At least with immersion lithography most of the new patents that are coming out are ancillary equipment, parts and upgrades, no core parts of the machine. That is one of the reasons I said that they have been running these machines in domestic fabrication lines for the last few years at least, debugging them and solving yield issues with them. These immersion machines have gone from 45nm <the goal of the project in 2017> to 28nm <the upgraded goal in 2020> to 7nm <to match SMEE overlay metrology tools> along with their dry I-Line, KrF, ArF counterpart.
Chinese semiconductor thread II
- Thread starter vincent
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Makes you wonder if they're learning anything in the DUVi NPI process that's informing current developments of the EUV instrument.
Paul Triolo is definitely one of the better ones
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He has good sources.
@DrewPavlou found another closet Wumao for you to cancel.
Paul Triolo , or US side focused only on logic and memory, advanced or mature. Thats highly unbalanced.
What about Si, SiC, GaN IGBT fabs for EV car and High speed rail, and charging. LED and display fabs , photonics, GaN for radar, and power amplifiers. LiDars. Those are huge volumes.
THey are all parts of the greater picture
What about Si, SiC, GaN IGBT fabs for EV car and High speed rail, and charging. LED and display fabs , photonics, GaN for radar, and power amplifiers. LiDars. Those are huge volumes.
THey are all parts of the greater picture
there's tons they forgot, like MCU, graphics drivers, motor drivers, modems, sensors, etc. The industry is huge and every part can be chipped away at. This will be bad for the companies previously dominant in this sector like TI, Renesas and Infineon.
The Peking University School of Integrated Circuits/Integrated Circuit Advanced Center team has made important progress in research on frequency generation and mixing of wireless IoT based on memristor arrays
Wireless Internet of Things (WIoT) has received increasing attention in various applications such as smart factories, smart homes, and security monitoring. Compared with traditional networks, WIoT requires no cables or physical connections, is easy to set up, and reduces the need for manual intervention, helping to greatly increase productivity, reduce costs, and improve user satisfaction. Modern WIoT hardware can either use higher frequencies to achieve short-range, high-speed data interaction, or use relatively lower frequencies to achieve long-distance transmission of sensor data to edge or cloud processing centers. Frequency generation and mixing are extremely critical steps in achieving high-efficiency wireless transmission; however, existing frequency generation and mixing modules usually use independent generation and mixing circuits, based on traditional complementary metal oxide semiconductor (CMOS) devices, using registers Complex digital and analog circuits such as ring oscillators, digital-to-analog converters, and operational amplifiers are not specifically designed for lower-frequency WIoT transmission links, which naturally results in higher delays and energy consumption.
NAURA here is getting interviewed
1000+ SiC growth furnace delivered & 100+ epitaxial growth delivered in 2023. Over 100 front end equipments. in total over 4000 SiC equipments have been delivered (I assume that number goes beyond 2023).
they provide crystal growth, epitaxial growht, etching equipment PECVD, PVD, vertical furnace and high temp furnace tubes.
on GaN side, they provide etching, PVD, cleaning, PECVD, vertical furnace type of equipments
expecting SiC modules to account for 70% of auto market by 2027. When they can get the cost down closer to Si chips.