yeah. 100 percent EUV domestic line will take time.. Lithography is just one piece in entire supply chain ..
domestically produced EUV prototype is near but verification and testing alone will take much time.
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Chinese semiconductor thread II
- Thread starter vincent
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domestically produced EUV prototype is near but verification and testing alone will take much time.
This newly built Huawei R&D center already started work in December 2023 ..As far as EUV, just follow CETC and Huawei with its new campus in Shanghai:
EUV isn't even the end all be all. There are a million and one things in this bubbling cauldron of growth that is the China semicon landscape right now. Things like packaging, multiple passing schemes, etc. that can extend competiveness up to 3nm without EUV, there are things that can blow the current state of EUV out of the water like SSMB and then there are others like Graphene, Photonics and Quantum that make EUV and the current state of chip production absolutely meaningless.
The key to this is gaining control of China's own market -- the world's largest by wide margin. Replace imports with domestic chips and you have the resources to not only survive but to do anything you want and dominate. Right now, that market is 50% of the global share and is still importing more chips than oil.
US is also behind the cutting edge chip technology, because US depends on TSMC for fabbing Intel's 4nm chips. Intel is stuck at 10nm/7nm chips, so technically, even Intel is behind SMIC.
It's a bit disturbing reading this from knowledgeable members. What's the reason for this pessimistic timeline? We know CIOMP has either already completed its LPP prototype or will this year. Unlike SMEE's DUVi stuck in "verification", there isn't an alternative source of EUV lithography machines domestic fabs would rather have. It's not CIOMP's EUV or ASML's like the case with DUVi, it's CIOMP or nothing.
I don't think the SMEE DUVi case should be used as a model for EUV adoption.
Xinyang Silicon Micron completed Series B financing of over 100 million yuan, focusing on the research and development of semiconductor wet process electroplating equipment
Xinyang Silicon Semiconductor (Shanghai) Semiconductor Technology Co., Ltd. (hereinafter referred to as "Xinyang Silicon Semiconductor") announced the completion of Series B financing of over 100 million yuan. This round of financing was led by Guoxin Investment, followed by Shanghai Science and Technology Innovation and China World Trade Industry Fund.
Xinyang Silicon Semiconductor was reorganized in April 2016 by Shanghai Xinyang Semiconductor Materials Co., Ltd. and Silicon Semiconductor Technology (Shanghai) Co., Ltd. It has created an R&D center test platform and manufacturing base, with complete R&D and production capabilities.
Xinyang Silicon Micron focuses on the research and development, production, sales and service of semiconductor wet process electroplating equipment and related wet equipment, providing new fully automatic electroplating machines with extremely high cost performance. Its independently developed equipment includes horizontal electroplating equipment, chemical plating equipment, cleaning/removing equipment, liquid supply systems, etc. Xinyang Silicon Semiconductor Equipment News shows that Xinyang Silicon Semiconductor’s factory buildings include 3,000 square meters of Songjiang headquarters, 80 acres of Haining factory, and 10 acres of Lingang R&D center.
This isn't exactly true. Intel's fab in Ireland can produce 4nm chips. Currently Intel does not have enough production to produce a lot at the fab though. So they are sourcing some chiplets from TSMC and others from their own fabs.
PikeCowboy
Junior Member
I would say that market economics (distribution of resources) is a distinct concept from capitalism/communism (ownership of means of production)
If Intel fab at Ireland can produce 4nm, why can't they produce 4nm in US? It doesn't make sense.
The subsidiary won the bid for the semiconductor silicon carbide complete line wet process equipment order and completed the contract signing.
Recently, the company's subsidiary Chuangwei Microelectronics (Changzhou) Co., Ltd. (hereinafter referred to as: Chuangwei Microelectronics) took the lead in the comprehensive evaluation of technology and business in the bidding, won the bid for the semiconductor silicon carbide complete line wet process equipment order, and successfully completed the contract signing.
Recently, the company's subsidiary Chuangwei Microelectronics (Changzhou) Co., Ltd. (hereinafter referred to as: Chuangwei Microelectronics) took the lead in the comprehensive evaluation of technology and business in the bidding, won the bid for the semiconductor silicon carbide complete line wet process equipment order, and successfully completed the contract signing.
This winning of the bid marks that Chuangwei Microelectronics' 6/8-inch trough and single-chip fully-automatic wet etching and cleaning equipment has covered the entire etching and cleaning process of silicon carbide devices and has the ability to replace imported equipment. Since its establishment in 2020, Chuangwei Microelectronics has relied on the platform of Jiejia VEICHI Group to share talents and technologies, focus on integrating domestic and foreign wet technology and resources, and introduce expert teams from Taiwan, South Korea, Japan and other countries to continuously overcome difficulties and independently Innovation and outstanding achievements.
