Chinese semiconductor industry
- Thread starter Hendrik_2000
- Start date
- Status
Kuka to be honest was a fantastic buy. Would never see the light of day in 2021
Another one from the mainland publication MINNEWS, apologies in advance for our esteem members who may want a more credible sources, but after @Hendrik_2000 previous post about Huawei future smart phone plan, this news collaborate that claimed and we may indeed see a Kirin 14nm 3D chiplet powering Huawei smartphone in 2023.
The first news is that the domestic 14nm chip is expected to be mass-produced next year. The second news is that Huawei HiSilicon has developed chip stacking technology. The stacking of two 14nm chips can achieve the effect of 7nm chips. Then some people pointed out that the above two pieces of news were unrealistic, and Wuhe Qilin started arguing with them. The scope of controversy is getting wider and wider, and some digital bloggers even invite fans to attack Wuhe Kirin. The remarks even developed to the point that "the black unicorn rumors", "the black unicorn hinders the development of Chinese chips" and so on. So there was an apology by the black unicorn.
Regarding the first article, the domestic 14nm chip is expected to be mass-produced next year. This is an article published by the World Wide Web. Wen Xiaojun said that the domestic 14nm chip can be mass-produced by the end of next year, and the domestic chip will welcome the best moment. Mr. Wen Xiaojun is the director of the Electronic Information Research Institute of the China Electronics Information Industry Development Research Institute. He said this to a certain extent on behalf of the official meaning, and the credibility is still there.
Second, a blogger posted some time ago that Huawei HiSilicon is studying various technologies and superimposing and optimizing two low-process chips to obtain more advanced chips. Then this Weibo was teased by some people and even besieged. In fact, this kind of chip stacking technology is being studied at home and abroad. Why can it be studied abroad? When we want to study, we are teased and besieged? Moore's Law is getting closer and closer to the limit, and it will fail. In order to make more advanced chips, various researches and explorations are being carried out internationally. One of these technologies is called "3D packaging", which is to stack two or more chips like a house to package them into a more advanced chip. SMIC is currently studying this technology.
Two cups of 50-degree water add up to not 100-degree water, but it is entirely possible that two 14nm chips are superimposed together to become more advanced chips. The key is what superposition technology you use. Although Huawei's reputation in the server field is not as good as Inspur, it is the first manufacturer in the world to implement multiple CPUs. Its Kunpeng 916 processor is the first to support two-way inter-chip interconnection, which means that through the interconnection of two chips, it can be The server performance has been greatly improved to achieve the effect of 1+1>2. At present, the latest Kunpeng 920icon can achieve 4-channel inter-chip interconnection. Therefore, Huawei is the absolute global leader in multi-channel CPU stacking technology, and don't forget. The Harmony system is the foundation of the Internet of Everything, so it is possible to transplant this technology to the Kirin chip. According to the time of making through holes, 3D TSV through hole integration methods can be divided into four categories:
In other words, advanced semiconductor manufacturing processes have stepped into 7nm, 5nm, and then 3nm and 2nm. As a result, the size of transistors is constantly approaching the physical volume limit of atoms. Electronic and physical limitations also make advanced processes continue to shrink. The difficulty of upgrading is getting higher and higher. Therefore, in addition to the continuous development of advanced manufacturing processes, the semiconductor industry has also begun to look for other ways to keep chips small and high performance at the same time;
The so-called heterogeneous integration, in a broad sense, refers to the integration of two different chips, such as memory + logic chips, optoelectronics + electronic components, etc., through packaging, 3D stacking and other technologies. In other words, the integration of two different processes and different properties of chips can be called heterogeneous integration.
Never treat your colleague as a friend
The Huawei chip stacking technology that the Ugly Kirin is boiling over, has the whole world begun to study it a few years ago?
2021-11-20 14:48 HKTThe first news is that the domestic 14nm chip is expected to be mass-produced next year. The second news is that Huawei HiSilicon has developed chip stacking technology. The stacking of two 14nm chips can achieve the effect of 7nm chips. Then some people pointed out that the above two pieces of news were unrealistic, and Wuhe Qilin started arguing with them. The scope of controversy is getting wider and wider, and some digital bloggers even invite fans to attack Wuhe Kirin. The remarks even developed to the point that "the black unicorn rumors", "the black unicorn hinders the development of Chinese chips" and so on. So there was an apology by the black unicorn.
Regarding the first article, the domestic 14nm chip is expected to be mass-produced next year. This is an article published by the World Wide Web. Wen Xiaojun said that the domestic 14nm chip can be mass-produced by the end of next year, and the domestic chip will welcome the best moment. Mr. Wen Xiaojun is the director of the Electronic Information Research Institute of the China Electronics Information Industry Development Research Institute. He said this to a certain extent on behalf of the official meaning, and the credibility is still there.
Second, a blogger posted some time ago that Huawei HiSilicon is studying various technologies and superimposing and optimizing two low-process chips to obtain more advanced chips. Then this Weibo was teased by some people and even besieged. In fact, this kind of chip stacking technology is being studied at home and abroad. Why can it be studied abroad? When we want to study, we are teased and besieged? Moore's Law is getting closer and closer to the limit, and it will fail. In order to make more advanced chips, various researches and explorations are being carried out internationally. One of these technologies is called "3D packaging", which is to stack two or more chips like a house to package them into a more advanced chip. SMIC is currently studying this technology.
Two cups of 50-degree water add up to not 100-degree water, but it is entirely possible that two 14nm chips are superimposed together to become more advanced chips. The key is what superposition technology you use. Although Huawei's reputation in the server field is not as good as Inspur, it is the first manufacturer in the world to implement multiple CPUs. Its Kunpeng 916 processor is the first to support two-way inter-chip interconnection, which means that through the interconnection of two chips, it can be The server performance has been greatly improved to achieve the effect of 1+1>2. At present, the latest Kunpeng 920icon can achieve 4-channel inter-chip interconnection. Therefore, Huawei is the absolute global leader in multi-channel CPU stacking technology, and don't forget. The Harmony system is the foundation of the Internet of Everything, so it is possible to transplant this technology to the Kirin chip. According to the time of making through holes, 3D TSV through hole integration methods can be divided into four categories:
In other words, advanced semiconductor manufacturing processes have stepped into 7nm, 5nm, and then 3nm and 2nm. As a result, the size of transistors is constantly approaching the physical volume limit of atoms. Electronic and physical limitations also make advanced processes continue to shrink. The difficulty of upgrading is getting higher and higher. Therefore, in addition to the continuous development of advanced manufacturing processes, the semiconductor industry has also begun to look for other ways to keep chips small and high performance at the same time;
The so-called heterogeneous integration, in a broad sense, refers to the integration of two different chips, such as memory + logic chips, optoelectronics + electronic components, etc., through packaging, 3D stacking and other technologies. In other words, the integration of two different processes and different properties of chips can be called heterogeneous integration.
Never treat your colleague as a friend
Are you saying Russia's current lithography machines were all purchased before 2014-2015? Also, I doubted TSMC is specifically barred by USDOC BIS from selling its most advanced chips to Russia (unlike China, which both Taipei and Washington shared the critical threat perception, especially since Trump and GOP considered China a much more serious threat than Russia).
I wouldn't take anything posted by Wuhe Qilin (乌合麒麟) about Chinese semiconductor development seriously. He is a talented graphic artist without any real knowledge of semiconductor industry. He's very popular on weibo due to his great drawings, but he's not a "big shrimp" at all.
Lithography machines aren't disposable nor do they break easily. You buy them if your industry expands or they depreciate due to high usage.
TSMC has already fabbed 5 nm chips for Chinese companies but not for Russia.
So where are the Russian high-end chips? They can't even design them, let alone build them. What you are claiming is simply difficult to answer because the scenario you implied isn't anywhere close to occurring.
Skywatcher
Captain
Honestly, I would have taken the article more seriously (whether or not it said the SSA800 passed the 02 acceptance trial) if it hadn't claimed that the SSA800 would be benchmarked against the NXT:2000i. I think that we can all agree that the SSA800's 7nm capability is in very early alpha build, and nobody benchmarks an in progress alpha against what's arguably the industry leader.
Well is a really good idea that they set the goal higher and benchmark against multiple ASML machines. If you design a CPU, you don't benchmark it against the worst ones but the best ones, that way the effort put into development is higher, even if was almost guaranteed that they will fail to reach that goal. So maybe is not as good as NXT:2000i but if the reached the last previous generation is a great achievement.
- Status