Quectel's 5G-A vehicle-scale group launch is a major achievement, while Vanchip's RF chips empower Tiandi Communications.
On January 4, 2026, ahead of CES 2026, Quectel launched the AR588MA, a 3GPP R18-compliant 5G-A automotive module built on MediaTek’s MT2739 platform. The module features up to 2.3GHz quad-core CPU, peak downlink of 9.0Gbps and uplink of 2.5Gbps, 400MHz bandwidth, NR 5CC, and dual-SIM dual-pass support. Its key innovation is full coverage of terrestrial 5G-A plus satellite communication, solving signal blind spots in underground parking and remote areas via enhanced low-frequency reception and adaptive algorithms. With a six-port antenna design, it supports advanced ADAS and V2X applications. Engineering samples are now available, with major automakers already integrating solutions.Vanchip Technology provided the core AEC-Q100 Grade 2 automotive-grade RF front-end chip solution for this module, covering Sub-3GHz to Sub-6GHz bands, tested from –40℃ to +105℃, and certified under IATF 16949 with a 12+ year lifecycle. Its integration with the MT2739 platform enables both ultra-high-speed transmission and satellite communication, achieving seamless space-ground connectivity.
This collaboration marks a major milestone for Vanchip in high-end automotive RF solutions, validating its technological capability. Going forward, Vanchip will expand its presence in the automotive RF market, delivering reliable, cost-effective domestic chips to drive intelligent vehicle connectivity and upgrade across the industry chain.

