Chinese semiconductor thread II

tokenanalyst

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Join hands with Huawei Kunpeng to help build a domestic EDA platform​


Faced with the uncertainty of the global supply chain, domestic processors have risen and become an important support for the development of China's digital industry. Huawei also launched its self-developed Kunpeng processor in 2019. Based on the ARM architecture, it aims to build a computing platform with independent intellectual property rights and create an important computing infrastructure for all its digital applications.

To this end, Huawei has adopted an open ecosystem strategy. By opening the instruction set architecture of the Kunpeng processor, it invites partners to jointly develop and optimize software to adapt to the Kunpeng platform and promote the coordinated development of the entire industry chain.

In July 2021, Xinhuazhang's related products passed the Huawei Kunpeng computing field OpenLab compatibility test and became a Huawei certified ISV partner. In 2022, Xinhuazhang GalaxSim won the first prize in the Huawei Kunpeng Innovation Competition.

At present, Xinhuazhang's core EDA software products have completed the porting of the Kunpeng platform , and have completed a lot of fruitful development work in compilation environment adaptation, C++/ASM compilation adaptation, cmake and other compilation script adaptation, and third-party library adaptation.

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Compatibility is only the first step in the construction of the entire ecosystem. Xinhuazhang also optimizes code and compilation based on the characteristics of Kunpeng processors, and continues to support EDA computing to achieve performance excellence on Kunpeng server clusters. The development of parallel computing methods such as multi-threading and multi-process is one of the important directions.

Based on domestic architectures such as the Kunpeng processor, Xinhuazhang's logic simulator GalaxSim and formal verification tool GalaxFV can effectively utilize Kunpeng's high-performance cluster to improve compilation and computing, accelerate coverage convergence at different levels of performance and parallelism, and significantly improve the efficiency of system-level chip simulation and verification.

Among them, GalaxSim has achieved a 2-3 times improvement in simulation performance on multiple customer test cases , significantly reducing the time for simulation regression testing.

The combination of domestic EDA platforms and Huawei Kunpeng processors is not only an important part of Huawei Kunpeng's ecological construction, but will also provide a safe, reliable and efficient design environment for the domestic semiconductor industry. The cooperation between the two parties will accelerate the development of domestic EDA tools, enhance the independent innovation capabilities of the domestic semiconductor industry, and provide a solid foundation for building a safe and controllable information technology system.

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tphuang

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Rumor has it that the 28nm lithography machine was delivered to SMIC this January
i mean lithography machine was delivered before that, but whether they are used for HVM i the question. you don't need to start production of the new Guowang plant unless you plan to ramp up lithography production
 

tokenanalyst

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Chuangrui Spectrum SiC Minority Carrier Lifetime Quality Imaging Detection System Completes Order Delivery​


Recently, the SiC minority carrier lifetime quality imaging detection system, a semiconductor industrial detection product of Spectrum Optics, was signed a purchase contract with a well-known customer in the industry and was officially delivered. This is another milestone for Spectrum Optics in the field of third-generation semiconductor detection.The official delivery of this system marks that Chuangrui Spectroscopy has been fully recognized by the market in the field of industrial semiconductor quality inspection.

The Chuangrui SiC minority carrier lifetime quality imaging detection system is the world's first third-generation semiconductor defect (crystal quality and point defect concentration) detection equipment based on transient spectroscopy technology. It not only achieves full independent domestic substitution of related technologies, but also comprehensively surpasses imported similar products in various technical indicators. The successful delivery and successful application of this will help the high-quality development of the domestic SiC industry and promote the further improvement of SiC epitaxial growth quality.

Compared with the traditional microwave conductivity attenuation method (point scanning detection mode), the full-frame imaging detection method developed by Chuangrui Spectrum based on transient spectroscopy technology has greatly improved key parameters such as spatial and temporal resolution and detection efficiency, and can be widely used in the rapid detection and screening of large quantities of wafers on the production line.

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tphuang

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very interesting

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We know now that Huawei's Ascend chips are in very high demand, but looks like it started to sell its chips back in 2021 and only government data centers would use its chips (I think there are charts of this)

Nobody would use something other than Nvidia. I remember back in 2022 when Chinese chipmakers like Biren came out wit their products, Huawei was advising all the chipmakers to stick together and come up with a unified standard, but that was ignored by others. But here is what i looked like, nobody wanted Ascend chips. This only started to turn around in early 2023
 

siegecrossbow

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very interesting

View attachment 130849

We know now that Huawei's Ascend chips are in very high demand, but looks like it started to sell its chips back in 2021 and only government data centers would use its chips (I think there are charts of this)

Nobody would use something other than Nvidia. I remember back in 2022 when Chinese chipmakers like Biren came out wit their products, Huawei was advising all the chipmakers to stick together and come up with a unified standard, but that was ignored by others. But here is what i looked like, nobody wanted Ascend chips. This only started to turn around in early 2023

In other words, thank you Raimondo once again.
 

gabriel.shenton

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just curious, when could SMIC or Huawei ramp up its 7nm (5nm in the future) production so Huawei could cut prices? some posts mentioned 2nd of this year.

with both Apple and Nvidia offering big discounts in China now, I don't think Huawei's products are competitive with the discounted high-end products from Apple or Nvidia, unless you want to support "Made in China", personally I fail to see Huawei's products provide better values for the money?

Huawei is best stuck at 5nm for the foreseeable future unless domestic EUV comes out while Apple is moving into 2nm soon, as long as Apple is willing to cut prices, very hard for Huawei to beat Apple's value proposition.
 
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ansy1968

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just curious, when could SMIC or Huawei ramp up its 7nm or 5nm production so Huawei could cut prices? some posts mentioned 2nd of this year.
5nm? we can expected Limited production this year with an increase next year.

About 7nm, I'm expecting a massive increase with a parallel production with SMIC SN1 and SN2 Shanghai FAB using ASML DUVI and those of SMIC Beijing with a full domestic 7nm line in late or early next year.
with both Apple and Nvidia offering big discounts in China now, I don't think Huawei's products are competitive with the discounted high-end products from Apple or Nvidia, unless you want to support "Made in China", personally I fail to see Huawei's products provide better values for the money?
Would you like to pay an over price Iphone with a better engineer and cheaper Huawei? I know I won't.
Huawei is stuck at 5nm for the foreseeable future while Apple is moving into 2nm soon, as long as Apple is willing to cut prices, very hard for Huawei to beat Apple's value proposition.
Well the competition is against the US which will be producing their 5nm Arizona based TSMC by late 2026 or early 2027. In this area the Chinese had the American beat by 2 years without any outside help using old tech DUVI. Now let that sink in cause by the year the US is mass producing its 5nm chip, the Chinese will Commercially producing 3nm chips using its owned EUVL and also introducing its 2nm node process leaving behind the US by at least 2 generation. By 2027 both Chinese (TSMC and SMIC) will be among the top three leading FAB and all of them will be ASIANS.
 

Hyper

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Glancing through the internet. Samsung seems to be intrested in 3D dram. So lithography driven scaling for dram is about to end. High-na euv seems to be the last one unless hyper-na goes into hvm. Lithography seems to be running out of steam.
 

vincent

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Rumor has it that the 28nm lithography machine was delivered to SMIC this January
Not really a rumour

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国产EUV光刻机的进展
截至目前,国产EUV光刻机的研发取得了一定的进展:
28nm浸没式光刻机:SMEE于2023年12月成功研发出28nm浸没式光刻机,并交付给中芯国际。
7nm光刻机:SMEE计划在2027年实现7nm光刻机的量产。

SMEE successfully developed 28nm lithographic equipment in December 2023 and delivered to SMIC.
SMEE plans to mass produce 7nm lithographic equipment in 2027.
 
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