I think the US is definitely having that option in mind as it watches China making progress. At that time, I'd like to see China to make semiconductor equipments affordable to even the Global South. That will turn ICs into commodities. In turn it will completely crush one of the last few "bastions" in the US defense line.
Chinese semiconductor industry
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Who will buy from Qualcomm if not Chinese phone companies if Beijing returns the favour ?
In any case I see BBK and others have joined the design bandwagon so Qualcomm SOC might not be in Chinese phones past 2025
TSMC has developed Chiplet for more than ten years, and the 3nm process is to rely on Chiplet technology to increase performance. Is this technology mature? After all, Mr. Jiang has long been committed to the promotion of advanced packaging! It also predicts that advanced packaging is a next-generation solution that breaks Moore's Law.
On December 2, Changjiang Electronics Technology (JCET) (600584.SH) stated on the investor interaction platform that for Chiplet heterogeneous integrated applications, Changjiang Electronics Technology (JCET) announced in July this year that it will officially launch a full range of XDFOI extremely high-density fan-out packaging solutions. The packaging solution is a new type of through-silicon-via wafer-level very high-density packaging technology. Compared with 2.5D through-silicon-via (TSV) packaging technology, it has the characteristics of higher performance, higher reliability and lower cost. The solution can realize multi-layer wiring while the line width or line pitch can reach 2um. In addition, it adopts extremely narrow pitch bump interconnection technology, the package size is large, and it can integrate multiple chips, high bandwidth memory and passive Device. At present, Changjiang Electronics Technology has completed the ultra-high-density wiring and started the customer sample process. Mass production is expected in the second half of next year. The key application areas are: high-performance computing applications such as FPGA, CPU/GPU, AI, 5G, autonomous driving, smart medical, etc.
l XDFOI™, a family of high-density fan-out packaging solutions, is an innovative wafer-level packaging technology designed to provide cost-effective solutions with high integration, high-density interconnection and high-reliability for the heterogeneous integration of chipsets, that are in high demand
l Application scenarios includes FPGAs, CPUs, GPUs, AI and 5G, all of which require high integration and computing performance
l Product validation and mass production are expected to be completed in 2H 2022
Shanghai, China, July 6, 2021 – JCET Group, a global leading provider of integrated circuit (IC) manufacturing and technology services, today announces the official launch of XDFOI™, an innovative solution for ultra-high-density fan-out packaging. This revolutionary technology will provide cost-effective solutions with high integration, high-density interconnection and high-reliability for the heterogeneous integration of chipsets, which are in high demand . This innovation from JCET Group will take its advanced chipset backend manufacturing to new heights.
The XDFOI™ high-density fan-out package solution is a new silicon based, TSV-free, ultra-high-density wafer-level packaging technology with higher performance, higher reliability and lower cost compared to 2.5D TSV-based packaging technologies. XDFOI™ enables multiple redistribution layers (RDL) with line width and line spacing down to 2 micrometer. In addition, the extremely narrow bump pitch interconnect technology and large package size allow for the integration of multiple chips or chiplets, high bandwidth memories, and passive components.
The XDFOI™ solution portfolio greatly reduces system cost and package size by integrating different functional devices in a system package with a wide range of applications. XDFOI™ primarily targets FPGA, CPU, GPU, AI and 5G applications, with demanding requirements for integration and computing performance to provide several functional chips (Chiplets) with Heterogeneous integration Package (HiP) solutions.
Dr. Choon Heung Lee, CTO of JCET Group, said, "Moore's Law is slowing down, while the rapid development of information technology and the accelerated spread of digital transformation have stimulated a large number of diversified computing power needs. This market demand makes heterogeneous integration a new opportunity for advanced packaging technology, as it can effectively increase the IO density and computing performance within the chipset. JCET’s XDFOI™ solution will offer diverse options of heterogeneous integration for the customers’SoC as well as chiplets with unique technical advantages. Customer trials of the JCET XDFOI™ solution portfolio will begin soon and mass production is expected to begin in the 2nd half of 2022."
Not to mention that, out of all the transistors made so far, only a tiny fraction are for number crunching which could be the only practical use that quantum computers are thought of good at in years to come. Number crunching is very important but it is far from all that semiconductors are used for nowadays. Most of the ICs produced every day are for storage, logic control, DA/AD conversion, electrical power regulation, etc. Modern life and modern industries, manufacturing in particular, wouldn't exist anymore without these ICs.
China has to master the latest semiconductor technologies.
Exactly. This may come as a giant shock to people but semiconductors, an electronic device... Are mostly used for electrical purposes.
As in, regulating voltages and currents, converting analog signals to digital ones, switching things on and off, emitting light/heat, sensing light/heat/chemicals, converting electricity to various other forms of energy or electricity like DC to AC, etc.
99.99% of semiconductor devices have nothing to do with computers at all.
From translate "According to statistics from the China Electronic Special Equipment Industry Association, 56 major semiconductor equipment manufacturers in mainland China will achieve 24.29 billion yuan in semiconductor equipment sales revenue in 2020, an increase of 38.7% year-on-year; total profits are 5.192 billion yuan, an increase of 80.5% year-on-year. Among them, the total sales revenue of integrated circuit equipment was 9.677 billion yuan, a year-on-year increase of 59.0%."
And your part:
"Jin Cunzhong said that although domestic lithography machines have been successfully developed, related products have not yet entered the production line of integrated circuit wafer production."
It seems he refers to lithography machines in general. For some other types of equipment, he says there is a technology gap. For lithographs, he says they are not being used.
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