Chinese semiconductor thread II

tokenanalyst

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The list of major projects in Jiangsu Province in 2025 is released! More than 60 semiconductor projects are on the list.​

Jiangsu Provincial Development and Reform Commission officially released the list of major projects in Jiangsu Province in 2025 and the list of key private investment industry projects in Jiangsu Province in 2025. Among them, a total of 600 major projects in Jiangsu Province in 2025 were arranged, including 500 implementation projects and 100 reserve projects.

There are more than 60 semiconductor industry chain projects on the list, including Nanjing Huatian Integrated Circuit Advanced Packaging and Testing, Nanjing Xinde Technology Packaging Production Line Upgrade, Nanjing Weice Integrated Circuit Wafer and Finished Chip Testing, Nanjing Pangu Multi-chip High-density Board-level Fan-out Packaging, Wuxi Xinzhuo RF Chips and Modules, Wuxi Huajin Semiconductor Three-dimensional Heterogeneous Heterogeneous System Integration Phase III, Wuxi Yiwen Electronic Semiconductor Equipment, Yixing CRRC Medium and Low Voltage Power Device Industrialization, Jiangyin Shenghe jingwei Three-dimensional Multi-chip Integrated Packaging, Wuxi Huahong Integrated Circuit Wafer Manufacturing, Yixing Lakeside Optical Core Silicon-based OLED Microdisplay Phase I, Xuzhou Leuven Semiconductor Etching Equipment, Xuzhou Bokang Photolithography Materials and Photoresists, Suzhou Luxin Semiconductor Mask Phase I, Suzhou Siliconware Precision Industries Wafer-level Chip High-end Testing, Chongchuan Tongfu tongda Integrated Circuit Advanced Packaging and Testing, Gaoyou Chengsheng Technology Chip Packaging and Testing and OLED Display Modules, Suzhou Oudi Semiconductor Special Equipment, Suzhou Guanli Semiconductor Process Supply System, Xuzhou Pioneer Semiconductor Thin Film Materials and other projects.

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tokenanalyst

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Guangsao builds a new semiconductor process high-end technology and automation equipment base.​


The project is located in the west of Sudai Road and the east of Hebei, Huangqiao Street, Xiangcheng District, Suzhou City, covering an area of about 22 acres, with an estimated total investment of about 220 million yuan. Since the official start of construction in May 2024, with the care and help of leaders at all levels of the street and district and friends, the project has been successfully completed on schedule and topped out today. Among them:

The 1# plant is planned to be built with 10 floors above ground, including modern plants for R&D, office and manufacturing. The 2# plant is planned to be built with 3 floors above ground, with a construction area of more than 30,000 square meters. After completion, the project will reach an annual output of 200 sets of high-end technology and automation equipment for pan-semiconductor processes.

As new projects are gradually completed and put into production, Guangsao will continue to "increase investment" in the pan-semiconductor field, overcome "bottleneck" technologies, break through the localization of more equipment, and continue to "add bricks and tiles" to the stability of the supply chain in the semiconductor field!

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tokenanalyst

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Anhui Xuteng Microelectronics Equipment Co., Ltd. clean room expansion project started​


Anhui Xuteng Microelectronics Equipment Co., Ltd. was established in March 2022 with a registered capital of 11 million yuan. As the parent company of Hefei Zhenping Electronic Technology Co., Ltd., it is located at No. 4708, Yungu Road, Hefei Economic Development Zone. The company is a high-tech enterprise, focusing on the research and development, production and sales of semiconductor equipment in the fields of thermal field (+30 - 1600℃), vacuum (1 - 1*10⁻⁶ torr), and high pressure (10MPa), integrating design, manufacturing, sales and after-sales service.

This expansion project will build class100 and class1000 workshops with a construction area of 7,000 square meters. The company has a strong technical team, with core members composed of senior engineers in the fields of thermal engineering, fluid, structure, semiconductor, etc., and more than 40 R&D personnel, all of whom have a bachelor's degree or above. At present, the company has obtained 60 national patent applications, including 12 invention patents and 16 software copyrights, and has about 32,000 square meters of factory buildings and 2,000 square meters of clean workshops.

In terms of its main business, the company is committed to developing highly integrated and automated semiconductor equipment that can adapt to complex process requirements, such as fully automatic vertical furnaces, vertical oxidation furnaces, vertical diffusion furnaces, vertical annealing furnaces, vertical LPCVD furnaces, vertical alloy furnaces, fully automatic formic acid vacuum welding furnaces, fully automatic vacuum oxygen-free ovens, fully automatic vacuum pressure ovens, fully automatic SIC coating furnaces, etc. At present, the company has successfully developed and mass-produced a variety of automated products, including single-tube, double-tube, and four-tube vertical furnaces for wafers and advanced packaging, fully automatic vacuum oxygen-free ovens for Baking processes, fully automatic vacuum pressure ovens, formic acid reflow ovens, and other equipment.

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huemens

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There is already a loophole. The VEU list. Let's say you are AWS, azure or G42 and your are already on the list. You can import more gpu than the limit. And 50k is already more than the need of most countries. Buy GPU in one country and send they via mail to other countries. Though this will make cloud hyperscalers pretty much controlling GPU access in countries with export restrictions.
The news article doesn't explain everything, but there are several restrictions even for VEUs. For example minimum 50% of their entire capacity has to be in US. 75% has to be within Tier 1 countries. The maximum they can have in all the Tier-2 countries combined is 25% and out of that not more than 7% in a single Tier-2 country.
Then there are several security and audit requirements they have to follow. Also they can't host closed-source AI models outside of Tier-1 countries even if they have data centers in Tier-2 countries.

This Oracle article has some more information
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huemens

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This is the SIA statement on this last rule

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BTW rules will start during Trump administration, so it is not clear how it will end up....

Just less than one week before the end of their mandate...if this is not a desperate move I don't know what a desperate move is.

I will not regret this old administration, they come in power masquerading as peaceful sheep after the turbulent Trump 1 period....but they vastly demonstrated to be all but peaceful...and I'm not referring to semiconductors only.

Unfortunately the world today is a worst place than 4 years ago, and the Biden administration has a huge responsibility for it.

Because they excluded so many countries that are considered US allies (even in Europe) from Tier-1, my speculation is they actually didn't want to include even the allies but were compelled to include some due to various reasons.

1) Anglo Countries: US, UK, Canada, Australia, New Zealand
2) Countries heavily involved in Chip supply chain: SK, Japan, Taiwan, Netherlands
3) European countries where US cloud companies like AWS already operates very large data-centers. Or this may just be the set of countries that easily provides access to data when US requests.
 
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tokenanalyst

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Designed specifically for the robotics field, Hesai Technology launches the world’s widest field of view mini 3D LiDAR.​


The JT series has achieved many technological breakthroughs. It uses a full-rotation scanning method in the horizontal direction to easily obtain a 360-degree horizontal field of view; the vertical field of view can reach up to 256 lines. Through Hesai's innovative optical module design, the vertical field of view is expanded to 187 degrees. It is currently the most extensive super-hemispherical product in the global laser radar field. This sensing range is equivalent to the size of 1.5 standard football fields, which is more than 60% higher than similar products, providing robots with unprecedented all-dead-angle sensing capabilities.
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The JT series has achieved a minimum detection distance of 0 meters, achieving close-range perception without blind spots. This technological upgrade not only improves the robot's positioning accuracy and obstacle recognition capabilities, but also enables it to simultaneously take into account ground detection and environmental structure perception in the space above. The robot only needs to install a JT laser radar to easily achieve all-round detection of the surrounding environment.
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The minimum bottom diameter of the JT series products is only 55 mm, which is about 30% smaller than similar products, and the volume is 70% smaller than similar products. Because of their compact size, these products can be flexibly installed in different positions of various robots. Through concealed embedded installation, the exposed window height does not exceed 30 mm. Not only is the volume extremely optimized, JT has also achieved a major breakthrough in weight. The weight of the whole machine is only 200-250 grams, which is 47% lighter than similar products, further improving the installation portability, reducing the load impact on the robot equipment, and helping the robot to last longer.

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Hyper

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Because they excluded so many countries that are considered US allies (even in Europe) from Tier-1, my speculation is they actually didn't want to include even the allies but were compelled to include some due to various reasons.

1) Anglo Countries: US, UK, Canada, Australia, New Zealand
2) Countries heavily involved in Chip supply chain: SK, Japan, Taiwan, Netherlands
3) European countries where US cloud companies like AWS already operates very large data-centers. Or this may just be the set of countries that easily provides access to data when US requests.
They will be compelled to add countries even more when AWS and azure lobby to allow case by case exemptions.
 

siegecrossbow

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This is the SIA statement on this last rule

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BTW rules will start during Trump administration, so it is not clear how it will end up....

Just less than one week before the end of their mandate...if this is not a desperate move I don't know what a desperate move is.

I will not regret this old administration, they come in power masquerading as peaceful sheep after the turbulent Trump 1 period....but they vastly demonstrated to be all but peaceful...and I'm not referring to semiconductors only.

Unfortunately the world today is a worst place than 4 years ago, and the Biden administration has a huge responsibility for it.

Never in my wildest dream did I imagine a legitimate arm of the U.S. government go to retard, yet it just did…
 

tokenanalyst

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Interesting, spin-on carbon hard mask for next gen patterning methods like EUV.​

Organic polymer, carbon hard mask composition and method for forming pattern​

Huangpu Institute of Materials

CN117946352A

Abstract​

The present invention relates to the field of high molecular polymers, and in particular to an organic polymer, a carbon hard mask composition and a method for forming a pattern. The organic polymer of the present invention comprises a first structural unit and a second structural unit connected to each other by covalent bonds; the first structural unit isThe second structural unit comprises at least one of the following formula,,,,,wherein R 1 , R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are independently selected from C 2 to C 9 alkenyl or C 2 to C 9 alkynyl. The organic polymer and carbon hard mask composition can be used to prepare a carbon hard mask with high carbon content, high temperature resistance, etching resistance and the ability to form an organic film with planarization characteristics through spin coating.​

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tphuang

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China network communications Institute now has mass production capacity for System-in a package (SiP packaging)

Allows multiple dies to be integrated in 3D packaging. Reducing area by more than 80%, widely used navigation, positioning, surveying, earthquake early warning.

IIRC, SiP is quite popular in RF applications
 
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