rather than in the past with foreign fabs like TSMC, UMC and Samsung. My guest these Analysts are basically lying by omission to avoid saying "We were totally wrong ".

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[tphuang]

https://twitter.com/i/web/status/1933163091308474613

Espressif has unveiled ESP32-C61 SoC on RISC-V core. Again, they are a huge player here, basically de facto industry standard w/ ESP32.

 

[tokenanalyst]

Zhongke Haixin RISC-V chip R&D and industrialization project signed in Wuxi​

According to the official Weibo of HiSilicon, the signing ceremony of HiSilicon's RISC-V chip research and development and industrialization project was successfully held in Beijing recently at the Industrial Chip Valley Industrial Park in Xishan District, Wuxi City.

The successful signing of this agreement is a key measure for Sino-Tech HiSilicon to deepen its strategic layout in the Yangtze River Delta, and also lays a solid foundation for the successful implementation of the project in the Xishan "Industrial Chip Valley" Industrial Park. Sino-Tech HiSilicon will take this signing as a new starting point, and with the strong support of Xishan District, accelerate the preparation and implementation of the project, deepen technological innovation and industrial integration, and work with Xishan to jointly promote the early completion of the project and contribute to the prosperity of China's RISC-V open source chip ecosystem.

In February this year, Sinochip announced the completion of nearly 100 million yuan in Series A financing, which was jointly supported by Qingdao Haifa Group, Wuxi New Clean Energy Co., Ltd. and other industrial capitals. The funds will be used to deepen the innovation of RISC-V chip basic technology, accelerate the mass production of commercial vehicle-grade chips and the upgrade and development of commercial vehicle-grade chips, and further consolidate the company's leading position in the field of end-side and edge AI computing power. At the same time, consolidate and expand the wider commercial application of RISC-V chips in the open source chip industry.
It is understood that Zhongke HiSilicon focuses on the independent control and scenario-based innovation of RISC-V technology. The core team is composed of senior experts from top institutions and enterprises such as the Institute of Computing Technology of the Chinese Academy of Sciences, with more than 20 years of experience in chip research and development. It has jointly established the "RISC-V Automotive Regulation Joint Laboratory" with the National New Energy Vehicle Innovation Center and the Beijing Open Source Chip Research Institute to promote the formulation of industry standards and the improvement of the quality certification system.

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