Chinese semiconductor thread II

[tphuang]

CAS & NIMTE have developed a diamond-copper composite material with thermal conductivity > 1000 W/m·K, it is highly efficient & 3D composite w/ scalable manufacturing process. Resolved key manufacturing bottlenecks such as dispersion, processing & surface treatment. They are now working with 江西铜业集团 and 宁波赛墨科技有限公司 to drive industrial scale production. This is used in Sugon's C8000 V3.0 MG scale immersion liquid-cooling cabinet solution. Boosts heat transfer capacity of chip modules by 80%. It is used in supercomputing center in Zhengzhou Sugon Scale.

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here is C8000 V3.0, I don't remember if I posted this

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this solution is used in Sugon's ScaleX 10k+ card cluster and used in China's supercomputing centers. Each cabinet can handle MW level of electricity and can dissipate 200W/cm3.

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Note, Sugon here is providing 60k card in the AI for science computing cluster in Zhengzhou, which looks to be using this tech.

 

[tphuang]

two memory chip news today

https://twitter.com/i/web/status/2043950457048183114

3D DRAM with higher memory bandwidth than LPDDR5X using tSV and hybrid bonding stacking. Given the shift by CXMT to domestic equipment, this should be quite the news

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Chinese chipmaker Yangtze Memory Technologies (YMTC) aims to build two more factories in addition to one that will be completed this year

The three new plants will each have the capacity to produce 100,000 wafers per month when fully operational, said three sources who were not authorised to speak to media and declined to be identified.
Unlisted YMTC, China's ⁠largest maker of NAND flash memory chips that store data in smartphones and computers, currently has two fabs which can produce a combined 200,000 wafers per month, they added.

lol on this part, in China, people already know the new lines are fully domestic and Reuters is still going with > 50% domestic, loser news source

YMTC's third factory, which like its first two plants is located in Wuhan, should start operations late this year and be capable of producing 50,000 wafers per month by 2027, according to two of the sources.
The building has been completed and the company is currently installing equipment, they said, adding that more than 50% of equipment has been sourced from domestic companies including critical tools used for ‌vertical ⁠stacking of chip layers.

 

[tokenanalyst]

@tokenanalyst , prof is this significant?, what usage is this lithography used for?

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147 views18 minutes ago

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As the U.S.-China chip war heats up, researchers at the State Key Laboratory in Hangzhou have delivered a stunning ...
New

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(MEBDW) technology, using over 10,000 electron beams working in parallel, is designed to overcome the low throughput limitations of traditional single-beam lithography. It enables high-resolution, maskless patterning, making it suitable for advanced, high-mix, low-volume production and prototyping where mask costs are prohibitive.
Design And Reuse +3
Key Applications & Usage

• Next-Generation Semiconductor Manufacturing: Targeted for 20-nm half-pitch and beyond, as well as 22-nm and 16-nm nodes.
• Maskless Lithography (Direct-Write): Eliminates the need for expensive photomasks (which can cost $5–20 million per layer set), reducing costs for low-volume or prototyping runs.
• Rapid Prototyping and R&D: Used in research institutions and to create high-frequency, optical, and quantum semiconductor devices.
• High-Resolution Nano-Patterning: Capable of sub-10 nm resolution, used for creating nanostructures, NEMS (Nano-Electro-Mechanical Systems), and magnetic recording heads.
• High-Volume Manufacturing (Future Goal): Systems like those developed by MAPPER aimed for 10+ wafers per hour (WPH).
  Design And Reuse +7

Performance Characteristics

• Throughput: By utilizing over 10,000 beams, the technology significantly increases the speed of scanning compared to single-beam tools.
• Data Handling: 10,000-beam systems generate massive data rates, exceeding 1,000 Terabits per second (Tbps), requiring high-speed data reduction and 10 Gbps fiber links for each beam.
• System Examples: The
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  offers high throughput with a max writing area of 12".
  Design And Reuse +4

Advantages Over Conventional Methods

• No Photomasks: Drastically reduces turnaround time and costs for chip revisions.
• Flexibility: Easily adaptable for changes in design without creating new physical masks.
• High Precision: Combines the resolution of electron beams with the efficiency of parallel processing.

Interesting. This will significantly improve China domestic mask manufacturing and help institutions to make chips on a smaller scale, like military chips or rad hard space chips.

 

[tokenanalyst]

BluePoint Touch has completed a C+ round of financing exceeding 100 million yuan, becoming a leading domestic enterprise in six-dimensional force sensors.​

Bluepoint Touch, a leading domestic manufacturer of six-dimensional force sensors, announced the completion of its C+ round of financing, exceeding 100 million yuan. This round was led by Puquan Capital, a subsidiary of CATL, with participation from industry and institutional investors including Zhiyuan Robotics, Galaxy General, Optoelectronic, and Galaxy Yuanhui. This brings the company's total financing rounds to over 100 million yuan, with shareholders including Sequoia China, GF Securities, Fosun Capital, and Zhuhai Science & Technology Industry Group, among other top-tier capital firms. The company is poised to become the first listed company in the robotic force sensor field.

This round of financing will focus on three main areas: first, increasing investment in the research and development of a new generation of high-precision, highly integrated force control sensors to meet the mass production needs of humanoid robots; second, promoting the digitalization and automation upgrade of production bases to strengthen the annual delivery capacity of millions of units; and third, accelerating the expansion of domestic and international markets to enhance global market coverage and brand influence.
The company's products have entered the supply chains of leading companies such as Zhiyuan, Xiaomi, XPeng, and UBTECH, and have achieved shipments of tens of thousands of units to a single customer.

Founded in 2019, Bluedot Touch has built four core technology platforms around force control sensing: elastomer design, embedded hardware, high-precision decoupling algorithms, and six-dimensional calibration. Its six-dimensional force sensor achieves 0.1% FS accuracy, a response time exceeding 10kHz, and 500% overload resistance, with key performance comparable to international standards. The company has achieved revenue doubling and profitability for three consecutive years and has established an automated production base in Guangdong, with a scaled production capacity of 1 million sets of joint force sensors and 200,000 sets of end-effector six-dimensional force sensors per year.

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[tokenanalyst]

China's integrated circuit exports surged 84.92% year-on-year in March.​

the General Administration of Customs released data on China import and export trade in goods for March this year. The data shows that in March, my country's imports, measured in US dollars, increased by 27.8% year-on-year, while exports increased by 2.5%, resulting in a trade surplus of US$51.13 billion. From January to March, imports, measured in US dollars, increased by 22.7% year-on-year, exports increased by 14.7%, and the trade surplus reached US$264.33 billion.

Specifically, mechanical and electrical products ranked first with an export value of US$209.098 billion, a year-on-year increase of 11.21%, and their share of total exports continued to rise.

Among the subcategories, exports of automatic data processing equipment and its parts increased by 37.11% year-on-year; exports of integrated circuits surged by 84.92% year-on-year, further climbing from the 72.6% growth rate in the first two months; exports of automobiles increased by 43.85% year-on-year and exports of ships increased by 35.76% year-on-year, both continuing their strong growth momentum.

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[tokenanalyst]

Angstrom-e Semiconductor Ships 100th Equipment​

Ecore Semiconductor has achieved a significant milestone by shipping its 100th wafer and advanced packaging metrology equipment unit to a customer. This achievement marks the company's transition from initial product development and verification to large-scale mass production and delivery. Starting with the first shipment in January 2023, the rapid progression to the 100th unit reflects continuous improvements in technology iteration, system optimization, and algorithm refinement, demonstrating that Ecore’s equipment has gained substantial customer recognition for its accuracy, stability, and adaptability in complex production line environments.​

The company’s success is attributed to deep collaboration with wafer fab customers and reliable support from supply chain partners. By engaging in joint R&D and responding precisely to frontline technical needs, Ecore has accelerated the evolution of its product capabilities, ensuring that each unit moves effectively from design to stable production use. Driven by synergistic "optics + X-ray" dual technology routes, Ecore has built a comprehensive metrology product system. Optical solutions address high-precision measurements for front-end manufacturing, while X-ray technologies enable detailed characterization of multi-layer structures and materials, extending into advanced packaging scenarios such as wafer bonding and 2.5D/3D packaging.



Looking ahead, the delivery of the 100th unit serves as a new starting point rather than just a scale marker, signaling Ecore’s shift from achieving domestic substitution to pursuing innovation leadership. The company aims to evolve from providing single-point equipment capabilities to offering full-process solutions, helping customers build more efficient and controllable process control systems. In response to the AI-driven industrial cycle and increasing demands for precision in advanced processes, Ecore plans to deepen its core technologies and collaborate with industry partners to enhance yield and precision, moving its market position from "usable" to "leading."

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[tokenanalyst]

JCET has preliminarily verified the application of glass substrates in large-size FCBGAs.​

Recently, JCET Group released its 2025 annual report. The report shows that the company achieved operating revenue of RMB 38.87 billion in 2025, a year-on-year increase of 8.1%, setting a new record; total profit reached RMB 1.74 billion, a year-on-year increase of 5.4%, and net profit attributable to shareholders of the listed company was RMB 1.57 billion. During the reporting period, JCET Group's domestic and overseas factories maintained stable overall operations, with capacity utilization rates remaining at high levels. Advanced packaging capacity, such as wafer-level packaging, maintained high-load operation; revenue related to advanced packaging business reached RMB 27 billion for the year, also a record high.

In terms of R&D, JCET's R&D investment in 2025 will focus on core areas such as high-performance computing, next-generation system-in-package (SiP), high-reliability automotive electronics, and power energy. In the advanced packaging field, the company is promoting the mass production of multi-chip heterogeneous integrated packaging products and continuously expanding its customer base; CPO (Contains-Poly Optoelectronic Package) products have achieved customer sample delivery; glass substrate product development has made positive progress, and the application of glass substrates in large-size FCBGAs has been initially verified; the company is also proactively developing panel-level high-density packaging technology (PLP), laying the technological foundation for high-performance heterogeneous integrated applications. Facing the trends of high integration, thinning, and miniaturization, the company continues to improve its high-density 3D SiP and PoP packaging solutions and is developing multi-layer stacked SiP packaging technology suitable for complex system integration.

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[PopularScience]

8-inch carbon-based integrated circuit production line project with 3 billion RMB investment

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[tokenanalyst]

China Direct Write Lithography Industry is quietly advancing.​

XEBL100 Electron Gaussian Beam Lithography Machine​

Electron beam lithography (EBL) is a nanoscale patterning fabrication device based on high-energy electron beam direct writing technology. This technology uses an advanced electron optics system to focus an electron beam onto a nanoscale spot, selectively exposing photoresist according to a preset pattern under precise computer control. The interaction between the electron beam and the photoresist triggers changes in chemical properties, and after subsequent development, etching, and other processes, a high-precision micro/nano structure is ultimately formed on the substrate.

The XEBL 100 electron beam lithography machine, as a new generation of nanofabrication platform, integrates a 100kV high-brightness thermal field emission electron gun, a conjugate high-speed electrostatic beam gate, and variable axis lens technology. It supports dual-mode operation of high throughput and high precision, is equipped with a 20-bit pattern generator and a multi-stage electrostatic deflection system, and features a single-layer orthogonal structure workpiece stage and a laser interferometric fully closed-loop ranging system. It also has dynamic focusing function, which together ensures the perfect reproduction of ultra-fine patterns.

This device has significant application value in cutting-edge fields such as quantum devices, integrated photonic chips, and nanoelectromechanical systems. It provides key processing methods for new material research and development, cutting-edge physics research, biosensor development, and advanced microelectronics manufacturing, and is an important tool platform for promoting the development of nanotechnology.​

XZPG30 Graphics Generator​

The XZPG-30 pattern generator system is a high-precision electron beam direct-write exposure solution tailored for scanning electron microscopy (SEM). It integrates advanced software and hardware technologies to fully empower nanoscale patterning. The system consists of EBLLayout pattern generator software and an FPGA-based hardware pattern generator. The two work together to build a complete closed loop from pattern design to exposure processing.

In terms of performance parameters, the XZPG-30 system boasts an ultra-high-speed scanning capability of up to 50MHz, with a minimum time increment of 1ns during scanning. Whether it's simple geometric shapes or complex irregular patterns, it can easily achieve accurate exposure. Its accompanying EBLLayout software features a simple and intuitive interface with clear and easy-to-understand operation logic, allowing even novice users to quickly get started. The software also provides a custom drawing function based on optical micrograph positioning, allowing users to flexibly plan graphic layouts according to actual needs, significantly improving design efficiency and exposure accuracy.

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[gotodistance]

According to new @CSISCBE data, the United States and its allies still dominate the semiconductor industry. While China is likely to continue making strides, it is unlikely to become dominant or entirely self-reliant.

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