I dont know if this has already been posted. This article from semiengineering talks about High-NA.
Too technical for me. Does anyone knows if china has anything in this area?
This is a good article and has a couple of important points, even though I am not a tech guy either.
The important points relate to two issues, 1) the specs and timeline, and 2) the costs.
1) In the article, they need a lens to produce a laser light of a certain wavelength, to etch the circuitry onto the silicone chip.
The current state of the art ASML machine has,
0.33 NA lens, ---> 13.5nm wavelength ---> fab 7nm & 5nm chip
By 2025 at the earliest, the state of the art AMSL will have,
0.55 NA lens, ---> 8nm wavelength ---> fab 3nm chip at TSMC etc.
A clear conclusion here is that the 5nm chip will be here with us for a while as the best chip.
2) The costs involved are huge, with the current state of the art ASML machine $153.4 million then the new machine will double in price to $318.6 million.
Then there are more increased costs to the equipment and materials needed to fab at 3nm.
What this means is the cost to produce the cutting edge chips rising exponentially, while the actual performance improvements are merely incremental. In economics, we call this the law of diminishing returns.
In short, the 3nm chip is not going to be cost effective compared to the 5nm or 7nm chip.
In other words they are reaching limits to what they can do technically and financially to make money. Given these type of economic constraints, the prize at the end of this race, for being the best node at 3nm, that prize could be not as big as we would think. The risks are huge. The fab can make a bundle of money, or over expand and get crushed.
(A side note, that is why there is so much collaboration and coordination in the IC industry. Companies must know who they will be selling to before they make the massive capital expenditures for plant and equipment.)
No, China does not have any of this type of equipment now. Clearly China is behind.
In four or five years, maybe China can fab a 3nm with EUV on its own, because that is the scheduled date for the ASML machine to appear.
This is the complicated part, because this is a business decision too. ASML can get that 3nm capable machine to the market in 2 years, that is 2 years earlier, but they won't.
It is too expensive. The semiconductor industry, if you are TSMC or Samsung, is different that almost all other types of businesses.
You make a capital expenditure on a machine. After TSMC decides it earned enough from that machine, then TSMC will buy the next one.
ASML coming out with their most advanced machine 4 to 6 years from now, indicates when TSMC feels ready to buy that, after they earned enough money from the old machine they bought cranking out chips.
Bottom line for Chinese Communist Party, is that TSMC and Samsung at 5nm, but SMIC at 7nm, with 3nm in the distant future. And they all know that 90% of chip demand is at the mature nodes of 14nm or above.
That is how the CCP would view this battle or race. It is a whole new ball game.