Chinese semiconductor thread II
- Thread starter vincent
- Start date
What is the limit can 2000i make for memory? We know 5nm chips is possible with 2000i, how advanced in term of memory?
The number of layers in DRAM is not constraint by lithography but rather aspect ratio in etching.
What can be said about CXMT?
did you get DRAM mixed up with Nand flash? But regardless, etching equipment seems more important in memory chip production than the lithography machines themselves. Micron has been able to get to D1b without use EUV machines. I see no reason why CXMT cannot get to D1a using 2050i. Based on the timeline we are looking at, EUV absence shouldn't be a major issue for CXMT's development. If they are not moving faster on schedule, that's just their own incompetence + difficulty in getting around big 3's IPs
Picosecond solid-state DUV laser for dark field inspection tool for 28nm and below developed by Inno laser. RSlaser and several other domestic laser makers also have similar lasers. Three key components for defect inspection tools: laser/light source, specialized cmos/ccd detector and image processing algorithms.
Huawei ecosystem and products made by Huawei to replace American or Western products (Upgrade 20240420)
Smart Phone, Tablet, Wearable: Apple, Samsung ✖
Smart Watch: Apple, Samsung ✖
PC, Notebook: Dell, HP ✖
Ascend AI Chip: Nvidia ✖
Kirin 5G Chip: Qualcomm ✖
HarmonyOS Smart Phone: Google/Android ✖
HarmonyOS PC: Microsoft Windows ✖
HarmonyOS Car: Tesla ✖
Own AI model: ChatGPT ✖
5G/5.5G Equipment : Other 5G Equipment ✖
MetaERP: IBM, SAP ✖
EDA Semiconductor Design Software: Other EDA Companies ✖
Huawei Cloud: Amazon, Google, Microsoft ✖
TV: Samsung, LG ✖
EMUI 13 (Device Connection): Google ✖
Smart Mines (Mine Automation)
Smart Port (Port Automation)
Smart PV (electrical inverter)
5G Smart Factory (Factory Automation)
Smart Solar (green energy system)
Huawei Cloud AI Model (Accelerating New Drug Development)
Luna solar power solution
Financial AI contact center solution
residential storage solutions
Smart door lock (AI 3D face recognition lock)
AI weather model Pangu-Weather, new AI weather regional model Zhiji
LiDAR (10% market share in China): Luminar, Velodyne ✖
Industrial and commercial energy storage device (world’s first)
Visual intelligent driving solution (version with LiDAR, version without LiDAR)
Product in preparation
Huawei subsidiary SWAYSURE: DRAM Chips (Shenzhen): Samsung, SK-Hynix ✖
Huawei subsidiary PST: Logic Chips (Shenzhen): TSMC, Samsung, Intel ✖
Huawei subsidiary PXW: Image Sensors, RF Chips (Shenzhen): Sony ✖
Huawei Acquisition of SiEn Integrated Circuits: Power Chips (Qingdao): TSMC ✖
Huawei acquisition JHICC: DRAM Chips (Quanzhou, Fujian): Samsung, SK-Hynix ✖
EUV (SiCarrier and EUV patent sharing and human resources collaboration): ASML ✖
6G : Other 6G Equipment ✖
Smart Phone, Tablet, Wearable: Apple, Samsung ✖
Smart Watch: Apple, Samsung ✖
PC, Notebook: Dell, HP ✖
Ascend AI Chip: Nvidia ✖
Kirin 5G Chip: Qualcomm ✖
HarmonyOS Smart Phone: Google/Android ✖
HarmonyOS PC: Microsoft Windows ✖
HarmonyOS Car: Tesla ✖
Own AI model: ChatGPT ✖
5G/5.5G Equipment : Other 5G Equipment ✖
MetaERP: IBM, SAP ✖
EDA Semiconductor Design Software: Other EDA Companies ✖
Huawei Cloud: Amazon, Google, Microsoft ✖
TV: Samsung, LG ✖
EMUI 13 (Device Connection): Google ✖
Smart Mines (Mine Automation)
Smart Port (Port Automation)
Smart PV (electrical inverter)
5G Smart Factory (Factory Automation)
Smart Solar (green energy system)
Huawei Cloud AI Model (Accelerating New Drug Development)
Luna solar power solution
Financial AI contact center solution
residential storage solutions
Smart door lock (AI 3D face recognition lock)
AI weather model Pangu-Weather, new AI weather regional model Zhiji
LiDAR (10% market share in China): Luminar, Velodyne ✖
Industrial and commercial energy storage device (world’s first)
Visual intelligent driving solution (version with LiDAR, version without LiDAR)
Product in preparation
Huawei subsidiary SWAYSURE: DRAM Chips (Shenzhen): Samsung, SK-Hynix ✖
Huawei subsidiary PST: Logic Chips (Shenzhen): TSMC, Samsung, Intel ✖
Huawei subsidiary PXW: Image Sensors, RF Chips (Shenzhen): Sony ✖
Huawei Acquisition of SiEn Integrated Circuits: Power Chips (Qingdao): TSMC ✖
Huawei acquisition JHICC: DRAM Chips (Quanzhou, Fujian): Samsung, SK-Hynix ✖
EUV (SiCarrier and EUV patent sharing and human resources collaboration): ASML ✖
6G : Other 6G Equipment ✖
Huawei before the ban was notoriously international -- as it should -- at the time. It went for best in class, what nearly killed it was HiSilicon using TSMC exclusively.
This is the great gift of the ban to China.
That said, without the ban, Huawei would have been a much more dominant global behemoth than today. It was number 1 in cellphones with the Kirin being on the cutting edge until the kneecapping. But it would suppliers in the West, Japan and Korea. Its chips would have been more than likely made only in Taiwan.
Today, to get back to that position Huawei would be doing it with a completely Chinese supply chain.
Last edited:
from tests posted online of the CPU and GPU performance of Kirin-9010 vs other notable chips
Heat is less of an issue now?
In energy saving mode, Kirin 9010 is utilizing about 7% less power than 9000S. I would think a lot of that comes from improvements in the big core.
The improvement is more visible in gaming, which is probably due to a combination of CPU improvements as well as drivers. That you are looking at maybe 20% improvement or even more