Significant improvement here in GPU
Now gotten to 58.9 fps while consuming just 5.34W
Mate 60 Pro was at 52.6fps and 6.2W for the same game
Snapdragon 8 Gen 2 is 57.1fps and 6.3W
Huawei did some really good stuff here
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Significant improvement here in GPU
Now gotten to 58.9 fps while consuming just 5.34W
Mate 60 Pro was at 52.6fps and 6.2W for the same game
Snapdragon 8 Gen 2 is 57.1fps and 6.3W
Huawei did some really good stuff here
A major breakthrough! Zunxin Intelligent Technology AMHS system received the first overseas order in China!
Zunxin Intelligent Technology successfully obtained a formal AMHS order from South Korea’s Samsung Group . This major breakthrough not only marks that Zunxin has further consolidated its leading position in the domestic AMHS field, but also made historic progress in overseas markets as a Chinese semiconductor manufacturing enterprise, becoming the first Chinese company in the industry to successfully enter overseas markets. Manufacturer.
Break through bottlenecks and lead the trend
In the field of AMHS, domestic manufacturers have long faced the dual pressure of technical bottlenecks and the monopoly of Japanese companies (Company D and Company M). However, Zunxin Intelligent Technology Group has always adhered to China's smart manufacturing policy of linking production with automation and empowering manufacturing with intelligence. Adhering to the concept of software + hardware combined with comprehensive product coverage; through continuous and large-scale technical research and R&D investment, we have successfully broken through this bottleneck. In the end, it gained recognition in the international market through its excellent technical strength and leading overall solution capabilities.
Exploring overseas markets and taking steps toward globalization
This breakthrough of Zunxin in overseas markets not only demonstrates its technical strength and product quality, but also wins more opportunities and space for domestic semiconductor equipment manufacturers in the international market, and also injects new vitality and vitality into the development of the entire industry. power. Currently, as Zunxin is about to release a new generation of software and hardware products this year, it has received many invitations from well-known FAB factories in Taiwan and Japan to conduct evaluation and technical exchanges on software systems and whole factory planning. It is expected to gradually be adopted by the world. Favored by well-known fab factories and widely used.
Break through bottlenecks and lead the trend
In the field of AMHS, domestic manufacturers have long faced the dual pressure of technical bottlenecks and the monopoly of Japanese companies (Company D and Company M). However, Zunxin Intelligent Technology Group has always adhered to China's smart manufacturing policy of linking production with automation and empowering manufacturing with intelligence. Adhering to the concept of software + hardware combined with comprehensive product coverage; through continuous and large-scale technical research and R&D investment, we have successfully broken through this bottleneck. In the end, it gained recognition in the international market through its excellent technical strength and leading overall solution capabilities.
Exploring overseas markets and taking steps toward globalization
This breakthrough of Zunxin in overseas markets not only demonstrates its technical strength and product quality, but also wins more opportunities and space for domestic semiconductor equipment manufacturers in the international market, and also injects new vitality and vitality into the development of the entire industry. power. Currently, as Zunxin is about to release a new generation of software and hardware products this year, it has received many invitations from well-known FAB factories in Taiwan and Japan to conduct evaluation and technical exchanges on software systems and whole factory planning. It is expected to gradually be adopted by the world. Favored by well-known fab factories and widely used.
China's first large-chip (Wafer Scale Packaging?) advanced packaging dedicated photolithography machine is delivered to the factory.
The "Exposure Moment - 3D Heterogeneous Chip Packaging Technology Seminar" organized by Guangdong Microtechnology Industrial Research Institute (referred to as "Guangdong Industrial Research Institute") and the first domestic large-chip advanced packaging dedicated lithography machine were delivered. The factory ceremony was held at Guangdong Yuehai Integration Technology Co., Ltd (3DSEMI). (hereinafter referred to as "Yuehai Integration") in Zengcheng District.
The first domestic advanced packaging dedicated photolithography machine for large chips delivered to the factory this time was independently developed by Xingkong Technology (I-Star). It can provide photolithography processing technology for the integrated manufacturing of chiplets and 2.5D/3D large chips.
According to the data, Yuehai Integration was established in January 2022. It was initiated by Xingcheng Capital and Bay Area Sensor Industry Group. Guangzhou Industrial Investment led the investment, and provincial, municipal and district state-owned assets jointly participated in the investment. It focuses on the fields of semiconductor wafer-level and system-level advanced packaging, and uses leading TSV and 2.5D/3D system-level packaging technologies to accelerate the localization process of the chip industry. The first phase of the project will see the first batch of equipment come online in May 2023, and mass production will begin in early 2024.
Guangdong Industrial Research Institute is a new R&D institution. In 2023, Guangzhou Industrial Investment, Zengcheng District and Zengxin Technology launched the construction of the Guangdong Industrial Research Institute pilot line project, effectively filling the gap in the high-end R&D pilot line of 12-inch characteristic technology in Guangdong Province.
The first domestic advanced packaging dedicated photolithography machine for large chips delivered to the factory this time was independently developed by Xingkong Technology (I-Star). It can provide photolithography processing technology for the integrated manufacturing of chiplets and 2.5D/3D large chips.
According to the data, Yuehai Integration was established in January 2022. It was initiated by Xingcheng Capital and Bay Area Sensor Industry Group. Guangzhou Industrial Investment led the investment, and provincial, municipal and district state-owned assets jointly participated in the investment. It focuses on the fields of semiconductor wafer-level and system-level advanced packaging, and uses leading TSV and 2.5D/3D system-level packaging technologies to accelerate the localization process of the chip industry. The first phase of the project will see the first batch of equipment come online in May 2023, and mass production will begin in early 2024.
Guangdong Industrial Research Institute is a new R&D institution. In 2023, Guangzhou Industrial Investment, Zengcheng District and Zengxin Technology launched the construction of the Guangdong Industrial Research Institute pilot line project, effectively filling the gap in the high-end R&D pilot line of 12-inch characteristic technology in Guangdong Province.
Yes looks like 3DSEMI do Wafer Level Packaging
The question is "large chip" means Wafer Scale Chip?
The question is "large chip" means Wafer Scale Chip?
Can you link the bilibili video?
If this new large-chip lithography machine can connect this Wafer Level Chip in two or four exposures that will increase China supercomputer powers to new levels. SMEE Packaging machines have one biggest exposure fields in the market but will still need a lot stitching at this level
Among local cpus only Phytium fab in mainland China.
Loongson too .. they are blacklisted already. cannot fab 7nm from TSMC/SS.. so only option is SMIC for advanced CPUs ..