The guy explicitly says it's a domestic line, there's no ambiguity.
Chinese semiconductor thread II
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AMEC's Chengdu R&D and production base and Southwest headquarters project officially started
Chengdu, China, October 17, 2025—Shanghai Advanced Micro-electronics Equipment Co., Ltd. (hereinafter referred to as "AMEC," stock code: 688012) held a grand groundbreaking ceremony in the Chengdu Hi-Tech Zone, announcing the official start of construction on its Chengdu R&D and Production Base and Southwest Headquarters. The base will provide strong support for AMEC to further enhance its core R&D capabilities and scale production capacity, helping it maintain its leading position in the global high-end semiconductor equipment market.
At the groundbreaking ceremony, Dr. Yin Zhiyao, Chairman and General Manager of AMEC, stated that the digital industry is the core engine of modern industry and national economic development, and micro-processing equipment, key materials, and components are the cornerstone of the entire digital industry. Since its founding 21 years ago, AMEC has focused on the research, development, and manufacturing of high-end micro-processing equipment. The Chengdu R&D and production base, which specializes in high-end semiconductor manufacturing equipment such as thin film deposition equipment, is a key strategic move for the company to achieve its development blueprint and will provide key support for continuously advancing technological breakthroughs and enabling industrial upgrading. The company will continue to accelerate the development of new equipment. Over the next five to ten years, through organic growth and epitaxial expansion, it will gradually cover 50% to 60% of equipment in key integrated circuit areas. The company strives to quickly establish itself as a high-end equipment platform company and become a world-class semiconductor equipment company in terms of scale and competitiveness.
The first phase of AMEC's Chengdu R&D and Production Base and Southwest Headquarters project covers approximately 50 mu (approximately 1.5 acres) and has a construction area of approximately 70,000 square meters. It will be developed into a comprehensive R&D and manufacturing facility, scheduled for completion and commissioning in 2027, to continuously enhance the company's R&D and manufacturing capabilities in high-end semiconductor equipment, such as thin film deposition equipment. As a key strategic development for AMEC, with the commencement of construction of the Chengdu R&D and Production Base, the company's total plant area will reach 750,000 square meters, ensuring the continued enhancement of its product R&D and manufacturing capabilities and laying a solid foundation for continued high-speed, stable, healthy, and safe high-quality development in the future.
In his speech, Tao Heng, Vice President of AMEC Group and General Manager of AMEC Semiconductor Equipment (Sichuan) Co., Ltd., elaborated on the strategic positioning and industrial responsibilities of the Chengdu R&D and production base. He stated, "The Chengdu project shoulders three core missions: technological breakthroughs, industrial complementation, and cluster leadership. We will focus on areas such as thin film deposition equipment, fully developing key equipment technologies such as chemical vapor deposition and atomic layer deposition. We will strive to address the shortcomings of the southwest region in advanced wafer processing equipment manufacturing. We will also actively promote the joint development of upstream and downstream partners, help build a semiconductor high-end equipment industry chain cluster, and provide solid support for the upgrading of the semiconductor industry chain in the southwest region."
Since its establishment in 2004, AMEC has been committed to developing and providing high-end, critical equipment required for micro-processing, such as plasma etching, chemical thin films, and metrology. The company has maintained an average annual revenue growth of over 35% over the past 14 years. Building on a 44.7% sales increase in 2024 compared to 2023, revenue is projected to continue its rapid growth in the first half of 2025, increasing by 43.9% year-on-year to 4.961 billion yuan. The company continues to increase its R&D efforts, with R&D investment reaching 1.492 billion yuan in the first half of 2025, a year-on-year increase of approximately 53.70%. R&D investment accounts for approximately 30.07% of the company's revenue, significantly exceeding the average R&D investment level of companies listed on the Science and Technology Innovation Board (STAR Market). The company's current R&D projects encompass six major equipment categories and over 20 new products. In the field of chemical thin film equipment, the company is continuously increasing its R&D investment and product portfolio, successfully achieving the efficient development and mass production of six types of thin film deposition equipment, with key performance indicators reaching world-leading levels.
The official commencement of construction on AMEC's Chengdu R&D and Production Base and Southwest Headquarters project marks the transition of the company's strategic layout in the southwest region from planning to substantial implementation. Upon completion, the project will not only provide a solid foundation for the company's continued expansion into R&D innovation and production capacity, but will also inject strong new momentum into regional economic development, further promote the upgrading of the semiconductor industry chain in the southwest region, and contribute significantly to the high-quality development of the semiconductor industry.
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Hongqi Technology signs contract for semiconductor key equipment lampshade components and consumables project
According to news from Hefei Xinzhan District, on October 15, Xinzhan High-tech Zone and Hongqi (Hefei) Technology Co., Ltd. officially signed a contract for the semiconductor key equipment lampshade components and consumables project, filling the gap in domestic semiconductor core high-precision consumables.
Hongqi (Hefei) Technology Co., Ltd. is a high-tech enterprise specializing in the research and development and manufacturing of high-end precision semiconductor consumables. The company is committed to achieving localized production and innovative breakthroughs in core semiconductor components in China. Its main products include key consumables for semiconductor equipment, such as shower heads (gas distribution plates) and lamp housings, which are widely used in advanced manufacturing processes. Currently, Hongqi Technology is one of the few companies in China capable of mass-producing core components for 5nm advanced processes.
The project, with a total investment of 200 million yuan, plans to lease office buildings and factory space at the Core Vision Industrial Park. The company will primarily manufacture consumables such as lampshade assemblies and showerheads, core components for semiconductor lithography and cleaning processes. The project will be jointly operated with Taiwan's Yongkang Company. Upon completion, the project will achieve domestic substitution of key consumables, reducing reliance on foreign supply chains and ensuring the security of the industrial chain.
Jingzhou Equipment: Glass Substrate Process Equipment Solutions
Jingzhou Equipment showcased its newly developed "Semiconductor Glass Substrate Process Equipment Solutions ," attracting significant attention.
At the exhibition, Jingzhou Equipment's exhibition area attracted many professional visitors to stop and communicate. Many representatives from packaging and testing, integrated circuit manufacturing and terminal application companies showed great interest in its glass substrate solutions and conducted in-depth discussions on technical details, cooperation models, etc.
This exhibition not only showcased Jingzhou Equipment's technological strength in the semiconductor equipment field, but also further enhanced its brand influence within the industry chain. Through the Wanxin Expo platform, Jingzhou engaged in extensive exchanges with industry partners, gained potential customers and partnership opportunities, and laid a solid foundation for the industrialization of advanced glass substrate packaging technology.
In an exclusive interview with Charging Head Network, Jingzhou Equipment explained that its core solution at the exhibition aims to break through the limitations of traditional wafer processing, achieving a technological leap from "round" to "square ." This solution can be widely applied in advanced packaging and high-end display driver applications. Its core technology relies on advanced processes such as panel-level packaging (FOPLP), through-glass vias (TGV), and redistribution layout (RDL) to arrange chips on a square substrate, significantly improving area utilization and achieving better cost-effectiveness.
To achieve this technological path, Jingzhou Equipment has equipped itself with advanced equipment covering the entire process chain , including electroplating equipment, glass laser-induced etching equipment, vertical and planar wet process equipment, and slit coating equipment . These key equipment together establish a full-process manufacturing capability from patterning, via formation, metallization, to coating , providing efficient, stable, and scalable equipment support for semiconductor packaging processes.
As the semiconductor industry continues to evolve towards high performance, high integration and low cost, the solution released by Jingzhou Equipment is expected to play an important role in the future packaging technology route and contribute significantly to the independent innovation and industrial upgrading of China's semiconductor equipment.
At the exhibition, Jingzhou Equipment's exhibition area attracted many professional visitors to stop and communicate. Many representatives from packaging and testing, integrated circuit manufacturing and terminal application companies showed great interest in its glass substrate solutions and conducted in-depth discussions on technical details, cooperation models, etc.
This exhibition not only showcased Jingzhou Equipment's technological strength in the semiconductor equipment field, but also further enhanced its brand influence within the industry chain. Through the Wanxin Expo platform, Jingzhou engaged in extensive exchanges with industry partners, gained potential customers and partnership opportunities, and laid a solid foundation for the industrialization of advanced glass substrate packaging technology.
In an exclusive interview with Charging Head Network, Jingzhou Equipment explained that its core solution at the exhibition aims to break through the limitations of traditional wafer processing, achieving a technological leap from "round" to "square ." This solution can be widely applied in advanced packaging and high-end display driver applications. Its core technology relies on advanced processes such as panel-level packaging (FOPLP), through-glass vias (TGV), and redistribution layout (RDL) to arrange chips on a square substrate, significantly improving area utilization and achieving better cost-effectiveness.
To achieve this technological path, Jingzhou Equipment has equipped itself with advanced equipment covering the entire process chain , including electroplating equipment, glass laser-induced etching equipment, vertical and planar wet process equipment, and slit coating equipment . These key equipment together establish a full-process manufacturing capability from patterning, via formation, metallization, to coating , providing efficient, stable, and scalable equipment support for semiconductor packaging processes.
As the semiconductor industry continues to evolve towards high performance, high integration and low cost, the solution released by Jingzhou Equipment is expected to play an important role in the future packaging technology route and contribute significantly to the independent innovation and industrial upgrading of China's semiconductor equipment.
Core Micro-Equipment debuts at the Bay Core Exhibition
Xinshang Micro-Equipment showcased its new compound semiconductor lithography system, laser annealing equipment, wafer advanced packaging volume measurement equipment, wafer advanced packaging lithography system, and bonding equipment solutions, primarily in the form of promotional materials. Taking the wafer advanced packaging lithography system as an example, it is said to be primarily applicable to various high-end chip packaging applications such as artificial intelligence and advanced smart devices. Featuring high resolution, an ultra-large exposure field of view, and support for highly warped substrates, it can meet the lithography process requirements of various wafer-level and substrate-level advanced packaging applications, including flip chips, fan-in and fan-out WLP/PLP, and 2.5D/3D integration.
Chengdu accelerates the development of a domestically produced smart chip ecosystem by collaborating across the entire supply chain.
The "Chengdu Embodied Intelligence Industry Innovation and Development Action Plan (2025-2027)" was recently officially released. The plan proposes achieving an industry scale exceeding 50 billion yuan by 2027, implementing a campaign to develop leading sectors, and listing the development of a domestically produced smart chip ecosystem as one of its strategic goals. In recent years, Chengdu, guided by major national strategic needs and adhering to the principle of "strengthening design, supplementing manufacturing, expanding packaging and testing, and extending the supply chain," has strived to establish itself as a strategic backup base for the national integrated circuit industry and a national "core" hub. This has outlined a blueprint for the industry's core development, transitioning from "ecological synergy" to "cluster development."
In September this year, Chengdu Huawei Electronics Technology Co., Ltd. successfully launched the first domestically produced 4-channel 12-bit 40GSPS high-speed and high-precision RF direct-source ADC chip - HWD12B40GA4. This breakthrough not only refreshed the performance record of domestic ADCs, but also marked that my country has reached the international leading level in the field of high-end RF direct-source.
In the packaging and testing segment of the supply chain, Chengdu Yicheng Technology Co., Ltd.'s board-level high-density sealing and testing facility has also performed exceptionally well. As the only company in mainland China capable of mass-producing high-density FOMCM (Fan-Out Multi-Chip Interconnect Platform) products, Yicheng Technology has continuously improved production efficiency and quality since achieving mass production of this platform in October 2024, providing critical packaging and testing support for the localization of high-end chips. Intel's Chengdu facility, one of Intel's largest chip packaging and testing centers globally, processes over half of the world's laptop CPUs for packaging and testing in Chengdu. In the terminal application sector, local server company Huakun Zhenyu has become the largest domestic seller of ARM-based computing servers.
Chengdu currently houses over 400 integrated circuit (IC) companies, including BYD Semiconductor, Chengdu Haiguang, Texas Instruments, Moore's Thread, and Muxi. The city has also fostered 51 national "specialized, sophisticated, and innovative" small giants and 12 supply chain leaders. Chengdu's revenue has maintained rapid growth exceeding 10% for three consecutive years, projecting 83 billion yuan in 2024, an 18% year-on-year increase, placing it eighth nationwide in terms of industry scale. Chengdu has initially established a relatively complete industrial system encompassing IC design, wafer fabrication, advanced packaging and testing, and equipment and materials, with distinct advantages in computing, communications, power semiconductors, and analog.
Haiguang Xinzheng's high-speed silicon photonics devices and high-speed silicon photonics modules intelligent manufacturing project started
On October 13th, the groundbreaking ceremony for the Haiguang Xinzheng High-Speed Silicon Photonics Device and High-Speed Silicon Photonics Module Intelligent Manufacturing Project was held in the Beijing Economic and Technological Development Zone. The project was developed by Beijing Haiguang Xinzheng Technology Co., Ltd. Officials from the Beijing Economic and Technological Development Zone and senior executives from Haiguang Xinzheng attended the event.
Dr. Hu Chaoyang, General Manager of Beijing Hi-Tech Co., Ltd., delivered an opening speech. He stated that, with the groundbreaking ceremony, Hi-Tech will use the new site as a starting point to continue deepening its presence in the optoelectronic chip field and accelerate the development of high-end products. He also expressed his hope that Hi-Tech will work with partners to jointly promote the domestic optical communications industry to the high end of the global value chain through a more efficient R&D environment and a more open innovation ecosystem.
Haiguang Xinzheng's high-speed silicon photonics device and module intelligent manufacturing project will focus on building specialized production lines for these devices and modules. The project's launch will effectively fill the supply gap in the domestic high-end high-speed optical module market, solidifying the production capacity foundation and providing key support for the large-scale, high-quality development of my country's optical communications industry.
