Yeah brother, new materials are the key for the future of the Chinese IC.
The engineering for the current 5nm then 3nm, is massive.
Too massive. That can only be done with over-engineering the current methods.
I'm not an engineer, but over-engineering is no different than anything else in life.
When we get to that point, we all know, that situation has reached its limits, and time for something new.
TSMC can put all its efforts to over-engineering the 7nm to 5nm then 3nm.
China should put all its efforts to figure out a new way of doing it.
Then SMIC talks to TSMC saying they will not wipe them out if they develop new materials and if they continue selling their stuff, out in the open for through the Ho Chi Min Trail.