so they are making 30k HBMs a month with this 17.1B RMB investment?
what else could 高端封测存储芯片 be?
Chinese semiconductor thread II
- Thread starter vincent
- Start date
what else could 高端封测存储芯片 be?
China RF Power Supply for semiconductor manufacturing equipment situation:
Tuojing Technology invested in Hengyunchang, Shenzhou Semiconductor and other companies through its wholly-owned subsidiary Yanquan Technology in 2023. Among them, Shenzhou Semiconductor's main business is the maintenance and testing platform of RF plasma generators, and Hengyunchang focuses on the design, development and manufacturing of plasma power systems. It is a specialized and innovative small giant and a national high-tech enterprise that provides core component solutions for the localization of major equipment in the semiconductor and other fields.
It is reported that Hengyunchang and Tuojing Technology have signed a memorandum of strategic cooperation, and some RF power products have passed the verification of Tuojing Technology and are supplied in batches.
Shanghai IAN Semiconductor started out by repairing products such as RF generators. It has been in the field of semiconductor technology for more than 20 years and began to independently develop RF generators and RF matching products in 2018. IAN Semiconductor's many years of experience in product repair has not only accumulated technology, but also accumulated rich customer resources. According to insiders of the company, nearly 95% of wafer fabs are currently its customers. "Our biggest advantage is low cost and a wide range of styles. In the past five years, we have been able to achieve 80%-90% domestic substitution in 6-inch and 8-inch lines; in the next five years, we expect the product coverage rate of 12-inch lines to reach 50%."
North Huachuang Microelectronics, a wholly-owned subsidiary of North Huachuang , acquired Beijing Broadcasting Technology's RF application technology-related assets in 2020 to enhance the company's RF application technology level.
Yingjie Electric focuses on power control power supply, and has the ability to replace domestic RF power supply of some semiconductor equipment (etching machine, PECVD, etc.) and mass production, and the research and development of RF power supply of other equipment is also progressing in an orderly manner. Yingjie Electric's RF power supply related products include RHH series RF power supply, RLS series RF power supply, RMA series matching, etc.
Anyone has the full report? Would be really interesting to see how YMTC is coping with Mainstream NAND Makers in events of recent sanctions on them
Professor Wang Wei's team at Peking University has made progress in chip thermal management
Professor Wang Wei's team from the School of Integrated Circuits, Peking University, the National Key Laboratory of Micron and Nano Processing Technology, and the High-Precision Innovation Center for Integrated Circuits proposed a double "H" manifold embedded microchannel heat dissipation solution
With the widespread application of a new generation of wide bandgap semiconductor materials represented by GaN, the performance of power devices has been greatly improved. However, due to the limitations of device thermal management performance, GaN power devices can only achieve 20% to 30% of their theoretical performance. Embedded microfluidic cooling technology integrates microfluidics inside the device, avoiding almost all external thermal resistance, and uses direct convection heat transfer of the fluid to complete efficient heat transport. Therefore, it has a strong heat dissipation capability and is considered to be one of the key technologies most likely to break through the thermal management bottleneck in the future. However, the device structure of actual electronic devices is mostly a composite structure with more than two layers, and the heat generation mode also shows a multi-size trend, which poses a great challenge to the design and preparation of the heat sink. In thermal design, it is necessary to systematically analyze the thermal resistance composition in the actual device heat dissipation path and reduce the key thermal resistance.
To address this key issue, Professor Wang Wei's team from the School of Integrated Circuits of Peking University, the National Key Laboratory of Micron and Nanofabrication Technology, and the Advanced Innovation Center for Integrated Circuits proposed a double "H" manifold embedded microchannel cooling solution. At the same time, they integrated a scale-adjustable heating array on the microchannel radiator and tested the heat dissipation performance of the microchannel radiator for heat sources of different sizes under different operating modes.
After actual measurement, the heat flux density of the microchannel heat sink for a 500 × 500 μm2 heat source reached more than 1200 W/cm2, the average temperature rise was less than 60 °C, and the convection heat transfer coefficient reached 1.5×105 W/(m2?K). In addition, this work also constructed a heat-flux coupling simulation and theoretical model based on experimental data, and systematically summarized the changes in heat sink thermal resistance, one-dimensional conduction thermal resistance, and diffusion thermal resistance in typical structures of electronic devices in multiple scenarios. The study found that when the substrate size is fixed, the change in the size of the hot spot from small to large will cause the main thermal resistance in the device to change from diffusion thermal resistance to heat sink thermal resistance. Therefore, different heat dissipation methods need to be adopted for point heat sources and surface heat sources according to the change trend of their main thermal resistance.
With the widespread application of a new generation of wide bandgap semiconductor materials represented by GaN, the performance of power devices has been greatly improved. However, due to the limitations of device thermal management performance, GaN power devices can only achieve 20% to 30% of their theoretical performance. Embedded microfluidic cooling technology integrates microfluidics inside the device, avoiding almost all external thermal resistance, and uses direct convection heat transfer of the fluid to complete efficient heat transport. Therefore, it has a strong heat dissipation capability and is considered to be one of the key technologies most likely to break through the thermal management bottleneck in the future. However, the device structure of actual electronic devices is mostly a composite structure with more than two layers, and the heat generation mode also shows a multi-size trend, which poses a great challenge to the design and preparation of the heat sink. In thermal design, it is necessary to systematically analyze the thermal resistance composition in the actual device heat dissipation path and reduce the key thermal resistance.
To address this key issue, Professor Wang Wei's team from the School of Integrated Circuits of Peking University, the National Key Laboratory of Micron and Nanofabrication Technology, and the Advanced Innovation Center for Integrated Circuits proposed a double "H" manifold embedded microchannel cooling solution. At the same time, they integrated a scale-adjustable heating array on the microchannel radiator and tested the heat dissipation performance of the microchannel radiator for heat sources of different sizes under different operating modes.
After actual measurement, the heat flux density of the microchannel heat sink for a 500 × 500 μm2 heat source reached more than 1200 W/cm2, the average temperature rise was less than 60 °C, and the convection heat transfer coefficient reached 1.5×105 W/(m2?K). In addition, this work also constructed a heat-flux coupling simulation and theoretical model based on experimental data, and systematically summarized the changes in heat sink thermal resistance, one-dimensional conduction thermal resistance, and diffusion thermal resistance in typical structures of electronic devices in multiple scenarios. The study found that when the substrate size is fixed, the change in the size of the hot spot from small to large will cause the main thermal resistance in the device to change from diffusion thermal resistance to heat sink thermal resistance. Therefore, different heat dissipation methods need to be adopted for point heat sources and surface heat sources according to the change trend of their main thermal resistance.
Xinta Electronics delivers a large number of SiC modules
On July 2, Xinta Electronics' official Weibo account announced that its core power module products have been successfully launched and delivered in large quantities to benchmark customers in the industrial field. Xinta Electronics revealed that they are relying on the Huzhou power module packaging production line and combining their own chip leadership to develop automotive-grade silicon carbide power modules with better performance; they will also customize high-quality silicon carbide power devices and modules based on customers' special needs to assist customers in iterating application solutions and developing product routes.
It is reported that the total investment of the Huzhou power module packaging production line is 100 million yuan. It was officially put into operation in early 2024 and is currently in the mass production ramp-up stage. After the production line reaches full capacity, it will produce 1 million sets of power modules annually, with an estimated annual output value of 300 million yuan.
Juzi Technology: X-ray equipment has been recognized by many customers and is expected to achieve sales this year
Juzi Technology stated in an institutional survey that the company's X-ray equipment was officially launched to the market last year. It has currently carried out verification tests with a number of potential customers. The product performance has been recognized by many customers and is expected to be sold this year.
According to reports, Juzi Technology's machine vision equipment mainly includes automatic optical inspection equipment (AOI), 3D-CT online Xray inspection equipment (AXI), high-speed and high-precision dispensing machines and other products. It is an important supplier to well-known companies or their OEM manufacturers such as Apple, Huawei, Xiaomi, BYD, BOE, Samsung, and Hikvision.
According to the "Research Report on the Development of China's Automotive Electronics Industry and Investment Strategy 2023-2028" released by the China Business Industry Research Institute, the scale of China's automotive electronics market is expected to reach 1,158.5 billion yuan in 2024, with an annual growth rate of approximately 12%.
In the automotive electronics SMT link, with the further improvement of reliability and stability requirements, the demand for X-ray detection is increasing year by year. 3D-CT online X-ray of Juzi Technology is currently mainly used for internal defect detection of PCBA and internal defect detection of semiconductor power devices. The mainstream brands of this type of product in the market are Vitrox in Malaysia, Telus in Taiwan, Omron in Japan, and SAKI in Japan.
