背板制作的大部分设备与传统的半导体制程设备相似,但考虑到玻璃基板的尺寸比半导体晶圆要大得多,对设备的大型化要求比较高。中国的半导体厂商目前主要精力放在半导体设备的国产化上,对显示领域制程设备的国产化需求感觉不是很强烈,在设备的国产替代方面进展缓慢。
Looks like in the private-commercial sector only move under extreme pressure, even when ZTE was under the threat of being killed by US sanctions in 2017 nothing changed, China industrialists thought that will never happen to them and those include Huawei management. The Chinese government also was somehow slow to act, they pay for the R&D and commercialization of semiconductor manufacturing tools but they can't force managers to buy SMEE I-Line scanners instead of ASML ones and much less when those managers are foreign. I think the best strategy for China was and still is a dual approach. MEMs, Power ICs and mature logic nodes should be as close to 100% domestic as possible leaving foreign tools, software and materials just to the leading edge. So in that case under a threat of sanctions could allow China to quickly fill the gaps. Imagine SMEE dry scanners (KrF, ArF, I-Line) being use more while ASML have only be allow to sell immersion and EUV scanners, in that case if ASML tools get sanctioned SMEE could have filled the gap a lot quicker and probably half decade ago.The indigenization progress on equipment and material at Chinese display sector LCD/OLED is extremely slow.
As this article pointed out,Chinese equipment manufactures all rush into semiconductor sector,not much attention is being paid at display sector. And the gov doesn't seem to concern about low level upstream indigenization in display sector either.
I think the reason for the stark contrast between the rapid rise of domestic manufactures in semiconductor sector and the slow progress in
display sector,is that the display sector never have a sense of insecurity(being cut off from oversea suppliers) but the semiconductor sector does.
The indigenization progress of semiconductor and display industry were pretty similar prior to 2019,then they start to split for well known reason. Semiconductor industry entered turbocharge mode on domestic supply chain,where as the display industry still go on business-as-usual.
The story of Chinese semiconductor industry is a good example of short term pain for long term gain. The question is,why do you have to wait for someone else to stab you to wake you up,to have that “short term pain”? Why don't you stab yourself before some else does (ie. ban critical imports before others impose export ban)?
People have unrealized potential,and that potential can only be realized when they are being pushed to the limit. This is true for most of Chinese high-tech industries,you put them in a do-or-die situation,they will figure out a way for self-salvation
Achieving nanometer-level alignment precision in lithography is essential for the advancement of semiconductor manufacturing. This study introduces an innovative laser self-reference technique that leverages the interference of two coherent beams on a reflective grating with a matching period. By incorporating a wedge-shaped beam splitter, a reference interference fringe is generated, establishing a direct correlation between the incident interference pattern and the reference grating, thus enabling real-time spatial alignment monitoring. A theoretical model was developed to elucidate the phase relationship. The experimental apparatus comprised a high-precision laser system, a piezoelectric transducer (PZT) for minute phase adjustments, and a high-speed CMOS camera for instantaneous analysis. The technique was evaluated using three displacement inversion algorithms, with the image phase correlation algorithm outperforming the others, achieving control of deviations to below 3.2 nm. Laser self-referencing technology not only provides a nanoscale alignment method, but also meets the fine control required for multi-layer grating manufacturing, improving the quality and reliability of the lithography process, and addressing a critical challenge in the production of semiconductor chips. |
you know what, i have only one problem with these random websites. they literally don't know the latest trend and update. sometimes i don't even believe on flagship websites like CGTN/Globaltimes. that's because Journalists literally don't know anything.Looks like in the private-commercial sector only move under extreme pressure, even when ZTE was under the threat of being killed by US sanctions in 2017 nothing changed, China industrialists thought that will never happen to them and those include Huawei management. The Chinese government also was somehow slow to act, they pay for the R&D and commercialization of semiconductor manufacturing tools but they can't force managers to buy SMEE I-Line scanners instead of ASML ones and much less when those managers are foreign. I think the best strategy for China was and still is a dual approach. MEMs, Power ICs and mature logic nodes should be as close to 100% domestic as possible leaving foreign tools, software and materials just to the leading edge. So in that case under a threat of sanctions could allow China to quickly fill the gaps. Imagine SMEE dry scanners (KrF, ArF, I-Line) being use more while ASML have only be allow to sell immersion and EUV scanners, in that case if ASML tools get sanctioned SMEE could have filled the gap a lot quicker and probably half decade ago.
Good opportunity for SMIC or Huawei to pick up talent imho. Sure, Samsung's advanced node yields are poor but through their human capital you can learn from missteps and avoid alot of trial and error for future rollout and improvement at advanced nodes. Will save both time and money, plus it provides an opportunity for knowledge transfer and training of fresh workforce from experienced hands.Chinese Ai firms will suffer no doubt on this.. but the bigger picture is, it will be death sentence for Samsung as they already struggling. planning to cut off 50% of its facilities by the end of the year.
looks like in 2030's we will have only two chip giants remains. TSMC/SMIC... SS will be distant 3rd or could be lower.
Robosense has developed its own Lidar specific SoC for M series Lidars. These Lidars use 2D MEMS chip and SPAD-SoC using 3D stacking technique.