Chinese semiconductor thread II

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tokenanalyst

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Jiangsu Province Integrated Circuit (Wuxi) Industry Special Fund was established, mainly investing in semiconductor equipment, materials and components, etc.​

On June 21, at the press conference on the launch of Jiangsu Province's Strategic Emerging Industries Mother Fund and the establishment of the first batch of industry special funds, it was learned that three funds with a total scale of 10 billion yuan were established in Wuxi, involving two landmark industries and five future industries. They will provide our city's innovative and entrepreneurial projects with more precise integrated, one-stop financing services led by venture capital.

Wuxi's industrial special funds include the "Jiangsu Province Integrated Circuit (Wuxi) Industry Special Fund" (5 billion yuan), the "Jiangsu Province Biomedicine (Wuxi) Industry Special Fund" (4 billion yuan) and the "Wuxi Future Industry Angel Fund" (1 billion yuan).
It is understood that the fund's investment is closely related to the dominant and advantageous industries and key development industries of each prefecture-level city. Integrated circuits and biomedicine are both landmark industries in Wuxi's "465" modern industrial cluster, with a solid industrial foundation and first-mover advantage. Among them, the Integrated Circuit (Wuxi) Industry Special Fund mainly invests in semiconductor equipment, materials and components, third-generation semiconductor materials, production entities and equipment, chip design, etc.

Last year, the scale of Wuxi's future industries reached 100 billion yuan. This year, the "Implementation Opinions on Accelerating the Cultivation and Development of Future Industries" was issued to pragmatically promote the cultivation of "5+X" future industries. The Wuxi Future Industry Angel Fund will further support cutting-edge future industries such as synthetic biology, general artificial intelligence, and quantum technology.

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tphuang

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curiouscat said:
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Looks like Bytedance has assumed that it makes more sense for them to develop their own chips rather than relying on Huawei or NVIDIA.
Click to expand...
i think this got denied by Bytedance.

I see no reason why they can't design AI inference chips, but training chips is a little harder. And working with broadcom to do it seems like it will not be sanction compliant.

They got a huge order for Ascend training chips.
 
H

Hyper

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tphuang said:
i think this got denied by Bytedance.

I see no reason why they can't design AI inference chips, but training chips is a little harder. And working with broadcom to do it seems like it will not be sanction compliant.

They got a huge order for Ascend training chips.
Click to expand...
Inference is easy. They are training on Nvidia chips on Oracle Cloud. Atleast some of it.
 
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curiouscat

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tphuang said:
i think this got denied by Bytedance.

I see no reason why they can't design AI inference chips, but training chips is a little harder. And working with broadcom to do it seems like it will not be sanction compliant.

They got a huge order for Ascend training chips.
Click to expand...
I just checked their website and they’re hiring semiconductor people so they must be working on something. Possibly the inference chips you mentioned. I agree that designing the training chips is difficult nevermind supporting another entire software stack for them.
 
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tokenanalyst

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With friends like that who need enemies.​

US export restrictions have caused a backlog of semiconductor equipment inventory in South Korea, which is overwhelmed​


According to recent news from the South Korean industry, since the United States imposed sanctions on China in the semiconductor field, South Korea's inventory of old semiconductor equipment has been seriously accumulated, which has resulted in unbearable storage costs and annual rent of more than 20 billion won (about 104.6 million yuan).
This cost has become a heavy burden for related companies. Industry insiders predict that Samsung Electronics and SK Hynix are likely to conduct a comprehensive cleanup and sell old equipment from the United States and Europe in exchange for hundreds of millions of dollars in cash.
Sources said that since the United States began restricting the export of semiconductor equipment to China (including second-hand equipment) in October 2022, South Korean semiconductor manufacturers have placed most of their old equipment in warehouses. Under pressure from the United States, Samsung only sells older, easier-to-manufacture back-end process equipment to China, but not front-end process equipment; SK Hynix also does not sell old front-end process equipment from the United States and Europe.
Although not all second-hand equipment is subject to U.S. monitoring, South Korean companies still need to be cautious to avoid causing U.S. dissatisfaction.
Industry insiders pointed out that the cost of renting warehouses for second-hand equipment alone is as high as several billion won per month. If this situation continues, it will become increasingly difficult to find enough storage space for these equipment.

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tokenanalyst

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Xinghang Technology's semiconductor chip high-reliability and high-density packaging project went into production​

Xinghang Technology's semiconductor chip high-reliability and high-density packaging project goes into production
On June 21, the production line opening ceremony of Zhengzhou Xinghang Technology Co., Ltd. (hereinafter referred to as "Xinghang Technology") and the opening ceremony of the Zhengzhou base were held in Zhengzhou Aviation Industry Park, Henan Province, marking the opening of the high-reliability and high-density packaging project and the addition of new forces to Henan's high-end manufacturing industry.
It is understood that the semiconductor chip industry is a key area leading a new round of scientific and technological revolution and industrial transformation, and is also one of the most iconic and representative industries of new quality productivity. As an important part of chip manufacturing process, advanced packaging technology can achieve efficient connection and reliable protection between chips and external circuits by adopting new packaging materials, processes and structures, which is of great significance to the development of chips towards smaller size, higher performance, lower power consumption and lower cost.
The high-reliability and high-density packaging project is a chain-strengthening and chain-complementing project introduced by Zhengzhou Airport Economic Zone around the high-end manufacturing industry. After completion, it will realize the extension of the layout from high-density packaging to system-level packaging, and from power device packaging to industrial module power supply assembly, and become an important base for the production of integrated circuit packaging, power device packaging, and power modules in our province. It is of great significance to promote the extension, complementation, and strengthening of the high-end manufacturing industry in Zhengzhou Airport Economic Zone and even Henan Province.
"The first phase of the project launched today mainly covers the comprehensive layout of DFN (Double Flat No-Lead Package), QFN (Quad Flat No-Lead Package) and BGA (Ball Grid Array Package) packaging production lines." The person in charge of Xinghang Technology told reporters that these packaging technologies have the advantages of small size, high pin density, and good heat dissipation performance, and are widely used in consumer electronics packaging fields such as mobile phones, computers, communications, and automobiles. With the commissioning of the production line, the company will focus on bottleneck technologies and cutting-edge technologies to increase its efforts to promote iterative upgrades and disruptive innovations in industrial technologies, and provide comprehensive and efficient one-stop, shelf-based packaging and testing services for multiple fields such as 5G, Internet of Things, artificial intelligence, and automotive electronics.

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