Chinese semiconductor thread II
- Thread starter vincent
- Start date
AKOPTICS defect inspection tools.
F2000 IC front-end wafer defect inspection equipment
The wafer defect inspection equipment features bright field DIC, dark field and advanced AI technology. The F2000 can detect defects such as particles and scratches on the surface of bare wafers and epitaxial wafers. Its performance is comparable to that of KLA SP1. The tool is used for the inspection of various front-end process nodes in HVM wafer manufacturing and IC Fab to improve the yield of chip production.
H2000 Integrated Circuit Graphic Wafer Front-End Defects
The patterned wafer defect inspection equipment has bright field, dark field, AI, combined with spatial filtering technology, and can detect defects such as particles, scratches, pits and bumps on patterned and non-patterned Si/GaN/SiC wafers. The main application of this tool is to detect various front-end process nodes in HVM IC Fab to improve the yield of chip production.
EUV light source techs I’ve counted so far:
1. CO2 lpp-euv
2. 2um solid state laser lpp-euv (maybe multibeam)
3. Thin disk laser lpp-euv
4. SSMB
5. ERL-FEL
6. dpp-euv
7. HHG-euv
6 and 7 might be infeasible for litho power requirements but are good for metrology/inspection
1. CO2 lpp-euv
2. 2um solid state laser lpp-euv (maybe multibeam)
3. Thin disk laser lpp-euv
4. SSMB
5. ERL-FEL
6. dpp-euv
7. HHG-euv
6 and 7 might be infeasible for litho power requirements but are good for metrology/inspection
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And a respite for Western manufacturer, cause when their Chinese counterpart had satisfy local demand they will export, with huge economic of scale they will outcompete them with quality and price.
I may see it happen with 2028 as the inflection point.
That's a given. This is the transitional period.
BTW, exports would be just a by-product. Not the main impact from China going fully domestic. Chinese firms taking over just the Chinese semicon market -- I've seen figures from 33% to over 50% of the global total demand -- would collapse the current supply chain outside China.
Look at the article. During a tech war with China AMAT and other American firms depend on China for f$@$ing 40% of sales. Insane.
I may say this year is the calm before the storm, I sensed that major official announcement will be made on OCT 1 the 75th anniversary of the PROC, a month before the US Presidential Election. I hoping it will be about the EUVL program BUT my hunch is the mass production and induction of SMEE 28NM SSA800 DUVl.
Light is too energetic. Electron blue is a huge issue. Lack of photo resist and mask. Overall no need. High-NA or Hyper-NA is the end of lithography scaling. 2D and 3D IC don't require shrinking dimensions. 2035 is probably the last year where node shrinks as 2D material/ TMDs move into production.