Chinese semiconductor thread II

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GiantPanda

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doggydogdo said:
Once they catch up in EUV it would be over for rest of the world. China has the supply chain to scale up rapidly and outcompete foreign competitors. I would say with in 10 years
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We'll look back sometimes in the future and realize that EUV wasn't even the key. Yes, it is a key component in the tail end of the silicon era.

But the long game is who dominates chips in the era post-silicon -- graphene, SiC, 2-D materials, etc. all of which China has a leading position in.

This would be like EVs overtaking ICE.
 
H

huemens

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Techinsights seems to confirm that the x90 is a 5nm chip. It is not clear if they are just repeating what was announced on the Chinese TV last week or they have more info to support this.
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It's just a blog post based off of the news. They haven't done teardown yet. The laptops haven't been shipped yet. They go on sale on 6th June.
 
T

tokenanalyst

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Chinese scientists innovate "warm processing" technology to prepare high-performance semiconductor films​

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In the field of semiconductor technology, the research team of the Shanghai Institute of Ceramics, Chinese Academy of Sciences, has recently made important progress. In collaboration with experts from Shanghai Jiao Tong University, they successfully prepared high-performance semiconductor films using a new method called "warm processing". This research result has been published in the internationally renowned journal Nature Materials.
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The research team found that a special type of brittle semiconductor exhibits good plastic deformation and processing capabilities at a temperature of 500K, breaking the limitation that traditional semiconductor materials are difficult to process at room temperature. By establishing a temperature-dependent plastic physics model, the researchers achieved a plastic processing process similar to that of metals, providing new ideas for the manufacturing technology of inorganic semiconductors.

Semiconductor materials have attracted much attention due to their rich adjustable functional properties, but the high processing cost and complex process at room temperature limit their application. The research team's findings show that some narrow-bandgap inorganic semiconductors can be effectively plastically processed by rolling, flat-plate pressing and extrusion at conditions slightly above room temperature, and the processed materials retain excellent physical properties.

Experimental results show that the warm processing method has significant advantages in manufacturing high-quality semiconductor films. It can avoid the limitations and additional costs brought by the substrate and freely adjust the film thickness in the range of micrometers to millimeters. The film has good crystallinity and uniform element distribution, inheriting the excellent properties of the bulk material. Microstructural analysis shows that plastic deformation is mainly caused by grain reorganization and lattice torsion distortion.

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huemens

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Chinese EDA firm offers free access amid US chip software restrictions​

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In response to recent US restrictions cutting off Chinese semiconductor firms from advanced chip design tools, Shanghai-based UniVista Industrial Software Group announced it will offer free trials and evaluations of its critical electronic design automation or EDA tools to domestic users. This move aims to alleviate mounting challenges facing China's chip industry.
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UniVista said it is China's only domestic EDA provider capable of fully supporting the entire digital chip verification flow while supplying high-speed interconnect IP for advanced process nodes. Its portfolio spans digital EDA tools, system-level solutions, and high-end IP.
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With over 200 clients—including most major Chinese high-end chip designers—UniVista emphasizes its proven expertise in supporting complex, large-scale digital chip projects. The company's tools have undergone rigorous refinement through real-world applications, backed by what it describes as a "highly capable" technical support team.
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T

tokenanalyst

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Yongsi Electronics: 2.5D advanced packaging is actively conducting product verification with customers​


Recently, Yongsi Electronics stated in an institutional survey that the company's 2.5D packaging has been completed and put into production in the fourth quarter of 2024, and is currently actively conducting product verification with customers.

In addition, the utilization rate of the company's wafer-level packaging and testing has continued to increase, and the gross profit margin has improved quarter by quarter. Looking forward to the second half of the year, with the introduction of related products from major customers, the utilization rate is expected to increase, promoting the gross profit margin to turn positive. The company will continue to grow and gradually reduce the impact of depreciation through economies of scale. On the other hand, the company actively optimizes its product structure, strives to improve the utilization rate of wafer-level products, and gives priority to products with higher gross profit margins to promote the positive development of gross profit margins.

From the perspective of utilization rate performance, there were Spring Festival holiday impacts and seasonal fluctuations in Q1 2025, but the company's downstream demand was strong, and revenue increased by about 30% year-on-year. The utilization rate continued to rise in Q2, the utilization rate of mature product lines was full, and downstream demand was strong.

In terms of business structure, the company's core IoT customer competitiveness continues to increase. The IoT field contributes approximately 70% of the company's revenue, and its market share gradually increases. The company grows together with its customers. In addition, the IoT field is currently in an "innovation-driven" cycle, and the penetration rate of new application scenarios driven by AI is increasing, and downstream demand is growing steadily.

In terms of capital expenditure planning for 2025, the company has reviewed the scale of capital expenditure for 2025 to be within RMB 2.5 billion, which remains stable compared to 2024. The main investments include capacity expansion of existing product lines, wafer-level packaging, and advanced packaging fields such as 2.5D and FC-BGA.

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tokenanalyst

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Haina Semiconductor Polishing Wafer Project Completion Acceptance​


According to the official WeChat account of Pujiang Industrial Investment Group, the Haina Semiconductor large-diameter silicon single crystal polishing wafer project implemented by Pujiang County Industrial Investment Group has successfully completed the final acceptance and is ready for production.

It is reported that the project covers an area of 108 mu, with a building area of 30,311.5 square meters and a total construction area of 120,782.81 square meters. It mainly constructs FAB plants, power stations, Class A warehouses, wastewater stations, dormitory buildings, guardhouses and other units. After completion, the project will be committed to the research and development and production of semiconductor silicon materials. It is expected that when the full production period is reached, it will have an annual production capacity of about 4 million 8-inch polished silicon wafers for integrated circuits, laying a solid foundation for the future development of Pujiang's integrated circuit industry.

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tokenanalyst

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Chengdu Ultrapure starts listing guidance​

On May 30, the official website of the China Securities Regulatory Commission disclosed the filing report on the initial public offering and listing guidance of Chengdu Ultrapure Applied Materials Co., Ltd. (hereinafter referred to as "Chengdu Ultrapure"). On May 26, 2025, the company signed a listing guidance agreement with Huatai United Securities, officially opening the curtain on the preparations for the A-share IPO.
Chengdu Ultrapure was founded in 2005 and is located in Shuangliu Airport Development Zone, Chengdu, China. It is a national high-tech manufacturing enterprise of semiconductor etching devices, high-power laser devices and special ceramics with technology as the guide. Taking the core components of semiconductor equipment as the starting point, it focuses on the research and development and manufacturing of core components of key equipment such as etching, film formation, diffusion, and epitaxy. The company's technology covers the etching-resistant film technology of inductively coupled plasma etching equipment and capacitively coupled plasma etching equipment, which are essential for the second and third generation semiconductors, and the etching-resistant film technology of vapor-deposited silicon carbide CVD-SiC material technology, vacuum deposition theory, thermal field analysis, precision machining, precision detection and precision mechanical structure design, and other complex cross-fields, and has accumulated a lot of design and manufacturing experience.
Chengdu Ultrapure has a research and development and plant area of more than 10,000 square meters. It has independent intellectual property rights and has developed a variety of processes, including advanced surface treatment processes, which can provide professional surface treatment services for semiconductor etching devices and MOCVD devices; purification processes, which can purify the purity of materials to more than 5N; advanced ceramic production processes, which can manufacture high-density carbide and nitride ceramics; At the same time, the company has developed a complete set of ultra-smooth surface treatment processes for different substrate materials to control surface defects and increase the service life of the device. The company's products cover semiconductor etching devices, semiconductor annealing devices, semiconductor epitaxial diffusion devices, MOCVD devices, high-power laser/lithography devices, etc.

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