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so 14th institute saw foreign MIC achieving huge gain from using integrated high power SiP packaging. By researching into this, they developed SiP packaging with 5x improvement in heat dissipation. That's pretty good.
So when we see Luxshare taking over Qorvo plant in China which puts together RF packaging, it could potentially open the door for certain advanced RF packaging tech.
“面对新一代装备超高性能、超高密度、超低剖面等重大需求,相控阵阵面亟待解决微系统架构、热学仿真、材料物理、集成工艺等跨学科问题,实现轻薄化、模块化。”14所TR组件先导技术团队以攻坚克难的精神,揭下这个公认难题的“榜单”。
在先进微系统集成架构推进会上,技术团队看到国外基于微系统技术集成大功率SiP组件的报道,互相激励说:“我们一定可以,不仅要做,还要做到领先。”经过跨学科研究和集智攻关,技术团队提出微系统形态新架构,将芯片级微纳集成技术从数字领域拓展到射频领域,SiP组件散热效能提升5倍以上。
so 14th institute saw foreign MIC achieving huge gain from using integrated high power SiP packaging. By researching into this, they developed SiP packaging with 5x improvement in heat dissipation. That's pretty good.
So when we see Luxshare taking over Qorvo plant in China which puts together RF packaging, it could potentially open the door for certain advanced RF packaging tech.