Chinese semiconductor thread II

[asiandemographer]

Sir from all indication they are, all the major expansion plan by U-precision and other components provider had been finished. It may not be as massive as ASML now BUT coming from low base we can expect an increase of 100% from 12 prototype to 24 commercialized machine in 2024.

As proof of the pudding, SMEE had delivered 2 units last DECEMBER 2023, so if we can deduced 2 x 12 months = 24 machine and it's on the conservative side, along the way SMEE can able to increase production as they able to master the intricacies of mass producing the machine.

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

SMEE, the Chinese leader in lithography gear that was blacklisted by the US, has announced its plans to deliver its first lithography machine based on 28nm ...


Nevertheless, these restrictions have had an unintended consequence. SMEE, the Chinese leader in lithography gear that was blacklisted by the US, has announced its plans to deliver its first lithography machine based on 28nm technology later this year. The company's first domestically produced SSA/800-10W lithography machine is expected to enter the market by the end of 2023.

And from the @horse (sorry bro can't help myself) mouth itself.

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Aug 1, 2023 — China, reportedly, will launch its first 28-nanometer homegrown lithography machine ... Equipment Group (SMEE) ... lithography machine will be ...

Better to be conservative with estimating advance. Unless I see clear irrefutable signs of SMEE machines being used, I am going to err on the side of caution. In fact some whispers are floating that Huawei might release their own DUV before SMEE. Anyways we will see.

As for machines themselves, ASML still shipped a tonne of machines in Q1, and Japan did too, you can check Japanese export statistics to China.

 

[sunnymaxi]

Better to be conservative with estimating advance. Unless I see clear irrefutable signs of SMEE machines being used, I am going to err on the side of caution. In fact some whispers are floating that Huawei might release their own DUV before SMEE. Anyways we will see.

you are new member .. please read previous pages of this thread.

for your kind information, SMEE has already released DUV/DUVi ..

China is the world largest semiconductor market by a country mile.. with enormous expansion going on, its obvious domestic firms needs many machines. so ASML will have good market share even in foreseeable future.. Japanese have very minimal market share in this segment.

 

[ansy1968]

Better to be conservative with estimating advance. Unless I see clear irrefutable signs of SMEE machines being used, I am going to err on the side of caution. In fact some whispers are floating that Huawei might release their own DUV before SMEE. Anyways we will see.

As for machines themselves, ASML still shipped a tonne of machines in Q1, and Japan did too, you can check Japanese export statistics to China.

SMEE is an integrator, so if Huawei want to join then it's all for the better. All the component had been tested and verify and the component providers had finished their expansion plan and that include Huawei which owned RS Laser. So not only Huawei, you can count on CETC to help in mass production of the machine.

 

[Quickie]

According to the article:
View attachment 128218
If the percentage of sales to China rose then the the bigger drop came from the rest of the world.

Basically China made up half of their sales this year not 2023. If the latest bans take full affect later this year, you are talking about the theoritical possibility of having sales halved if all factors remain the same.

That still works out to about a 25 percent drop in China's sales value between the last quarter of last year and the first of this year. (This implies a 50 percent drop in the rest of the sales other than China!).

However, from the above article, ASML still keeps the full-year 2024 sales forecast unchanged. We will have to see how it will turn out.

 

[GiantPanda]

I believed it when I see it, I'm not belittling India BUT I read this story before and the storyline start with optimism followed by denial and then anger and the process repeat itself. India only had 6 million consumer which you can classified at the upper echelon of the middle class, this class can readily afford premium Iphone and Tesla. So good luck to Elon Musk, I hope for his success in this endeavor cause nobody will buy an Indian made Tesla even it was sold for cheap.

India's proposed labs are just an example. The same effect -- China's market being progressively taken over by local firms and those local firms in turn becoming competitors globally -- will hit every other semicon company in the world.

The legacy chip makers -- anything above 28nm -- will be clobbered first and then the advanced nodes later.

With the business of selling legacy chips to China going away, TSMC will be holding the sub 5nm processes close to the vest. They will no longer have that cushion of selling paid-for nodes for revenue that they can plow back into investing in new processes.

Without China's market, few of the current companies elsewhere can expect grow. More are expected to shrink. Some will die once everything comes online in China.

The ASML quarterly is showing that. No one outside China is sourcing those machines.

 

[tphuang]

Please, Log in or Register to view URLs content!

I haven’t looked into mature chip fab expansion in other countries but there is clearly a lot of this going on in China. Interesting point here that asml sales of duv tells us just how much mature fan expansion is going on outside of china.

 

[tokenanalyst]

China Chemical Mechanical Polishing Situation​

CMP equipment achieves efficient removal of excess material on the wafer surface and global nanoscale planarization through the synergistic effect of chemical etching and mechanical grinding. It mainly includes three modules: polishing, cleaning, and transmission. As line widths become smaller and smaller and the number of layers increases, the technical requirements for CMP become higher and higher, and CMP equipment is used more frequently. In the production process of advanced process integrated circuits, each wafer They will go through dozens of CMP process steps. In this process, CMP technology is a key process to achieve wafer surface planarization in the integrated circuit manufacturing process, and is an important link in promoting process technology node upgrades in integrated circuit manufacturing.​

Please, Log in or Register to view URLs content!

China CMP market size

Polishing market of Silicon/GaN wafers substrates:

Market size of CMP equipment for silicon wafer manufacturing in mainland China from 2024 to 2025 will be approximately 1.96-2.45 billion yuan for 12 inches, and approximately 1.7 billion yuan for 8 inches.

Polishing market for Silicon/GaN Wafer foundry:

The market size of CMP equipment for wafer foundry in mainland China will be approximately 8.4-10.5 billion yuan for 12-inch and 8-inch About 1.2-1.44 billion yuan.

Polishing market for manufactured SiC wafers substrates and foundry:

From mainstream CMP equipment manufacturers, the unit price of 6-inch equipment is approximately 5 million yuan/unit. In summary, it can be estimated that from 2024 to 2025, the market size of CMP equipment for silicon carbide substrate manufacturing in mainland China will be approximately 500 million yuan.

Domestic CMP market competition landscape


The domestic teams that produce CMP equipment are mainly

Huahai Qingke.

Please, Log in or Register to view URLs content!

Shuoke Jingke.

Please, Log in or Register to view URLs content!

Hangzhou Zhongsilicon.

Please, Log in or Register to view URLs content!

Huahai Qingke was established in 2013. Its main products are 12-inch CMP equipment, thinning equipment, liquid supply systems, wafer regeneration, key consumables and maintenance services. Among them, CMP equipment has achieved full coverage of all processes of the 28nm process and has been supplied in batches; several key process CMP equipment of the 14nm process have been simultaneously verified on the client side.

Jingyi Jingwei was established on September 23, 2019. The company is an equipment supplier for overseas batch sales of 8-inch chemical mechanical polishing (CMP) equipment. It launched the first domestic 8-inch CMP production line mass production equipment with independent intellectual property rights. , 12-inch CMP equipment has completed process verification in the international mainstream integrated circuit production line of the 28nm process. At the same time, Jingyi Micro has seized the development opportunities of third-generation semiconductors and launched domestic 6/8-inch compatible CMP equipment, which can be used for special-demand surface polishing processes including third-generation semiconductor materials such as silicon carbide and gallium nitride.

Hangzhou Zhongsi was established in May 2018 and has successfully developed 6-inch, 8-inch and 12-inch CMP equipment. Its products are used in large production lines of well-known integrated circuits, large silicon wafers and third-generation semiconductor customers.

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Shenghejing Micro's three-dimensional multi-chip integrated packaging project FAB3 production plant has started construction.​

Jiangyin High-tech Zone released news that recently, according to the construction needs of Shenghe Jing Micro Semiconductor (Jiangyin) Co., Ltd.'s three-dimensional multi-chip integrated packaging project and ultra-high-density interconnected three-dimensional multi-chip integrated packaging project, Jiangyin High-tech Zone has completed Following the line inspection procedures, the two projects have started construction one after another.

The three-dimensional multi-chip integrated packaging project and the ultra-high-density interconnected three-dimensional multi-chip integrated packaging project are both major industrial projects in Jiangyin City. They are located in the existing factory of Shenghe Jingwei at No. 9 Dongsheng West Road, Jiangyin High-tech Zone. The production plant of the three-dimensional multi-chip integrated packaging project includes the existing FAB2 production plant and the newly built FAB3 production plant. The total construction area of the FAB3 production plant is approximately 56,722 square meters. After the project is completed, it will reach production capacity of 80,000 pieces/month (960,000 pieces/year) of metal Bump (bump process) products and 16,000 pieces/month (192,000 pieces/year) of 3DPKG (three-dimensional multi-chip integrated packaging) products. production capacity. The ultra-high-density interconnected three-dimensional multi-chip integrated packaging project includes three buildings: R&D production plant, R&D workshop, and employee supporting parking building. The total construction area is approximately 154,002 square meters. The goal is to form a monthly production capacity of 4,000 pieces (12 inches). .

It is reported that the three-dimensional multi-chip integrated packaging project and the ultra-high-density interconnected three-dimensional multi-chip integrated packaging project are based on the industrialization of three-dimensional multi-chip integrated packaging and aim to create a new high-end packaging and testing base that is China's leading and world-class.

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Nanocore releases its first 1200V SiC MOSFET​

Nanocore Micro launches the first 1200V SiC MOSFET NPC060N120A series product. The product has an R DSON of 60mΩ. It has two packaging forms: through-hole TO-247-4L and surface mount TO-263-7L. It can provide automotive and industrial specifications. Two levels.
Nanocore's silicon carbide MOSFET has excellent RDSon temperature stability, wider gate drive voltage coverage, and high reliability, and is suitable for electric vehicles (EV) OBC/DCDC, thermal management systems, photovoltaic and energy storage systems (ESS) and uninterruptible power supply (UPS) and other fields.

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

 

[tokenanalyst]