Jingce Electronics' Seal series TGV testing equipment was successfully delivered in batches to leading customers in the TGV industry in Central China
Jingce Electronics' Seal series TGV (Through Glass Vias) testing equipment was successfully delivered in batches to a leading customer in the TGV industry in Central China . This is the first time that the Seal series TGV testing equipment independently developed by Jingce Electronics has been successfully delivered in batches in the TGV field, marking another important breakthrough for Jingce Electronics in the field of semiconductor FOPLP advanced packaging testing.
This leading customer uses the company's independently developed TGV technology (through glass via interconnection technology) in Mini/Micro LED direct display, semiconductor advanced packaging substrates and other precision device fields. Its TGV technology capabilities and production capacity layout are in the leading position in the industry.
Driven by multiple forces of R&D and production, Jingce Electronics collaborated across multiple departments to successfully develop related products and achieve batch shipments to leading customers in the industry, fully demonstrating Jingce Electronics' outstanding technical strength in testing equipment in the field of semiconductor TGV advanced packaging applications, and also highlighting its strong R&D capabilities, production capabilities and growing market competitiveness.
The Seal series TGV inspection equipment independently developed by Jingce Electronics represents the company's latest technological achievements in the field of semiconductor inspection. The Seal series products are mainly used to inspect TGV through holes, metal filling in holes, surface metallization, RDL process and other key process flow inspections. The inspection defects include graphic abnormalities, surface damage, dirt and foreign matter, short circuits, open circuits, scratches, residues, etc. It can be optionally equipped with integrated key dimension measurement and film thickness measurement function modules. The equipment has high inspection accuracy and excellent data processing capabilities. It can accurately capture defects in fine structures and provide detailed inspection reports to help customers improve production efficiency and product quality. The TGV inspection machine equipment software is fully independently developed with independent intellectual property rights. Combined with Jingce Electronics' many years of technical experience in the field of quality inspection, it promotes the localization and application of TGV inspection equipment.
