Is DJI all over again. The next fab boom in China is not going to be 28nm but 7-3 nm.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Garen Semi with some GaO update
They've now been able to grow 4-inch GaO single crystal using VB method. This type of crystal growth equipment and process is now open for sale.
It has launched after level 010 GaO single crystal substrate product. Mostly to meet science research field.
010 substrate has highest thermal conductivity and faster epitaxy growth rate.
Some interesting notes:
- Greenland is orange although Denmark is blue....hmmmm
- In Europe, Portugal for some reason is orange but not Spain.
- Also no luck for East Europe (but still EU/NATO) countries like Poland, Slovakia, etc...why?
- Our friends, India people, are orange too...sorry for that!
Ok, jokes aside, it is really a sign of our times that during the last few weeks, even the last few days of the old Biden administration, instead of devoting themselves to routine and daily administration they ramped up super aggressive and long-impact actions. This curb is not the first of the last weeks.
You don't expect the government of the most powerful nation in the world to act like this one week before the end of its mandate.
Wanye Enterprises acquires stake in high-precision 3D measurement equipment manufacturer "Ami Instruments"
Nanjing Aimi Instrument Technology Co., Ltd. (hereinafter referred to as Aimi Instrument) underwent industrial and commercial changes, and Shanghai Wanye Enterprise Co., Ltd. and others were added as shareholders.
Amy Instruments is committed to the localization of precision 3D measurement equipment and mastering core technologies. According to data, the company has continuously launched a variety of measurement equipment. The first domestic online industrial atomic force microscope successfully developed has been delivered to the leading domestic 12-inch chip manufacturing company, which is of great significance to promoting the development of domestic advanced processes, improving chip manufacturing yield, and shortening the process development cycle.
With the development of high-density 3D integration technologies such as 3D NAND, HBM, hybrid bonding, and advanced packaging, AFM's high-precision, nanoscale measurement capabilities are key process technologies for development and monitoring, and are indispensable core demand equipment in these applications.
Amy Instruments is committed to the localization of precision 3D measurement equipment and mastering core technologies. According to data, the company has continuously launched a variety of measurement equipment. The first domestic online industrial atomic force microscope successfully developed has been delivered to the leading domestic 12-inch chip manufacturing company, which is of great significance to promoting the development of domestic advanced processes, improving chip manufacturing yield, and shortening the process development cycle.
With the development of high-density 3D integration technologies such as 3D NAND, HBM, hybrid bonding, and advanced packaging, AFM's high-precision, nanoscale measurement capabilities are key process technologies for development and monitoring, and are indispensable core demand equipment in these applications.
Pioneer Semiconductor launches new products at CES 2025: Unlocking the "core" era of robot joints, precise control is within reach!
Shanghai Pioneer Semiconductor Technology Co., Ltd. (Pioneering Semiconductor, HPMicro), a Chinese high-performance microcontroller product and embedded solution provider, made a shining debut and released the HPM6E8Y series, a high-performance MCU product focusing on robot motion and control, injecting new vitality into the hot robot market.
“I am very pleased to represent Pioneer Semiconductor to share our new product, the HPM6E8Y series, with you at CES, the forefront of global technological innovation. This chip is tailored for high-precision motion control of robot joints, and features high performance, high integration, small package, and ease of use. We believe that the application of this chip will greatly promote the progress of servo motor control, robotics technology, and even the entire industrial automation field. We look forward to working with you to create a brilliant future for industrial intelligence!”
“I am very pleased to represent Pioneer Semiconductor to share our new product, the HPM6E8Y series, with you at CES, the forefront of global technological innovation. This chip is tailored for high-precision motion control of robot joints, and features high performance, high integration, small package, and ease of use. We believe that the application of this chip will greatly promote the progress of servo motor control, robotics technology, and even the entire industrial automation field. We look forward to working with you to create a brilliant future for industrial intelligence!”
National Big Fund Phase II Invests in Zhongan Semiconductor
Industrial and commercial data show that Zhongan Semiconductor Co., Ltd. was established in 2020. The legal representative is Chen Jun. The registered capital is 57.5606 million yuan. The business scope includes: manufacturing of special equipment for semiconductor devices; sales of special equipment for semiconductor devices; sales of artificial intelligence hardware; integrated circuit chip and product manufacturing, etc.
According to the data, Zhongan Semiconductor was established in 2020 with a registered capital of 57.5606 million yuan. It focuses on semiconductor measurement equipment. Its main products include wafer geometry measurement equipment, wafer particle defect detection equipment, etc. Among them, the wafer geometry measurement equipment mainly performs non-contact optical interference measurement on parameters such as wafer warpage, flatness, thickness, and film stress; the wafer particle defect detection equipment uses the principle of light scattering and high-power deep ultraviolet technology to provide non-contact optical detection of wafer particle defects.
It is reported that the WGT300-M large silicon wafer flatness and warpage detection equipment developed by Zhongan Semiconductor is benchmarked against mainstream products in the international market. It is the first domestic semiconductor measurement equipment that can measure the warpage and stress of the entire surface of 12-inch wafers. It has many world-leading technical capabilities and fills the gap in the domestic market.
Zhongan Semiconductor's products are mainly used in large silicon wafer production, wafer manufacturing, equipment research and development, advanced packaging and other fields. Its core technologies cover precision optomechanical, deep ultraviolet, high-speed cameras, etc. It also has independently developed core algorithms, and its equipment performance is internationally leading. It has been highly recognized and received repeat orders from many leading customers. Through technological iteration, it meets customer customization needs, and its business is expected to continue to grow in the future.
According to the data, Zhongan Semiconductor was established in 2020 with a registered capital of 57.5606 million yuan. It focuses on semiconductor measurement equipment. Its main products include wafer geometry measurement equipment, wafer particle defect detection equipment, etc. Among them, the wafer geometry measurement equipment mainly performs non-contact optical interference measurement on parameters such as wafer warpage, flatness, thickness, and film stress; the wafer particle defect detection equipment uses the principle of light scattering and high-power deep ultraviolet technology to provide non-contact optical detection of wafer particle defects.
It is reported that the WGT300-M large silicon wafer flatness and warpage detection equipment developed by Zhongan Semiconductor is benchmarked against mainstream products in the international market. It is the first domestic semiconductor measurement equipment that can measure the warpage and stress of the entire surface of 12-inch wafers. It has many world-leading technical capabilities and fills the gap in the domestic market.
Zhongan Semiconductor's products are mainly used in large silicon wafer production, wafer manufacturing, equipment research and development, advanced packaging and other fields. Its core technologies cover precision optomechanical, deep ultraviolet, high-speed cameras, etc. It also has independently developed core algorithms, and its equipment performance is internationally leading. It has been highly recognized and received repeat orders from many leading customers. Through technological iteration, it meets customer customization needs, and its business is expected to continue to grow in the future.
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CMP materials provider Ningbo Runping Electronic Materials Co., Ltd. new more efficient wafer chemical mechanical polishing method.
Ningbo Runping Electronic Materials Co., Ltd. has invented a wafer chemical mechanical polishing method, including: setting a retaining ring on the periphery of the wafer to fix it, and pressing it on the polishing pad for polishing; recording the surface of the retaining ring close to the polishing pad as the first surface, and recording the surface of the retaining ring close to the wafer as the second surface, and the transition radius from the first surface to the second surface is 0≤R<0.05mm. This invention ensures the stability of the retaining ring in the polishing process, solves the problem of residue retention, and effectively improves the wafer edge polishing rate.
According to Hui Hongye, chairman of Runping Electronics, the R&D team of Runping Electronics has achieved breakthroughs in the independent research and development of key ultra-precision polishing components such as polishing heads, surpassing foreign counterparts in many dimensions such as product accuracy and flatness. The company has also quickly opened up the domestic market through the new model of "product + service", and has been favored by many chip manufacturers.
Linghang Electronics has completed the performance verification of semiconductor-grade polishing liquid
The company stated that its equity participation company, Dongguan Linghang Electronic New Materials Co., Ltd., has completed the performance verification of semiconductor-grade polishing liquids such as ICs, silicon wafers, and silicon carbide and has mass production capabilities.
Dongguan Linghang Electronic New Materials Co., Ltd. was established in November 2021. It is led by senior overseas CMP industry professionals and doctors in the geometric center of the Guangdong-Hong Kong-Macao Greater Bay Area. The products mainly serve 3C and IC companies. The company is based in the CMP field to help companies improve quality and efficiency, and is an overall operation solution provider for CMP companies. The company focuses on the efficient operation of polishing/grinding of CMP companies, and builds a new operation management system with horizontal integration, vertical penetration, and end-to-end integration through the company's professional R&D, digital production, and close services built on a management platform that matches customer needs.