Dachen leads the investment in the nearly RMB 100 million Series A financing of the semiconductor high-end laser equipment company Rasontech
Founded in October 2021has been focusing on the research and development and manufacturing of high-end laser equipment in the semiconductor industry. Relying on the entrepreneurial team's nearly 30 years of deep industry experience and overseas background, it has successively completed the forward research and development layout of multiple series of equipment such as substrate level, packaging level, and wafer level. The products have been successfully shipped to domestic first-tier manufacturers and have been certified, and it has quickly become a dark horse in the field of high-end laser equipment in the domestic semiconductor industry. At present, Raytheon Technology sells nearly 20 types of semiconductor-specific equipment, which are widely used in high-speed, high-precision, and composite micro-nano processing in the fields of semiconductor wafer manufacturing and advanced packaging.
Huang Gang, the founder of Raysun Tech, said that with the maturity of laser technology, laser equipment in various fields in China has developed rapidly in recent years. However, in the field of micro-nano processing involved in high-end semiconductor wafer manufacturing and advanced packaging, Japanese and Korean companies have firmly occupied most of the market share of leading customers by virtue of their industrial and regional advantages. Since its establishment, the company has insisted on forward research and development, and has successively completed the research and development of multiple core independent technologies such as software algorithms, ultrafast lasers, optical control platforms, and composite motion platforms. The developed equipment includes wafer-level cutting, wafer-level grooving, wafer-level core marking, packaging-level uPOP drilling, and RF module TSA film cutting, which have reached the international leading level in terms of processing accuracy, production efficiency, and operational stability. At present, the company's products have begun to attract the attention of overseas customers . In the future, Raysun Tech will be based in China and gradually radiate overseas markets, striving to become a leading laser comprehensive solution provider in the semiconductor industry.
Huang Gang, the founder of Raysun Tech, said that with the maturity of laser technology, laser equipment in various fields in China has developed rapidly in recent years. However, in the field of micro-nano processing involved in high-end semiconductor wafer manufacturing and advanced packaging, Japanese and Korean companies have firmly occupied most of the market share of leading customers by virtue of their industrial and regional advantages. Since its establishment, the company has insisted on forward research and development, and has successively completed the research and development of multiple core independent technologies such as software algorithms, ultrafast lasers, optical control platforms, and composite motion platforms. The developed equipment includes wafer-level cutting, wafer-level grooving, wafer-level core marking, packaging-level uPOP drilling, and RF module TSA film cutting, which have reached the international leading level in terms of processing accuracy, production efficiency, and operational stability. At present, the company's products have begun to attract the attention of overseas customers . In the future, Raysun Tech will be based in China and gradually radiate overseas markets, striving to become a leading laser comprehensive solution provider in the semiconductor industry.
