Chinese semiconductor industry

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xypher

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China already has as much wafer capacity as either the US or Japan. They have companies like YMTC and SMIC and they certainly have enough of a market to justify making their own CPUs and GPUs.

Huawei tried to scale up quickly so they didn't bother building their own fabrication facilities (because fabrication ain't where the profit is) and it cost them. Now a lot of Chinese companies are into chip design. They are taking advantage of the tax credit to make chip companies and software companies. I hope the government has better plans than just the tax credit. It isn't solving the main issue.
China has a larger capacity, actually. They are only behind Taiwan & South Korea.
 

xypher

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This is about the elbrus line from Russia. I believe they are on a 28 nm node.
They are made on TSMC fab. Russian fabs can only manufacture up to 65 nm and the 65 nm is not mass-produced.

P.S. It didn't take long for SleepyStudent to log in from his Annihilation98 twink account, did it? Lol. So obsessed, I wonder if he is on a paycheck.
 
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caudaceus

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The standard for self sufficiency from Russia = capable of doing it with foreign tools like how they imported Toshiba machine tools

The standard for self sufficiency from China = not even a single speck of paint can be from a foreign country otherwise it is the deepest dependence in the world.
That makes sense since Russia self sufficiency in this case is not for commercial mass products but for military which doesn't require that mass production along with lower expectation of international commerce.
 

Tyler

Captain
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@ericlfh bro aside from Nokia, I had been using Huawei phone all my life ;) , My traitorous son switch last year from Huawei to Apple and he gave me his P30 pro replacing my favorite Mate 20 pro and so far NO complained. I will wait when Hisilicon reintroduced its Kirin 980 7nm with 3D chiplet tech, that will take time maybe mid 2023 but at least the performance level will be less than a generation behind ( TSMC 3NM CHIP).

Regarding replacing ASML, bro it wouldn't happen with the massive investment being spend, it is foolish thing to do, it's a business venture need those ROI . What SMIC will do as @weig2000 had previously stated is the Dual approach strategy, BUT with future investment concentrated in procuring domestic equipment.
A nearly full replacement of ASML is needed, as all western technologies need to be replaced. The investment will be relatively small compared to what they have invested in the highspeed railway. As the local production capacity scales up, the exporting of Chinese semiconductor and related equipment will be very disruptive to the world. But this is what western countries had asked for.
 

Orthan

Senior Member
I'm pretty sure US has sanctions against Russia on lithography tools. It's part of Wassenaar Agreement. It's just that no one is talking about it since Russia is so far behind in IC.
Russia´s economy and semiconductor market are much smaller than china´s. Thats why russia really doesnt need a cutting-edge domestic semiconductor industry. Just for military needs and litlle else. And their best chips are made by TSMC.

build a space station, can't build this?
Yes. Its more difficult than a space station, in terms of high-quality materials, precision machinery, etc.

At one time Intel is the most advance semiconductor company but they slip up and fall behind the Asian giant like TSMC
Because TSMC also had acess to Intel suppilers, something that chinese foundries dont have.
 

FairAndUnbiased

Brigadier
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Yes. Its more difficult than a space station, in terms of high-quality materials, precision machinery, etc.

this is factually false, both in general ("more difficult" than a space station) and in your specific assertion of "high quality materials, precision machinery, etc."

Just because you think that anything done by China is easy and everything done by the west is hard doesn't make that misconception reality. It only shows that you are not a subject matter expert in either semiconductors OR aerospace engineering.

Difficulty can be approximated by money.
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of which
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Difficulty can also be approximated by lead time.
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. A
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.

In terms of materials, without disclosing any proprietary information, ASML requires all suppliers to submit to certain testing standards regarding chemical purity and gas/particle generation of materials.

All space agencies require the same tests but often under even more extreme conditions such as low temperature or EUV irradiation (since EUV is naturally produced by the sun).
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Being outgassing and particle generation free is quite difficult on Earth. It is 10000x more difficult in space due to the solar environment and space debris. EUV is not penetrating but is highly chemically active, resulting in materials degradation. In addition they require other tests such as vibration analysis, high velocity impact testing, radiation hardness, etc that are not relevant for EUV lithography.

So your main point has been refuted along with every single detail.
 
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FairAndUnbiased

Brigadier
Registered Member
A lot of countries have access to Intel supplier eg India, Japan but that does not make them TSMC because they just lack the technology of manufacturing, entrepreneur spirit, highly educated engineer, government support. China has all those ingredients
you can tell that he's not a subject matter expert in semiconductor trying to pose as one.

simple logic: if TSMC and Intel have the same suppliers and Intel started first with a supposedly insurmountable first mover advantage, how did TSMC surpass Intel? clearly the key difference isn't in access to suppliers then.
 

Hendrik_2000

Lieutenant General
Well good news seem like Huawei is optimistic and soon get back into the buz of smart phone Via Vincent. Seem like they were told by the FAB 28nm and 14 nm is possible within 2 years
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Yu Chengdong: Huawei mobile phones will "return the king" in 2023, and Mate50 will only have 4G version next year​

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Source: Aijiwei

1 day ago
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According to reports on the micronet, according to Tencent's "Deep Web" report, Yu Chengdong recently stated at an internal consumer business presentation that Huawei's mobile phones will continue to do so and that the king will return in 2023. Huawei insiders said that this presentation is a recruitment activity for the company, which means that the consumer business has stopped shrinking and turned to expansion.

In addition, Huawei will release the new Mate50 series of flagship phones early next year. Part of the Mate50 will use Kirin 990 chips, and some will use Qualcomm 898 chips, but only the 4G version.

Many people familiar with the matter said that Huawei has made substantial progress in the field of chip supply chain. An industry source close to telecom operators said that the current schedule given by Huawei sales staff to operators is, "28nm will be mass-produced next year, and mass production will be possible after 14nm." Huawei HiSilicon insiders said, "Now is the time to go. So, after these two or three years, mass production will be possible."


At last night's Huawei full-scene smart life new product launch conference, Huawei released the Mate X2 Collector's Edition and plain leather folding screen mobile phone, which increased the 8G memory to 12G, and added 512GB storage specifications. The Kirin 9000 chip on board is upgraded to support 5G. , The price is 18,999 yuan, and it will be sold out this morning. This may be Huawei's last batch of 5G mobile phones.

According to Bloomberg's previous report, people familiar with the matter said that Huawei is considering licensing its design to a department of the state-owned China Posts and Telecommunications Equipment Group Co., Ltd. (PTAC), which will then seek to purchase it that was blacklisted in the Trump era. It has already sold Huawei-branded Nova mobile phones on its website. According to the partnership, this department called Xnova will provide independent-brand mobile phones based on Huawei’s design. The report pointed out that this move may be the best opportunity for Huawei to save its smartphone business. (Proofreading|Stan)
 
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