Chinese semiconductor thread II

[tokenanalyst]

Option 4) the US surely would've made ASML stop buying DUV earlier? Why would they let China stockpile so much in 2023/24 and not do anything?

The stooges are chaotic pseudo-intellectuals HG who think they can understand the inner workings of a 600B dollar industry (or any industry for that matter) and much less what is happening in China. Like toddlers when they don't get the results they want, like Huawei dying, they cry loud and double down in their failing strategies. This dynamic is really annoying for Chinese companies for its unpredictability but at the same time has give Chinese companies time to adjust.

The US semiconductor industry and most of the global semi industry had been trying to fight back against the advice of think tank clown stooges for while, but for some reason this is the first time in US history that a corporate lobby has gradually lost all their power over US politicians, is incredible, if people in the US want universal healthcare they should try to get China involved somehow so the healthcare industry lose all its power.

In the past when stooges before introducing exports controls they always let a time window so the industry comment and try to lobby about it and after the export controls are introduced a time window for the industry to adjust. This give time to China to stockpile before the ban. Now in the last few years looks like stooges have reduced the time window to zero. That had reduced significantly the exports of US made tools but increased the export of tools made in South East Asia by US toolmakers. In the case of ASML their exports are controlled by the Dutch government and they have their own time window which had give Chinese companies time to stockpile their tools. From document of one of the clown committees of congress they are putting pressure to BIS to basically have the control of selling tools made outside the US using the FPDR, now given that China has made its own FPDR and ASML is also bound to Chinese law, they have components, software and materials from China, ASML could found themselves banned from selling to China and the US at the same time. Crazy times.

 

[tphuang]

no idea if the following is true or not, but it would be good if domestic firms are proactively using and replacing their foreign EDA software when possible. And same with Oscilloscope

被称为“芯片听诊器”的超高速示波器：新凯来子公司万里眼推出的新品直接将性能拉涨5倍，带宽突破 90GHz、采样率达 200GSa/s，不仅远超美国对华出口的 59GHz限制线，更实现100%核心零部件自主可控。要知道，此前6G 通信、智能驾驶的超高速信号测试，全靠进口设备垄断，单台售价超千万且维修需等外企数月。现在国产设备价格砍至进口价的60%，还能提供3天紧急维修，已经悄悄进入中芯国际、长江存储的产线。


更关键的突破在“芯片之母”EDA 软件领域。


新凯来子公司启云方发布的两款设计软件，彻底丢掉了国外代码“拐杖”。不同于美企


Synopsys 的串行设计模式，它能支持100人同时在线画原理图、20人并行做PCB设计，实测布线效率比国际标杆快 28%，还能让芯片功耗降低 15%。这可不是小改进—2023年就有国内企业因 EDA 断供，导致7nm 项目停摆3个月损失近2亿，而现在国产软件不仅价格减半，还能提供7×24 小时本地化服务，展会上当场签下2亿订单就是最直接的认可

View attachment 162612

Nice, more of the EUV light source improvements from CIOMP.

 

[jx191]

no idea if the following is true or not, but it would be good if domestic firms are proactively using and replacing their foreign EDA software when possible. And same with Oscilloscope





Nice, more of the EUV light source improvements from CIOMP.

Its always interesting how patents relate to the development situation. For example, if CIOMP is still gradually improving and optimizing their light source + peripheral equipment, what about the light source that is already installed in a potential prototype machine? Would they just add the new stuff into the existing system, or would they rather observe the success of an existing system and then bring in any potential updates.

 

[tphuang]

https://twitter.com/i/web/status/1978527873763049554

BYD is apparently not far from completing development of its own auto SoC that supports both cockpit and ADAS. Will have 2000 TOPS of computation.

 

[tokenanalyst]

The Institute of Semiconductors of the Chinese Academy of Sciences has made new progress in the research of optical frequency combs for high-speed optical communications​

According to the official WeChat account of the Institute of Semiconductors, Chinese Academy of Sciences (CAS), a team led by Researcher Chen Siming of the CAS CAS, in collaboration with Hunan Huisi Optoelectronics Technology Co., Ltd., Shenzhen University of Technology, and the National Center for Information Optoelectronics, has recently achieved a breakthrough in the research of quantum dot mode-locked optical frequency combs for high-speed optical communications. By utilizing innovative semiconductor quantum dot co-doping technology and a collision pulse mode-locking scheme, the team has successfully developed a 100 GHz quantum dot optical frequency comb laser that can operate stably at extreme temperatures up to 140°C. This device achieves breakthroughs in operating temperature, transmission capacity, and reliability, providing a key light source solution for future terabit-scale optical interconnects.

This research demonstrates superior comprehensive performance: at room temperature (25°C), the laser achieves a 3dB optical bandwidth of 14.312 nm, capable of generating 26 channels. Each channel can carry a 128 Gb/s PAM-4 modulated signal. The device maintains stable mode locking at temperatures up to 140°C. At the industrial standard temperature of 85°C, its key performance indicators show little degradation, maintaining stable operation of 22 channels and supporting a total data transmission rate of 2.816 Tb/s. Furthermore, the energy consumption per bit of data transmitted is as low as 0.394 pJ at 25°C and 0.532 pJ at 85°C. Accelerated aging tests conducted at 85°C for over 1500 hours have demonstrated a mean time to failure (MTTF) of 207 years, fully meeting the stringent requirements of commercial applications.

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[sunnymaxi]

Another breakthrough! Tiancheng Semiconductor successfully developed 12-inch high-purity semi-insulating single crystal material

Recently, Shanxi Tiancheng Semiconductor Materials Co., Ltd. announced a major technological breakthrough: following the development of 12-inch N-type silicon carbide single crystal material in the second quarter, it has successfully developed 12-inch high-purity semi-insulating silicon carbide single crystal material based on its independently developed 12-inch silicon carbide crystal growth equipment. The effective thickness of the 12-inch N-type silicon carbide single crystal material has exceeded 35mm, marking that the company's technological strength in the field of large-size silicon carbide materials has reached a new level.

At present, Tiancheng Semiconductor has fully mastered the dual mature processes of 12-inch high-purity semi-insulating and N-type silicon carbide single crystal growth, and its self-developed crystal growth equipment can stably produce single crystal materials with a diameter of up to 350mm.

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[gelgoog]

Is he indirectly hinting at domestic DUVi or a slowdown in expansion?

stockpiling is over. they have purchased enough DUVi in 2023-24.

There is no "stockpiling". The Chinese semiconductor industry just operates extremely fast.

The Chinese build a factory shell in one year. For a gigafab it takes like up to two years to fill it with tools in two stages. From what I understand ASML gives priority to delivering tools to actual existing factories, due to their long backlog, they won't be delivering tools to be just stored in a warehouse somewhere. The lithography tools are typically installed by ASML technicians directly on site.

To keep the company cash flow positive the Chinese fab companies usually build one gigafab at a time per site. The current construction binge started in a big way after US sanctions. You could say it is a rush to the exits before the doors are closed down. But this is also due to COVID showing the fragility of foreign supply chains I think.

Anyway, in my opinion the Chinese semi industry is currently in a fundraising cycle. You will see a lot of Chinese semi IPOs this year. And then the next iteration of the cycle will start with new fabs being built in 2026. In 2027 those fab shells will be finished and only after that will tools be delivered to the fab sites.

That is how ASML can claim increased orders this year and lower deliveries to China next year.

BYD is apparently not far from completing development of its own auto SoC that supports both cockpit and ADAS. Will have 2000 TOPS of computation.

Sounds great in theory but putting all those transistors in one chip means they will need to use a leading edge process and become more vulnerable to supply shocks. You can be fairly sure the US government will try to torpedo Chinese EVs by cutting chip supply at some point. These car maker and auto semi people in China are just retarded lemmings.

 

[AndrewS]

There is no "stockpiling". The Chinese semiconductor industry just operates extremely fast.

The Chinese build a factory shell in one year. For a gigafab it takes like up to two years to fill it with tools in two stages. From what I understand ASML gives priority to delivering tools to actual existing factories, due to their long backlog, they won't be delivering tools to be just stored in a warehouse somewhere. The lithography tools are typically installed by ASML technicians directly on site.

To keep the company cash flow positive the Chinese fab companies usually build one gigafab at a time per site. The current construction binge started in a big way after US sanctions. You could say it is a rush to the exits before the doors are closed down. But this is also due to COVID showing the fragility of foreign supply chains I think.

Anyway, in my opinion the Chinese semi industry is currently in a fundraising cycle. You will see a lot of Chinese semi IPOs this year. And then the next iteration of the cycle will start with new fabs being built in 2026. In 2027 those fab shells will be finished and only after that will tools be delivered to the fab sites.

That is how ASML can claim increased orders this year and lower deliveries to China next year.


Sounds great in theory but putting all those transistors in one chip means they will need to use a leading edge process and become more vulnerable to supply shocks. You can be fairly sure the US government will try to torpedo Chinese EVs by cutting chip supply at some point. These car maker and auto semi people in China are just retarded lemmings.

My understanding is that in the 2023-2024 period, there was a glut of mature semiconductors.

So lots of customers cancelled or postponed their orders with ASML, which meant spare machines being available, which were bought up by Chinese customers.

 

[gelgoog]

My understanding is that in the 2023-2024 period, there was a glut of mature semiconductors.

So lots of customers cancelled or postponed their orders with ASML, which meant spare machines being available, which were bought up by Chinese customers.

It meant the Chinese fabs got their orders delivered faster by being bumped up the queue. Just that.

China built like 1000k wpm capacity in fab shells alone, minimum, over the last couple of years. It is just insane. And this buildup should be over this year.