Chinese semiconductor thread II

tphuang

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very interesting here on GaN-on-diamond IC

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金刚石衬底的GaN HEMT异质集成器件的优势、技术难点,及当前的研究现状是什么呢?陈堂胜首科对这些问题进行了一一介绍。

传统基于半绝缘SiC衬底的GaNHEMT综合了AlGaN/GaN异质结的高输运特性和半绝缘SiC衬底的高导热特性两方面优势,在高频、高功率、高效率以及宽带应用方面表现出显著的性能优势。早在2006年已验证GaN微波器件输出功率密度可达到41.4W/mm,但目前工程应用的器件其输出功率密度普遍不到10W/mm,GaN微波功率器件性能还有巨大提升空间,而散热是制约GaN器件输出功率密度提升的瓶颈。金刚石材料的热导率可达22W/(cm·K),是高纯SiC的4倍,多晶金刚石材料的热导率也可达到18W/(cm·K),也就是说,金刚石在导热方面具有天然的优势。但受限于掺杂、异质结等诸多材料关键技术的突破,多年来金刚石微波功率器件发展十分缓慢。而通过将金刚石与目前大功率器件的佼佼者──GaNHEMT进行异质集成,可有效解决现有SiC衬底GaN微波功率器件的散热瓶颈。

金刚石衬底GaN异质集成微波功率器件的核心技术有两点:一是通过金刚石与高质量GaN外延层的异质集成解决现有GaN器件的散热问题,二是通过异质结生长、器件结构设计、器件工艺等核心技术的进一步突破,提升GaN器件单位毫米栅宽极限输出功率密度,这两点结合起来,将器件可用的单位毫米栅宽输出功率密度提升到20W/mm甚至更高。

金刚石衬底GaN HEMT异质集成目前是固态微波器件与电路全国重点实验室的一个重要研究方向。陈堂胜首科向我们介绍了相关固态微波器件与电路全国重点实验室南京分部的基本情况,并重点介绍了实验室在金刚石衬底GaNHEMT异质集成器件方面的研究进展。
theoretical peak power on GaN MIC is 41.4W/mm, but right now such IC cannot hit 10W/mm in practice due to heat dissipation bottleneck. the thermal conductivity of diamond is 4x SiC. As such, we can get to > 20W/mm in output density with diamond substract

@BoraTas and @latenlazy , looks like we can get over 2x power increase on GaN-on-Diamond vs GaN-on-Sic (which btw, is already higher than GaN-on-Si). Some real gains coming if they can get this figured out
 

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Liuxin Industrial Headquarters Building and Semiconductor Packaging New Material Project Started​

On March 24, the groundbreaking ceremony for the Liuxin Industrial Headquarters Building and Semiconductor Packaging New Materials Project was held.
Liu Xin NEWCCESS news shows that the industrial project started this time will be mainly used to develop and manufacture NBF series of electronic insulation laminated films. This product is one of the key core materials for advanced semiconductor processes and is widely used in CPUs, GPUs and AI intelligence. and other high-performance chip packaging. After the project is completed and put into production, it will promote and realize the industrialization of semiconductor packaging "stuck neck" materials, break the pattern of foreign technology monopoly and dependence on imported high-end materials, and ensure the security of the supply chain of domestic advanced semiconductor key materials.
The Mingxin Building project is expected to have a total investment of 860 million yuan. It will build a headquarters office building, production plants and supporting infrastructure, relocate the original production and business premises, and introduce advanced software and hardware equipment to meet the needs of the NBF packaging insulation film new material industry. chemical and PCB drilling covers/pads to expand production.
It is reported that Liuxin Industrial focuses on the research and development of new electronic materials, composite materials and modified materials. It has a complete range of special cover pads for PCB drilling and precision drill pins, which are widely used in electronics, medical, transportation, Internet of Things, aerospace, etc. field. In addition, Liuxin Industrial has also successfully developed NBF series IC carrier board packaging materials, filling the domestic technology gap.

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Grasping the trend of the heterogeneous multi-core era, Xinyihui upgrades EDA tools to continue empowering DSA design​

The market structure of EDA software has not changed much since its birth. Currently, 75% of the market is occupied by the "Big Three" Synopsys, Cadence, and Mentor. Domestically, in 2008, the "National Medium and Long-term Science and Technology Development Plan (2006-2020)" was released, in which EDA software was listed as a major project, and a number of EDA companies emerged in the country. The escalation of Sino-US trade friction in 2018 has also allowed domestic EDA to truly embark on the fast lane in recent years. More emerging EDA companies have emerged, and ChipEasy is one of them.

In the past, as Moore's Law continued to advance, general-purpose processor designs required little change and could double their efficiency by increasing the number of transistors. The era of big data is coming, but with the slowdown of Moore's Law, general-purpose processors have become increasingly unable to improve computing performance by increasing transistor density, and Domain Specific Architecture (DSA) has emerged.

The new generation of dedicated processor design tool FARMStudio developed by Xinyihui for the DSA field is specially created for application scenarios of intensive computing and complex data processing, empowering the ability to efficiently self-research and deeply optimize IP.

FARMStudio upgrades the "Cloud Virtual FPGA" function to make verification more convenient

As the world's first dedicated processor generation tool based on C language description, FARMStudio has achieved a breakthrough in agile design methodology and can effectively help chip design teams complete tasks such as DSA processor software and hardware functional division, architecture verification, and PPA evaluation in a shorter time. , using tools can greatly improve design efficiency and reduce design costs.

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On top of basic functions, FARMStudio has the world's first multi-level verification environment, which realizes multiple levels of mutual verification from C language code to instruction-level cycle-accurate simulation, to circuit RTL simulation, to simulation on FPGA. With the continuous upgrading of FARMStudio, Xinyihui has launched the "Cloud Virtual FPGA Verification" function, which eliminates the need for chip design companies to build an additional FPGA platform to help users verify quickly and conveniently.

"The deployment of FPGA is not convenient enough for application development engineers and architecture engineers. It still requires purchasing and deploying boards and configuring various peripherals and other operations. Our 'cloud virtual FPGA' will be more user-friendly, and users can handle it in the design process After installing the device, application development and board-level verification can be carried out directly on our platform." Zhang Weihang said.

Complementing tools, Xinyihui’s customized IP accelerates chip design

In addition to optimizing the automation and optimization of EDA tools and improving development efficiency, Xinyihui pre-makes the operators needed by customers in specific fields into modules and independently develops processor IP suitable for multiple fields, allowing customers to flexibly customize according to their needs. Requires the use of tools and greatly reduces usage costs.

"From the perspective of the overall IP service model of Xinyihui, we are currently divided into three types," Xu Ming, marketing director of Xinyihui, said, "The first is official standard IP, the second is customized IP for specific customers, and the third This is an IP developed jointly with customers and based on in-depth cooperation with FARMStudio."

Xu Ming said that the official standard IP is a series of general products created by Xinyihui in response to the common needs of many customer products in specific fields. At present, Xinyihui has released E32 DSP series IP for the industrial control field, including E32B (basic configuration), E32F (floating point application), E32AI (AI application) and other different branches to facilitate customers to make refinements according to their own needs. s Choice.​

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With an annual production capacity of 160,000 pieces, the main part of the second phase of Tianke Heda SiC project has been completed.

On March 17, according to "Jinlonghu Release", the main body of the second phase of the Tianke Heda SiC project has been completed, and the internal and external assembly construction of the core is underway. The project has a total investment of 830 million and a construction area of 49,000 square meters.

Judging from the project progress, the second phase of the Tianke Heda SiC project was signed and settled in Xuzhou on March 20, 2023; on August 8, the project officially started; on December 28, the second phase of the Tianke Heda SiC project was fully capped; The project is planned to be completed in June 2024 and put into production in August. A total of 647 units (sets) of single crystal growth furnaces and supporting equipment will be purchased and installed to achieve an annual production of 160,000 SiC substrates. Previously in 2018, Tianke Heda had invested in the first phase of the SiC substrate project in Xuzhou. After the second phase expansion project is put into operation, the annual SiC substrate production capacity of Tianke Heda's Xuzhou base will reach 230,000 pieces and the annual output value will be 10 More than 100 million yuan.

In terms of performance, in November 2023, according to Tianke Heda, in the second half of 2023, the company's revenue exceeded 1 billion yuan for the first time. As of October 2023, the company's revenue has doubled compared with the full year of 2022. The company has served more than 500 domestic and foreign customers and sold more than 600,000 conductive SiC substrates.​
 

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Wanye Enterprise Keshitong launches large-beam ion implanter for CIS (CMOS Image Sensor)


Shanghai Keshitong Semiconductor Co., Ltd. (hereinafter referred to as "Shanghai Keshitong") brought a variety of ion implanters to this industry event. Among them, the most eye-catching one is the newly launched large-beam ion implanter for the CIS (CMOS Image Sensor) field. This is a new product developed by Keshitong based on the conventional large beam ion implanter.

It is understood that low-energy large-beam ion implanters account for the largest demand in the integrated circuit ion implanter market category. They are not only used in logic processes, but are also widely used in chip manufacturing fields such as storage, power, and CIS. The launch of the CIS large-beam ion implanter shows that Keshitong's technology in the field of ion implanters has become increasingly mature and perfect, and it has begun to expand into a wider and deeper market.
The “debut” of new large-beam ion implanter for CIS

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Zhang Changyong, deputy general manager of sales and marketing at Keshitong, introduced that Keshitong’s large-beam ion implanter for CIS is based on the iStellar universal injection platform and optical system that has been proven in batch industrialization by Keshitong. The equipment is mature and stable, comparable to imported advanced models. At the same time, in order to meet the higher requirements of CIS, after a number of technological upgrades and R&D innovations, it has the characteristics of excellent metal contamination control, high-precision injection angle control and other characteristics.
It is understood that Keshitong's CIS ion implanter has received customer orders and will be moved into the customer's production line this month.

Accelerate product development and create a full range of ion implanter product matrix

In recent years, Keshitong's technological achievements are not only in the CIS field. According to previous reports, Keshitong is the first domestic supplier to obtain verification and acceptance of 12-inch integrated circuit large-beam ion implanters and high-energy ion implanters, and has received bulk repurchase orders from many new and old customers.


Zhang Changyong introduced that based on the continuous development of ion implanter technology, Keshitong based on forward design and independent innovation, formed a product development strategy of "universal platform + key technology modules", which can carry out ion implantation according to customer needs and technology trends. The injection machine undergoes on-demand iterations, continuous upgrades, and continuous innovation.

At present, in addition to conventional low-energy large beams, Keshitong has formed a series of products such as ultra-low temperature, heavy metal, and solid-state sources, which are industrially applied in chip manufacturing fields such as advanced logic, advanced storage, and advanced power. This time, CIS large-beam ion The launch of the implanter will further improve the product matrix of Keshitong, expand the business space in the CIS field, and further enhance the market competitiveness of Keshitong ion implanters.

When talking about Keshitong’s future product development plans, Zhang Changyong said that Keshitong will continue to adhere to the product development path of forward design and accelerate the continuous upgrading of existing products and new products based on existing technology accumulation and industrialization foundation. R&D efforts, continuous pursuit of technological excellence, creating a full range of ion implanter product matrix, and contributing more excellent equipment to customers.

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Zn-Ti Oxo Cluster Photoresists for EUV Lithography: Cluster Structure and Lithographic Performance.​


Dalian University of Technology
Shanghai Synchrotron Radiation Facility
Shanghai University

Abstract​

Low reflectivity of multilayer mirror–induced low efficiency of existing extreme ultraviolet lithography (EUVL) has triggered the search for photoresists with heightened sensitivity. For this purpose, considerable research has focused on elements with high extreme ultraviolet (EUV) absorption, leading to considerable advancements. Solubility alteration, often resulting from ligand variations after exposure, is influenced by the cluster structure, markedly impacting lithography sensitivity. Herein, three Ti-based metal clusters, Ti6O4(OEt)8(OMc)8 (T-2), Zn2Ti4O4(OiPr)2(OMc)10 (TZ-1), and Zn4Ti2O2(OAc)2(OBu)2(OMc)10 (TZ-2), are designed and synthesized to elucidate the effects of the structure on lithography. These mixed metal–oxo clusters derived from Ti6O4(OR)8(OOCR)8 and stabilized by identical ligands exhibit structural diversity. The increase in the number of zinc atoms results in marked alterations in the oxo core, thereby triggering alterations in ligand coordination modes. These variations confer metal clusters with different solubility and lithographic properties. Analysis of the photochemical reaction mechanism and theoretical calculations reveal a reactive tridentate ligand coordination mode that considerably improves lithography sensitivity. Therefore, changing the ligand coordination mode by designing a mixed metal–oxo core holds promise for discovering new photoresists for EUV lithography.

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ERS established a company in China—Shanghai Yierisi Semiconductor Electronics Co., Ltd.​


Germany's ERS electronic, a leader in providing temperature management solutions for the semiconductor manufacturing industry, recently announced the establishment of a Chinese company: Shanghai ERS Semiconductor Electronics Co., Ltd. The company is located in Jiading District, Shanghai. Together with ERS China Laboratory, it provides customers and partners with: sales, order processing, technical support, sample display and other related services.

Since 2018, ERS China has grown from a one-person office to a complete team. During its six years of business development in China, ERS's technology and products have been widely praised and won the trust and support of more and more customers. With the surge in business volume, ERS headquarters decided to set up a company in China.

"This decision of the company further consolidates ERS' position in China, reflects its strong support for the ERS China team, and also demonstrates its emphasis on the Chinese semiconductor market." Mr. Zhou Xiang, general manager of ERS China, said, "This not only "
Mr. Laurent Giai-Miniet, CEO of ERS, said, "ERS has always been committed to providing high-quality wafer testing temperature management and advanced packaging equipment solutions to global customers. One of the reasons for setting up the company in China is to better meet the needs of the Chinese market , and provide services closer to customer needs.”

The establishment of ERS China is another milestone in development. The company looks forward to providing customers with better and more convenient services through close cooperation with the Chinese market and promoting the development of the semiconductor industry.

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