Look if Nvidia GPUs were snuggled then lithography stepper parts can also be snuggled. Each part is really small except for the lens. Lasers are the size of a show box for DUV. The worktable is quite heavy but made of multiple small parts. We might also see a lot of malicious compliance where they claim to comply with restrictions but don't enforce it themselves. For example, ASML ships the part to Singapore, South Korea or Taiwan or Japan. Parts are then purchased by third parties on second hand markets. Maybe parts can be cannibalised from used steppers. This is a nothingburger. At worst this is a shakedown attempt and ASML might make this go away with a few million dollar donation.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
This is a shakedown attempt for a donation. They just fired an export control official a few days ago. Musk will definitely have to beg Trump to reverse this because you know the reason.
Parts can be snuggled and chemicals even more easily. Trump just fired export control officials, so to be frank they themselves don't know what they plan to do and don't know how they plan to achieve it.
Chengdu Lianjiang Technology's new patent: Lithography objective lens exposure field of view exceeds 72mm×72mm, with broad prospects
On the road of continuous advancement of optical technology, Chengdu Lianjiang Technology Co., Ltd. has once again attracted industry attention. According to information recently released by the State Intellectual Property Office, the patent named "Lithography Objective and Lithography Equipment" applied by the company in June 2024 was recently approved, and the authorization announcement number is CN222506637U. The core technological breakthrough of this patent makes the exposure field area of the lithography objective lens greater than or equal to 72mm×72mm and the resolution less than 780nm. This innovation will not only have a far-reaching impact in the fields of semiconductor manufacturing, microelectronics technology, etc., but also pave the way for a wider range of optical applications.
As a key component in the optical system, the photolithography objective lens is used to accurately transfer the designed pattern to the photoresist. In this patent of Chengdu Lianjiang Technology, the photolithography objective lens is composed of 20 lenses. The clever arrangement design allows the objective lens to expand the field of view while ensuring high resolution. This means that in the semiconductor industry, future photolithography equipment can perform high-precision pattern burning within a larger field of view, improve production efficiency and reduce costs.
When analyzing the lithography objective, we can see its uniqueness in lens design. The first and twentieth lenses adopt a planar design, while the remaining lenses combine positive and negative optical power structures. This composite design not only improves the imaging quality of the objective, but also effectively reduces chromatic aberration and optical distortion, greatly enhancing its reliability and adaptability in practical applications.
With the rapid development of semiconductor manufacturing technology, the accuracy and efficiency of lithography process have become increasingly key factors in competition. The emergence of this new patent just meets the industry's urgent need for high-performance lithography systems. Giants in the field of lithography, such as ASML and Tokyo Electron, are facing fierce challenges from emerging companies. Chengdu Lianjiang Technology is expected to occupy a place in the international market with its independently developed lithography objective lens.
In addition to the technical characteristics of lithography lenses, Chengdu Lianjiang Technology sees broader application prospects in the industry development trend. With the popularization of integrated circuits and optoelectronic components, the demand for high-resolution lithography equipment is growing significantly. Especially driven by emerging technologies such as 5G, artificial intelligence, and the Internet of Things, every link in the semiconductor industry chain is pursuing higher technical thresholds.
In this regard, Chengdu Lianjiang Technology plans to increase investment in research and development in its future development strategy to further improve the performance of lithography lenses. At the same time, the company is also actively cooperating with universities and research institutions to promote cutting-edge technology research and application in the field of optics. According to Tianyancha data, Chengdu Lianjiang Technology was established in 2019 with a registered capital of 10 million yuan. It has accumulated 103 patent information so far and actively participated in various bidding projects. Its current achievements in the field of optics have undoubtedly brought new vitality to the industry.
Changsha Sap New Materials independently developed the first domestic silicon carbide substrate 30000# fine grinding and thinning grinding wheel
The core link in the silicon carbide production process is the processing of silicon carbide substrates, which is mainly divided into three processes: cutting, thinning and polishing of silicon carbide substrates. Thinning is mainly achieved through grinding and lapping, which are divided into rough grinding and fine grinding. The silicon carbide wafer thinning grinding wheel and grinding technology independently developed by Sap New Materials, from the wafer damage mechanism during the grinding process to the rough and fine grinding of the wafer, uses diamond grinding wheels to achieve wafer thinning processing with low damage and high cutting rate.
United Nova reporting huge gain in their revenue in 2024 vs 2023. Sales up 22.25%
auto and consumer electronics led the way.
They made progress sin microphone, IMU, pressure sensor, micro mirror, VCSEL, RF filters and power ICs.
It currently provides 70% of the chips in a car from analog to power chips to digital, sensors and modules.
for renewables, their 120 kW and 150 kW solar inverter is increasing market share. their 12tkW, 220kW and MW level power module for ESS customer has also started production
company has started mass production of 180nm process for tech for AI server power management chips, MOSFET for power management has also started
It is also going through customer product verification for 55nm BCD 20V integrated DrMOS.
Also mass production of MEMS sensors and power chip in robots and AI consumer electronics.