Chinese semiconductor thread II
- Thread starter vincent
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TGV laser drilling technology achieves breakthrough! Guihua Intelligent helps upgrade the glass substrate packaging industry
The substrate is an important component of the final stage of the chip packaging process, playing a key role in supporting the bare chip. Glass substrates, with glass as the core material, have shown great potential in advanced packaging technology due to their excellent high-frequency electrical properties, stable thermal stability, and chemical stability. They are generally regarded by the industry as an important development direction for next-generation chip substrates.
As a key supplier of TGV laser drilling machines, Guihua Intelligent has dedicated itself to technological research and development. Its TGV laser drilling machines have successfully overcome numerous technical challenges in through-hole forming, combining high speed, high precision, narrow pitch, smooth sidewalls, excellent verticality, and low cost. They demonstrate exceptional strength in key performance parameters, with a maximum processing width of 920mm*730mm and a minimum hole diameter of just 1.5μm. Source: Guihua Intelligence..
It can achieve an ultra-large diameter-to-depth ratio of 1:200, with the hole wall finish precisely controlled within 150nm and a processing efficiency of up to 10,000 holes per second. Under normal working conditions, it can perform high-precision precision processing on glass with a thickness of 200μm to 1.5mm.
The substrate is an important component of the final stage of the chip packaging process, playing a key role in supporting the bare chip. Glass substrates, with glass as the core material, have shown great potential in advanced packaging technology due to their excellent high-frequency electrical properties, stable thermal stability, and chemical stability. They are generally regarded by the industry as an important development direction for next-generation chip substrates.
As a key supplier of TGV laser drilling machines, Guihua Intelligent has dedicated itself to technological research and development. Its TGV laser drilling machines have successfully overcome numerous technical challenges in through-hole forming, combining high speed, high precision, narrow pitch, smooth sidewalls, excellent verticality, and low cost. They demonstrate exceptional strength in key performance parameters, with a maximum processing width of 920mm*730mm and a minimum hole diameter of just 1.5μm. Source: Guihua Intelligence..
It can achieve an ultra-large diameter-to-depth ratio of 1:200, with the hole wall finish precisely controlled within 150nm and a processing efficiency of up to 10,000 holes per second. Under normal working conditions, it can perform high-precision precision processing on glass with a thickness of 200μm to 1.5mm.