This is a funny guy. I remember this guy writing an article stating that Huawei devices are not safe because it has more bugs than Boeing 737 Max. Considering that US managed to let Boeing get away with "self-certification" while scrutinizing every miniscule component of Huawei devices to no avail, I don't think his insights are as profound as he thinks they might be.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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All of the issues he claim is pretty common in tech companies especially in that era of time. He has a nice credential as a exec that he can make himself stand credible, but most execs are really not aware of all the issues and duct tape involve in many software projects.
The problems is that he shouldn't even be writing about semiconductors at all. Based on his logic, Pixel 6 released 2 weeks ago already have more bugs than Boeing 737 Max, thus Google is a failure as a company. Boeing 737 Max only have a single bug, which just so happens to cause it to plummet into the ground vertically, and thus the plane must be the symbol of engineering and technological excellence! Another American achievement!
Many people write for what sells these days and which is filled with bias. These old money news sites like wsj, forbes, bloomberg are mostly for old western rich conservative men so anti-china bias is for that demographic.The old tv shows where the newspaper editor cares about integrity (at least if you are from the us) has been lost or just propaganda lol
Intel already tried getting into the foundry business several years ago. It was a total flop. They exited the market in 2018. They are just getting back into it to get that sweet, sweet government dough to increase foundry capacities worldwide.
IIRC they had two problems. One was that their transistors were optimized for high clockspeed instead of lower power, which made them useless for smartphone chips, the other was that they had terrible customer support and really long lead times. To the point everyone who tried their service left. Since Intel had a bunch of unused fabs, they ended up acquiring FPGA company Altera so they could increase their fab utilization.
Intel is also behind TSMC and Samsung in terms of process. They have something equivalent to TSMC 10nm/7nm but no 5nm.
Hendrik_2000
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4372
Source: Aijiwei
#乾晶 Semiconductor#
#Silicon carbide substrate#
#Process Validation#
3 days ago
According to the micronet news, a few days ago, the silicon carbide substrate wafers developed by Hangzhou Qianjing Semiconductor Co., Ltd. (hereinafter referred to as: Qianjing Semiconductor) passed the company's internal quality inspection and reached the product quality standards of the same industry.
Image source: dry crystal semiconductor
According to dry chip semiconductor news, on November 3, the first batch of samples has been officially provided to the client for process verification. At present, it has reached strategic cooperation intentions with Chinese and Japanese companies, and can provide 4, 6-inch silicon carbide ingots and wafers for domestic and foreign customers.
It is reported that in July 2020, Hangzhou Qianjing Semiconductor was established in Hangzhou International Science and Technology Innovation Center of Zhejiang University, focusing on the field of third-generation semiconductor materials. It is a company integrating semiconductor silicon carbide (SiC) single crystal growth, wafer processing and equipment development. High-tech enterprises. Its core team comes from the State Key Laboratory of Silicon Materials of Zhejiang University. It has established a joint laboratory with the Advanced Semiconductor Research Institute of Zhejiang University Science and Technology Innovation Center to jointly undertake the industrialization of SiC materials, and strive to become an internationally renowned third-generation semiconductor material in three to five years. Brands and benchmarking companies. (Proofreading/Small as)
Dry Crystal Semiconductor's first batch of silicon carbide substrates officially undergoes process verification
4372
Source: Aijiwei
#乾晶 Semiconductor#
#Silicon carbide substrate#
#Process Validation#
3 days ago
According to the micronet news, a few days ago, the silicon carbide substrate wafers developed by Hangzhou Qianjing Semiconductor Co., Ltd. (hereinafter referred to as: Qianjing Semiconductor) passed the company's internal quality inspection and reached the product quality standards of the same industry.
Image source: dry crystal semiconductor
According to dry chip semiconductor news, on November 3, the first batch of samples has been officially provided to the client for process verification. At present, it has reached strategic cooperation intentions with Chinese and Japanese companies, and can provide 4, 6-inch silicon carbide ingots and wafers for domestic and foreign customers.
It is reported that in July 2020, Hangzhou Qianjing Semiconductor was established in Hangzhou International Science and Technology Innovation Center of Zhejiang University, focusing on the field of third-generation semiconductor materials. It is a company integrating semiconductor silicon carbide (SiC) single crystal growth, wafer processing and equipment development. High-tech enterprises. Its core team comes from the State Key Laboratory of Silicon Materials of Zhejiang University. It has established a joint laboratory with the Advanced Semiconductor Research Institute of Zhejiang University Science and Technology Innovation Center to jointly undertake the industrialization of SiC materials, and strive to become an internationally renowned third-generation semiconductor material in three to five years. Brands and benchmarking companies. (Proofreading/Small as)
Shanghai Microelectronics New Lithography Machine Patent Could Improve Resolution of Exposure Lithography Machine
Figure 1 Schematic Diagram of the Lithographic Projection Objective Lens Structure
in a nutshell, Shanghai Microelectronics’ lithography projection objective lens patent, through the use of a spherical lens design, reduces processing and manufacturing costs, increases the numerical aperture, and is suitable for the Ge three-line band. The applicable view of the projection objective has been expanded, and the resolution of the lithography machine has been improved.
Hikvision: Hikvision Micro-Photography has built an 8-inch MEMS production line and packaging line
Haikang Micro-Photography also has a total of 20 complete machine production lines covering an area of 10,000 square meters, with a maximum annual output of 1.5 million units. The manufacturing and testing are strictly in accordance with high-quality production requirements. The materials are tested by multiple standards and carefully selected; production The process is strictly controlled, the core components are fully automated, and the dust-free clean room is packaged; the products have undergone multiple strict tests such as aging and air tightness before leaving the factory to ensure that the products are stable and reliable.
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