Chinese semiconductor thread II

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Longsys' self-developed SLC NAND Flash has shipped over 100 million pieces!​

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Longsys, a major domestic memory chip manufacturer, announced that the company has fully utilized its chip design capabilities and continued to actively invest in memory chip design business. As of now, the cumulative shipments of its self-developed SLC NAND Flash have exceeded 100 million!

In the first half of 2024, the company launched a new generation of 2Gbit SPI NAND Flash chip products based on 2xnm, with an interface speed of up to 166MHz and support for DTR (double transmission) function to achieve higher data transmission rates. Based on SLC NAND Flash products, the company also uses multi-chip packaging technology to integrate SLC NAND storage particles with LPDDR storage particles, and expands NAND based MCP products with various specifications. In addition to the existing SLC NAND and LPDDR2 integrated package MCP products, in the first half of 2024, SLC NAND and LPDDR4x integrated package MCP products were also launched, which are mainly used in 5G communication modules and have entered small-scale production.

The company's self-developed memory chip products implement quality management throughout the production process, achieve particle-level traceability, and have a DPPM (defective products per million defect opportunities) of less than 100, with outstanding performance and stability. Shipments are growing rapidly in consumer, industrial and automotive application scenarios, with cumulative shipments exceeding 100 million units to date.​

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Beam matching method and device for laser amplification system​

Changchun Institute of Optics Fine Mechanics and Physics of CAS

Abstract​

The invention relates to the technical field of extreme ultraviolet lithography, in particular to a method and a device for matching a laser amplifying system beam, which are characterized in that a variable curvature reflector is inserted between a seed laser and a laser amplifier based on the existing laser amplifying system, a space optical filter is inserted behind the laser amplifier, the space optical filter can effectively block transmission of diffraction stray light generated by interaction of seed laser and the inner wall of the laser amplifier, a laser power meter is utilized to measure net laser power after the stray light is filtered by the space optical filter, and curvature of the variable curvature reflector is adjusted according to net laser power feedback, so that the beam transmission parameters of the seed laser beam in the laser amplifier are dynamically regulated and controlled, and the problem of mismatching between the seed laser parameters and the gain space of the laser amplifier caused by factors such as non-uniformity of light refractive index of a gas subsonic flow field and nonlinear amplification of the optical power of the laser amplifier at present is solved.​

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Gallium Semiconductor · New Plant | VB method crystal growth equipment is fully put into production!​


The official opening of the second phase of the factory of Hangzhou Gallium Semiconductor Co., Ltd. (hereinafter referred to as "Gallium Semiconductor") marked the further deepening of the company's strategic layout in the field of gallium oxide and the qualitative leap in production capacity. The new factory has introduced advanced industrial equipment in key links such as crystal growth, wafer processing and epitaxial growth , and is expected to significantly increase production capacity to meet the growing demand for gallium oxide wafer substrates and epitaxial wafers in the global market.

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In the second phase of the factory, the vertical Bridgman method (VB method) dedicated gallium oxide crystal growth furnace independently developed and sold by Gallium Ren Semiconductor has been fully put into production and the process is continuously optimized on the existing basis. Bridgman method is a globally recognized key technology for the industrialization of gallium oxide. As the only domestic suppliers that can provide such equipment, we are committed to promoting the rapid development of the gallium oxide industry and look forward to working with more customers to solve industry problems."

With the introduction of the new production line, Gallium Semiconductor will further enhance the production capacity of gallium oxide materials and equipment to meet the growing market demand for high-performance semiconductor materials and special equipment. The introduction of the new production line will enable the company to achieve a new leap in product quality, production efficiency and cost control, and provide customers with better products and services.

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Guolin Semiconductor showcasing semiconductor grade ozone generators used in the cleaning of lithography machines.​



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Guolin Technology-----The core multiple exposure cleaning equipment of the lithography machine!

(1) The company's semiconductor ozone equipment can be used for semiconductor cleaning, helping the localization of the industrial chain. Ozone technology is widely used in cleaning of various semiconductor process links. In the photolithography process, the VOS process (mixture of high-concentration ozone gas and vaporized water) can replace the traditional SPM (sulfur peroxide mixture) cleaning process.

(2) The company has made breakthroughs in the core technology of semiconductor ozone equipment, and its performance is comparable to that of the overseas leader MKS. The current product samples have been sent to downstream leading customers such as North Huachuang, Tuojing Technology, and BOE for verification. It is expected that the production line verification will be completed by the end of May 2024, and mass production can be put into operation immediately after the verification is completed.

(3) The potential space for front-end cleaning is conservatively 18e, and the potential space for thin film deposition is 20e. If the comprehensive localization rate reaches 10%, Guolin Technology's order profit for semiconductor equipment will start at 85 million yuan, and a market value of about 20e at 25pe. It will be difficult to have competitors within 2 years, and it will not be difficult to achieve a 30% market share in its main business of ozone generators in the medium term.
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