Recently, Ebi Semiconductor announced a major breakthrough – it has become the first company to overcome the core technologies based on embedded silicon bridges, TMV and multi-layer high-density redistribution, and has independently developed the COORS series of advanced packaging solutions, successfully achieving the development and customer delivery of 2.5D/3D Chiplet and CPO products.
According to reports, compared to the mainstream CoWoS-S packaging solution overseas, EBO's COORS technology achieves short-distance, high-density interconnection using multiple embedded silicon bridges. It not only supports more than three times the mask size expansion and multi-chip heterogeneous integration, but also achieves comprehensive optimization in design flexibility, manufacturing cost control, and integration, precisely matching the packaging needs of high-computing-power and high-speed transmission chips such as AI, HPC, and xPO. The 2.5D Chiplet product delivered this time is a veritable "integration behemoth": with a package size exceeding 50x50mm, densely packed with over 160,000 micro-solder points, it successfully integrates more than 30 heterogeneous chips, covering advanced process SOCs and HBM chips; the CPO optoelectronic co-packaged product, with a compact 15x15mm size, achieves single-unit packaging of more than 8 optical and electrical chips, significantly improving interconnect density and transmission bandwidth, and refreshing the upper limit of system performance.
According to public information, EBO Semiconductor was founded in 2020 and is a high-tech enterprise specializing in advanced packaging of integrated circuits. Its core focus is on technologies such as 2.5D/3D Chiplet and CPO, providing one-stop packaging design, R&D, manufacturing and sales services for AI and high-computing power chips.