The list of major projects in Jiangsu Province in 2025 is released! More than 60 semiconductor projects are on the list.
Jiangsu Provincial Development and Reform Commission officially released the list of major projects in Jiangsu Province in 2025 and the list of key private investment industry projects in Jiangsu Province in 2025. Among them, a total of 600 major projects in Jiangsu Province in 2025 were arranged, including 500 implementation projects and 100 reserve projects.
There are more than 60 semiconductor industry chain projects on the list, including Nanjing Huatian Integrated Circuit Advanced Packaging and Testing, Nanjing Xinde Technology Packaging Production Line Upgrade, Nanjing Weice Integrated Circuit Wafer and Finished Chip Testing, Nanjing Pangu Multi-chip High-density Board-level Fan-out Packaging, Wuxi Xinzhuo RF Chips and Modules, Wuxi Huajin Semiconductor Three-dimensional Heterogeneous Heterogeneous System Integration Phase III, Wuxi Yiwen Electronic Semiconductor Equipment, Yixing CRRC Medium and Low Voltage Power Device Industrialization, Jiangyin Shenghe jingwei Three-dimensional Multi-chip Integrated Packaging, Wuxi Huahong Integrated Circuit Wafer Manufacturing, Yixing Lakeside Optical Core Silicon-based OLED Microdisplay Phase I, Xuzhou Leuven Semiconductor Etching Equipment, Xuzhou Bokang Photolithography Materials and Photoresists, Suzhou Luxin Semiconductor Mask Phase I, Suzhou Siliconware Precision Industries Wafer-level Chip High-end Testing, Chongchuan Tongfu tongda Integrated Circuit Advanced Packaging and Testing, Gaoyou Chengsheng Technology Chip Packaging and Testing and OLED Display Modules, Suzhou Oudi Semiconductor Special Equipment, Suzhou Guanli Semiconductor Process Supply System, Xuzhou Pioneer Semiconductor Thin Film Materials and other projects.
There are more than 60 semiconductor industry chain projects on the list, including Nanjing Huatian Integrated Circuit Advanced Packaging and Testing, Nanjing Xinde Technology Packaging Production Line Upgrade, Nanjing Weice Integrated Circuit Wafer and Finished Chip Testing, Nanjing Pangu Multi-chip High-density Board-level Fan-out Packaging, Wuxi Xinzhuo RF Chips and Modules, Wuxi Huajin Semiconductor Three-dimensional Heterogeneous Heterogeneous System Integration Phase III, Wuxi Yiwen Electronic Semiconductor Equipment, Yixing CRRC Medium and Low Voltage Power Device Industrialization, Jiangyin Shenghe jingwei Three-dimensional Multi-chip Integrated Packaging, Wuxi Huahong Integrated Circuit Wafer Manufacturing, Yixing Lakeside Optical Core Silicon-based OLED Microdisplay Phase I, Xuzhou Leuven Semiconductor Etching Equipment, Xuzhou Bokang Photolithography Materials and Photoresists, Suzhou Luxin Semiconductor Mask Phase I, Suzhou Siliconware Precision Industries Wafer-level Chip High-end Testing, Chongchuan Tongfu tongda Integrated Circuit Advanced Packaging and Testing, Gaoyou Chengsheng Technology Chip Packaging and Testing and OLED Display Modules, Suzhou Oudi Semiconductor Special Equipment, Suzhou Guanli Semiconductor Process Supply System, Xuzhou Pioneer Semiconductor Thin Film Materials and other projects.